JP2009054801A - Heat radiation member, and light emitting module equipped with the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a heat radiation member capable of efficiently radiating heat from a surface mounted component without changing design of a structure of the surface mounted component to be mounted. <P>SOLUTION: This metal base substrate (heat radiation member) 120 is provided with: a plate-like base material part 121 formed of aluminum; a conductor layer 126 formed on the upper surface of the base material part 121 through an insulation layer 125; elongated groove parts 127 having opening ends on the upper surface side of the conductor layer 126, and having bottom surfaces formed on the base material part 121 by penetrating the conductor layer 126 and the insulation layer 125; and a copper-plated layer 128 made to overlie to cover the bottom surfaces of the groove parts 127 and the inside surfaces of the groove parts 127. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a heat dissipation member and a light emitting module including the heat dissipation member.

  A large amount of heat is generated by driving in surface mount components such as an electronic component including a power semiconductor element and a light emitting device on which an LED (Light Emitting Diode) element is mounted. For this reason, when these surface mount components are modularized, some kind of heat radiating member is usually used.

  As an example of the heat radiating member, a mounting substrate (metal base substrate) in which a wiring layer is formed on an upper surface of a metal plate via an insulating layer is conventionally known. Since such a mounting substrate (metal base substrate) includes a metal plate having excellent heat conduction, it has higher heat dissipation characteristics than a glass epoxy substrate that does not include a metal plate.

  However, in the conventional mounting substrate (metal base substrate) described above, an insulating layer having a low thermal conductivity is interposed between the metal plate and the surface mount component. Therefore, heat conduction to the metal plate is caused by the thermal resistance of the insulating layer. Has the disadvantage of being hindered. For this reason, there is an inconvenience that it is difficult to sufficiently dissipate heat from the surface mount component from the metal plate.

  In recent years, the trend toward higher output in surface mount components such as electronic components and light emitting devices has been increasing, and accordingly, the amount of heat generated by driving the surface mount components has increased. For example, a light emitting device equipped with an LED element has come to be used for general illumination, a backlight for a large screen liquid crystal, an automobile lamp, and the like. When using a light emitting device for such an application, it is necessary to pass a large current through the LED element because high light output is required. For this reason, the calorific value from a light-emitting device also becomes large compared with the past. However, the conventional mounting substrate (metal base substrate) has the disadvantages described above, and it has been difficult to cope with the high output of surface mounting components.

  Here, as a method for improving the disadvantages in the conventional mounting substrate (metal base substrate), a part of the metal plate is exposed by removing a part of the insulating layer of the metal base substrate (mounting substrate), and the surface to be mounted A method is conceivable in which a part of a mounted component (electronic component, light emitting device, etc.) is brought into direct contact with an exposed region of a metal plate. An LED package (light emitting device) applicable to such a configuration is described in Patent Document 1, for example.

  FIG. 25 is a cross-sectional view showing a state in which the conventional LED package described in Patent Document 1 is mounted on a metal base substrate. Referring to FIG. 25, a conventional LED package 801 includes a heat sink 802 made of a metal material, an LED element 804 mounted on the upper surface of the heat sink 802 via a submount 803, and a predetermined heat sink 802. An insulator 805 attached to the position, a plurality of lead wires 806 extending laterally from the insulator 805, and a lens member 807 attached to the upper portion of the insulator 805 so as to cover the LED element 804 are provided. In addition, the terminal portion (not shown) of the LED element 804 and the plurality of lead wires 806 are electrically connected to each other via bonding wires 808. The heat sink 802 is configured such that the lower side is a flat contact surface. On the other hand, the metal base substrate (mounting substrate) 810 has a configuration in which a wiring layer 813 is formed on an upper surface of a metal plate 811 via an insulating layer 812. The metal base substrate 810 is in a state where a part of the metal plate 811 is exposed by removing a part of the insulating layer 812. The LED package 801 described above is surface-mounted on the upper surface of the metal base substrate 810 so that the contact surface of the heat sink 802 and the exposed region of the metal plate 811 are in direct contact. Note that the lead wire 806 of the LED package 801 is bent at a predetermined angle and is electrically connected to the wiring layer 813 of the metal base substrate 810.

  In the above configuration, heat generated by driving (light emission) of the LED element 804 is directly transmitted to the metal plate 811 of the metal base substrate 810 via the heat sink 802, so that the heat generation amount of the LED package 801 (LED element 804). Even when the current is large, the heat from the LED package 801 (LED element 804) can be effectively dissipated from the metal plate 811 of the metal base substrate 810.

JP 2005-183993 A

  However, in the conventional configuration shown in FIG. 25, a step is formed on the mounting surface (surface on which the wiring layer 813 is formed) of the metal base substrate 810 by removing a part of the insulating layer 812. There is an inconvenience. For this reason, when a general surface mount component having a flat joint surface is mounted, it is difficult to directly contact a part of the surface mount component with the exposed region of the metal plate 811. That is, it is difficult to thermally connect the surface mount component and the metal plate 811. In this case, it is difficult to efficiently dissipate heat from the surface-mounted component. Therefore, in order to obtain the effect of improving the heat dissipation in the metal base substrate 810 shown in FIG. 25, the structure of the surface mount component is set to the above-mentioned patent document so that a part of the surface mount component and the metal plate 811 are in direct contact with each other. There is a problem that it is necessary to change the design to a structure like the LED package 801 described in No. 1.

  The present invention has been made to solve the above-described problems, and an object of the present invention is to efficiently generate heat from the surface mount component without changing the design of the structure of the surface mount component to be mounted. It is providing the heat radiating member which can radiate heat.

  Another object of the present invention is to provide a light emitting module having good heat dissipation characteristics.

  In order to achieve the above object, a heat dissipation member according to a first aspect of the present invention includes a metal member, a conductor layer formed on the upper surface of the metal member via an insulating layer, and an open end on the upper surface side of the conductor layer. And having a bottom surface formed on the metal member by penetrating the conductor layer and the insulating layer, and a heat conduction member formed on at least a part of the inner surface of the groove portion.

  In the heat dissipation member according to the first aspect, as described above, the groove portion having the opening end on the upper surface side of the conductor layer and having the bottom surface formed in the metal member by penetrating the conductor layer and the insulating layer, A heat conducting member formed on at least a part of the inner surface, thereby allowing heat from a surface-mounted component surface-mounted on the conductor layer to pass through the heat conducting member formed on the inner surface of the groove. It can be efficiently transmitted to the member. For this reason, the heat from the surface mount component can be efficiently radiated from the metal member having a heat radiating function. In addition, by configuring the heat dissipating member as described above, even when the heat generation amount of the mounted surface mount component is large, the heat from the surface mount component can be efficiently dissipated from the metal member. It is possible to cope with higher output.

  Further, in the above configuration, the conductor layer and the metal member are thermally connected via the heat conducting member. Therefore, by mounting the surface mount component on the conductor layer, the surface mount component can be connected via the conductor layer. Indirect thermal contact (thermal connection) with the metal member. For this reason, the surface of the metal member is exposed by removing the insulating layer, and a general surface with a flat joint surface is different from the configuration in which a part of the surface mount component is in direct contact with the exposed region of the metal member. Even when a mounting component is mounted, the surface mounting component can be thermally connected to the metal member. Thereby, the heat from the surface mount component can be efficiently radiated from the metal member without changing the design of the structure of the surface mount component to be mounted.

  In the heat dissipation member according to the first aspect, preferably, a plurality of groove portions are formed at a predetermined interval from each other, and the plurality of groove portions are elongated so as to extend in a predetermined direction parallel to the upper surface of the metal member. Is formed. If comprised in this way, since the heat | fever from a surface mounting component can be easily transmitted to a metal member via a heat conductive member, a thermal radiation characteristic can be improved easily.

  In the heat dissipating member according to the first aspect, preferably, the heat conducting member is composed of a metal plating layer. With this configuration, the metal plating layer has a higher thermal conductivity than that of a heat conductive member made of solder, conductive paste, or the like. It can be transmitted to the member.

  In this case, the metal plating layer may be formed so as to cover the bottom surface of the groove and the inner side surface of the groove.

  In the configuration in which the metal plating layer is formed so as to cover the bottom surface of the groove and the inner side surface of the groove, preferably, solder or conductive paste is interposed on the inner surface of the groove via the metal plating layer. Embedded. If comprised in this way, in addition to the metal plating layer coat | covered on the bottom face of the groove part and the inner surface of the groove part, the heat | fever from a surface mounting component is also made to a metal plate by the solder or conductive paste embedded in the groove part. Since heat can be transmitted, heat from the surface-mounted component can be easily transmitted to the metal member as compared with a configuration in which the metal plating layer is only coated on the bottom surface of the groove and the inner surface of the groove. . Note that the solder or conductive paste embedded in the groove may be a solder or conductive paste used as an adhesive when mounting a surface-mounted component. At this time, the solder or conductive paste used as an adhesive flows into the groove to embed the inside of the groove, and the solder or conductive paste that has flowed into the groove downwards with respect to the surface mount component due to the surface tension. This produces a strong tensile force. Because of the strong downward force on the surface mount component, the thickness of the solder or conductive paste interposed between the conductor layer and the surface mount component can be reduced. Even when solder or conductive paste is interposed therebetween, the thermal resistance of the interposed solder or conductive paste can be reduced. For this reason, heat from the surface mount component can be efficiently transferred to the conductor layer, so that heat from the surface mount component can be easily transferred to the metal member via the heat conducting member provided in the groove. Can do. Therefore, the heat dissipation characteristics can be improved also by this.

  In the configuration in which the solder or the conductive paste is embedded on the inner surface of the groove portion, a dam member for blocking the flow of the solder or the conductive paste is preferably provided in a predetermined region of the conductor layer. If comprised in this way, a conductor layer can be divided into the area | region where the solder or the conductive paste was embedded in the groove part, and the area | region where the solder or the conductive paste was not embedded in the groove part. For this reason, the area where the solder or conductive paste is embedded in the groove can be used as a mounting area for the surface mount component, and the area where the solder or conductive paste is not embedded in the groove is used as a heat dissipation area. Can function. This makes it possible to dissipate heat from surface-mounted components not only from metal members but also from areas where solder or conductive paste is not embedded in the groove, thereby improving heat dissipation characteristics more easily. Can do.

  In the configuration in which the metal plating layer as the heat conducting member is formed on the inner surface of the groove portion, the metal plating layer is preferably formed so as to embed the groove portion. If comprised in this way, since the heat from a surface mount component can be more efficiently transmitted to a metal member, the heat from a surface mount component can be thermally radiated from a metal member more efficiently.

  In the structure in which the metal plating layer as the heat conducting member is formed on the inner surface of the groove part, the metal member is preferably made of aluminum, and the metal plating layer is made of copper. If comprised in this way, while aiming at the weight reduction of a heat radiating member and improvement in corrosion resistance, the heat from a surface mount component can be more efficiently transmitted to a metal member, and the surface which was transmitted more efficiently. Heat from the mounted component can be dissipated from the metal member.

  In this case, the metal member made of aluminum may include a metal layer made of a metal material different from aluminum formed on the surface thereof.

  In the configuration including the metal member composed of aluminum, preferably, the metal member composed of aluminum is formed on the zincate treatment layer formed on the surface by the zincate treatment and on the zincate treatment layer by the plating treatment. Contains a nickel layer. If comprised in this way, even if a metal member is comprised from aluminum, when forming the metal plating layer which consists of copper on the inner surface of a groove part, it is easily suppressed that the adhesiveness of a metal plating layer falls. can do.

  In this case, preferably, the metal member made of aluminum further includes a copper layer formed on the nickel layer. If comprised in this way, the metal plating layer comprised from copper can be more easily formed on the inner surface of a groove part.

  In the heat dissipation member according to the first aspect, preferably, the conductor layer includes a first conductor layer for heat dissipation, and a second conductor layer for wiring that is electrically insulated and separated from the first conductor layer. Is formed in the formation region of the first conductor layer for heat dissipation. If comprised in this way, even if a conductor layer and a metal member are electrically connected via a heat conductive member by forming a heat conductive member on the inner surface of a groove part, an electrical short circuit of a conductor layer Can be suppressed. Thereby, the surface mounting member can be surface mounted without considering an electrical short circuit.

  A light emitting module according to a second aspect of the present invention is a light emitting module including a light emitting device including a light emitting element and the heat dissipating member according to the first aspect. If comprised in this way, the light emitting module which has a favorable heat dissipation characteristic can be obtained easily. Note that by improving heat dissipation characteristics, it is possible to suppress a decrease in light emission lifetime, a decrease in luminance, and the like, so that a light emitting module having good light emission characteristics can be easily obtained.

  In the light emitting module according to the second aspect, preferably, the light emitting device includes a reflective frame body whose inner peripheral surface is a reflective surface that reflects light from the light emitting element, and the reflective frame body is made of a heat dissipation material. It is configured. If comprised in this way, since the heat | fever produced by light emission of the light emitting element can be efficiently radiated also from a reflective frame body, a thermal radiation characteristic can be improved easily. Thereby, the light emitting module which has a favorable heat dissipation characteristic can be obtained more easily.

  In the light emitting module according to the second aspect, preferably, the light emitting device includes a first electrode layer on the upper surface side and a second electrode layer on the lower surface side, and the first electrode layer via a through hole formed in a predetermined region. The light emitting device is further mounted on the first electrode layer on the upper surface side and thermally connected to the first electrode layer on the upper surface side. The second electrode layer on the lower surface side is thermally connected to the metal member of the heat radiating member via a heat conducting member provided on the heat radiating member. If comprised in this way, while being able to transmit the heat | fever from a light emitting element to the metal member of a heat radiating member more easily and to be radiated from the metal member of a heat radiating member, it is easier to radiate heat. Can be improved. Thereby, the light emitting module which has the favorable heat dissipation characteristic can be obtained still more easily.

  In this case, preferably, the reflective frame is fixed on the upper surface of the insulating substrate so as to be in direct contact with the first electrode layer on the upper surface side or indirectly through the conductive member. If comprised in this way, the heat from a light emitting element can be more efficiently transmitted to a reflective frame, Therefore The heat from a light emitting element can be radiated from a reflective frame more efficiently.

  In the configuration in which the light-emitting device includes the reflective frame, preferably, the reflective frame is made of a metal material containing aluminum as a main component. If comprised in this way, the thermal radiation efficiency of a reflective frame body can be improved more easily.

  In the configuration in which the light emitting device includes the insulating substrate, the insulating substrate further includes a third electrode layer for wiring for supplying power to the light emitting element, and the first electrode layer on the upper surface side and the second electrode on the lower surface side. Each of the layers may be electrically insulated and separated from the third electrode layer for wiring.

  In the light emitting module according to the second aspect, the light emitting element may be composed of a light emitting diode element.

  As described above, according to the present invention, it is possible to easily obtain a heat dissipating member capable of efficiently dissipating heat from a surface mount component without changing the design of the structure of the surface mount component to be mounted. .

  Moreover, according to the present invention, a light emitting module having good heat dissipation characteristics can be easily obtained.

  DESCRIPTION OF EMBODIMENTS Hereinafter, embodiments embodying the present invention will be described in detail with reference to the drawings.

(First embodiment)
FIG. 1 is an overall perspective view of the light emitting module according to the first embodiment of the present invention, and FIG. 2 is an exploded perspective view of the light emitting module according to the first embodiment of the present invention shown in FIG. FIG. 3 is a cross-sectional view of the light emitting module according to the first embodiment of the present invention shown in FIG. 4 to 10 are views for explaining the structure of the light emitting module according to the first embodiment of the present invention shown in FIG. First, the structure of the light emitting module according to the first embodiment of the present invention will be described with reference to FIGS.

  As shown in FIG. 1, the light emitting module 110 according to the first embodiment has a structure in which a plurality of surface-mounted LEDs 130 are surface-mounted on a top surface of a metal base substrate 120 at a predetermined interval. The metal base substrate 120 is an example of the “heat dissipating member” of the present invention, and the surface mount type LED 130 is an example of the “light emitting device” of the present invention.

  Moreover, the metal base board | substrate 120 which comprises the light emitting module 110 is provided with the plate-shaped base material part 121 comprised from aluminum, as shown in FIG.2 and FIG.3. The base member 121 has a function of radiating heat from the surface-mounted LED 130 to be surface-mounted to the outside. The base member 121 is an example of the “metal member” in the present invention. Moreover, the base material part 121 contains the zincate process layer 122, the nickel layer 123, and the copper layer 124 which were laminated | stacked sequentially from the surface side, as shown in FIG. Specifically, a zincate treatment layer 122 having a thickness of about 0.05 μm to 0.2 μm is formed on the surface portion of the base material portion 121 by a zincate treatment. A nickel layer 123 having a thickness of about 2 μm is formed on the upper surface of the zincate treatment layer 122 by electroless plating. Furthermore, a copper layer 124 having a thickness of 5 μm or more is formed on the upper surface of the nickel layer 123 by plating. The zincate treatment layer 122, the nickel layer 123, and the copper layer 124 are examples of the “metal layer” in the present invention.

  As shown in FIGS. 3 and 5, an insulating layer 125 having a thickness of about 25 μm to about 80 μm is formed on almost the entire surface on one main surface (upper surface) of the base member 121. A conductor layer 126 having a predetermined pattern shape is formed on a predetermined region of the insulating layer 125. That is, in the metal base substrate 120 according to the first embodiment, the conductor layer 126 is formed on one main surface (upper surface) of the base member 121 via the insulating layer 125. The conductor layer 126 is made of a metal material such as copper having excellent electrical conductivity and thermal conductivity, and a plurality of conductor layers 126 are formed on the upper surface of the insulating layer 125. The plurality of conductor layers 126 are divided into a conductor layer 126a for wiring and a conductor layer 126b for heat dissipation. The conductor layers 126 are electrically isolated from each other by being formed at a predetermined interval from each other.

  Further, as shown in FIG. 4, the heat-dissipating conductor layer 126b is formed in a shape corresponding to a heat-dissipating electrode layer 156 (see FIG. 7 and FIG. 8) to be described later in the surface-mounted LED 130 in plan view. Has been. The plurality of wiring conductor layers 126a can be electrically connected to corresponding electrode terminals 157a and 158a (see FIGS. 7 and 8) of the surface-mounted LED 130 when the surface-mounted LED 130 is surface-mounted. Is arranged. Specifically, the heat-dissipating conductor layer 126b is formed so that the length in the Y direction is longer than the length in the X direction. That is, the heat radiation conductor layer 126b is formed to extend in the Y direction. The heat radiation conductor layer 126b is formed so as to be symmetric with respect to the center in the X direction. On the other hand, three wiring conductor layers 126a are respectively formed on one end side (X1 direction side) of the heat dissipation conductor layer 126b and on the other end side (X2 direction side) of the heat dissipation conductor layer 126b. ing. The wiring conductor layer 126a formed on the X1 direction side and the wiring conductor layer 126a formed on the X2 direction side are respectively arranged at a predetermined interval in the Y direction.

  Here, in the first embodiment, as shown in FIGS. 2 to 4, the metal base substrate 120 is formed from the upper surface side of the conductor layer 126 (126 b) in the formation region of the heat dissipation conductor layer 126 b. Have a plurality of grooves 127 dug by laser processing. As shown in FIG. 5, the plurality of grooves 127 are formed to a depth that penetrates the conductor layer 126 (126 b) and the insulating layer 125 but does not penetrate the zincate treatment layer 122 of the base portion 121. That is, the open ends of the plurality of grooves 127 are located on the upper surface side of the conductor layer 126, and the bottom surfaces of the plurality of grooves 127 are formed on the copper layer 124 of the base member 121.

  In the first embodiment, as shown in FIG. 4, the plurality of grooves 127 are formed in an elongated shape so that each of the grooves 127 extends along a predetermined direction parallel to the upper surface of the base member 121. . Specifically, some of the plurality of groove portions 127a have a central portion (substantially the center of the heat dissipation conductor layer 126b) as viewed in a plan view in the region of the center portion of the heat dissipation conductor layer 126b. Are radially arranged so as to spread outward. On the other hand, each of the remaining groove portions 127b among the plurality of groove portions 127 is formed to extend in the Y direction in other regions of the heat-dissipating conductor layer 126b, and the extending direction of the groove portions 127 (Y direction) ) At a predetermined interval in a direction orthogonal to (X direction). Each of the plurality of groove portions 127 is formed to have a width of about 0.1 mm (a width in a direction orthogonal to the extending direction of the groove portion 127).

  Furthermore, in the first embodiment, as shown in FIGS. 3 and 5, a copper plating layer 128 having a thickness of about 25 μm is formed on the upper surface of the base member 121. The copper plating layer 128 is formed so as to cover the inner surface of the groove 127. Specifically, the copper plating layer 128 is formed so as to cover the bottom surface of the groove 127 and the inner surface of the groove 127. As a result, in the metal base substrate 120 according to the first embodiment, the heat-dissipating conductor layer 126b and the base member 121 are thermally connected via the copper plating layer 128 formed on the inner surface of the groove 127. It is in a state. The copper plating layer 128 is formed not only on the inner surface of the groove 127 but also on the upper surfaces of the wiring conductor layer 126a and the heat dissipation conductor layer 126b. The copper plating layer 128 is an example of the “heat conducting member” and “metal plating layer” in the present invention.

  Further, since the bottom surface of the groove portion 127 is formed on the copper layer 124 of the base portion 121 as described above, even if the copper plating layer 128 is formed on the inner surface of the groove portion 127, the adhesion of the copper plating layer 128 is improved. A decrease in strength is suppressed. That is, unlike the above-described configuration, when the zincate treatment layer 122, the nickel layer 123, and the copper layer 124 are not formed on the surface portion of the base material portion 121, the aluminum member is exposed on the bottom surface of the groove portion 127. Become. The aluminum member has an inconvenience that it is difficult to obtain an active surface because an oxide film is easily formed on the surface of the aluminum member. For this reason, it becomes very difficult to form the copper plating layer 128 directly on the surface of the aluminum member. Therefore, when the copper plating layer 128 is formed on the inner surface of the groove 127, there arises a disadvantage that the adhesion strength of the copper plating layer 128 is lowered. On the other hand, in the configuration of the first embodiment in which the nickel layer 123 and the copper layer 124 are formed on the surface of the base portion 121 via the zincate treatment layer 122, the bottom surface of the groove portion 127 is formed in the copper layer 124. Therefore, when the copper plating layer 128 is formed on the inner surface of the groove 127, it is possible to suppress a decrease in the adhesion strength of the copper plating layer 128.

  In the metal base substrate 120 configured as described above, the heat-dissipating conductor layer 126b and the base member 121 are electrically connected via the copper plating layer 128, but the wiring conductor layer 126a. Is formed on the upper surface of the base member 121 with the insulating layer 125 interposed therebetween, so that the wiring conductor layer 126a and the base member 121 are electrically insulated and separated. For this reason, in the metal base substrate 120 according to the first embodiment, the plurality of conductor layers 126 are not electrically short-circuited with each other via the base material portion 121 made of a metal material.

  Further, as shown in FIG. 2, the surface-mounted LED 130 that is surface-mounted on the metal base substrate 120 includes a substrate 131, a light-emitting diode element (LED element) 132 mounted on the substrate 131, and a substrate 131. A reflective frame 133 fixed (adhered) so as to surround the LED element 132 and a translucent member 134 filled inside the reflective frame 133 are provided. The LED element 132 is an example of the “light emitting element” in the present invention.

  In addition, as shown in FIG. 3, the substrate 131 has a plurality of electrode layers formed on the upper surface and the lower surface of an insulating base material 142 made of glass epoxy or liquid crystal polymer (LCP). It is comprised from the double-sided board made. As shown in FIGS. 7 and 8, the substrate 131 has a length of about 3.5 mm in the X direction when viewed in a plan view, and about 3. mm in the Y direction perpendicular to the X direction. It is formed in a square shape having a length of 5 mm. The substrate 131 has a thickness of about 0.2 mm.

  Further, the plurality of electrode layers formed on the upper surface of the insulating base material 142 include a plurality of (three) polar electrode layers 147 having a positive polarity and a negative polarity, as shown in FIGS. A plurality of (three) polar electrode layers 148 having polarity, and nonpolarity (neutral) having no electrical polarity that is electrically insulated and separated through the polar electrode layers 147 and 148 and the insulating groove 149 And divided into an electrode layer 146. Further, as shown in FIG. 6, the polar electrode layers 147 and 148 are respectively formed on the upper surface of the insulating base material 142 and in regions located inside the opening 133 a of the reflection frame 133. The nonpolar electrode layer 146 is formed on the upper surface of the insulating base material 142 and in a region other than the region where the polar electrode layers 147 and 148 are formed. Specifically, as illustrated in FIG. 9, the nonpolar electrode layer 146 includes the polar electrode layers 147 and 148, the insulating grooves 149 around the polar electrode layers 147 and 148, and the outer peripheral portion of the upper surface of the substrate 131. It is formed in a region other than this region. The polar electrode layers 147 and 148 are examples of the “third electrode layer for wiring” of the present invention, and the nonpolar electrode layer 146 is an example of the “first electrode layer on the upper surface side” of the present invention. is there.

  In addition, as shown in FIGS. 7 and 8, the electrode layer formed on the lower surface of the insulating base 142 is mainly used for wiring and is used mainly for heat radiation and has a large area. The electrode layer 156 is formed. In addition, a plurality of electrode layers 157 and 158 used for wiring are formed so as to correspond to the plurality of polar electrode layers 147 and 148, respectively, and as shown in FIG. The polar electrode layers 147 and 148 are electrically connected through the holes 142a. As shown in FIGS. 7 and 8, the electrode layers 157 and 158 used for wiring are formed on one end side (X1 direction side) and the other end side (X2 direction side) of the insulating base material 142, respectively. The electrode terminals 157a and 158a are integrally connected. The electrode layers 157 and 158 mainly used for wiring are examples of the “third electrode layer for wiring” of the present invention, and the electrode layer 156 mainly used for heat radiation is the “lower surface side of the present invention”. It is an example of a “second electrode layer”.

  Further, as shown in FIG. 3, the electrode layer 156 used for heat dissipation is in direct contact with the nonpolar electrode layer 146 through the plurality of through holes 142 b of the insulating base material 142. That is, the electrode layer 156 used for heat dissipation is thermally connected to the nonpolar electrode layer 146 through the plurality of through holes 142b of the insulating base material 142. The polar electrode layers 147 and 148, the nonpolar electrode layer 146, the electrode layers 157 and 158, and the electrode terminals 157a and 158a are made of a conductive material having excellent thermal conductivity such as copper.

  Further, as shown in FIG. 8, a resist layer 159 is formed in a predetermined region on the lower surface side of the insulating base material 142 so as to cover the electrode layers 157 and 158 used for wiring. The resist layer 159 has a disadvantage that the electrode layer 156 and the electrode layer 157 (158) are electrically short-circuited due to the spread of the solder 160 when the surface-mounted LED 130 is surface-mounted by the solder 160. It has a function to suppress the occurrence. Further, as shown in FIG. 3, plated layers 166 and 167 are formed on the electrode layer 156 and the electrode terminals 157a and 158a used for heat dissipation, respectively. Thus, the surface-mounted LED 130 is configured such that the lower surface side of the substrate 131 is a flat surface.

  As shown in FIGS. 2 and 6, the three LED elements 132 are provided on the upper surface of the nonpolar electrode layer 146 and on the region located inside the opening 133 a of the reflective frame 133. And fixed by an adhesive 172 (see FIG. 3). The LED elements 132 are arranged between the positive polar electrode layer 147 and the negative polar electrode layer 148 at a predetermined interval. The three LED elements 132 each have a function of emitting red, green, and blue light.

  Further, as shown in FIGS. 2 and 3, the upper surface of the positive polar electrode layer 147 and the electrode portion of the LED element 132 are electrically connected via bonding wires 137, respectively, and negative. The upper surface of the polar electrode layer 148 and the electrode portion of the LED element 132 are electrically connected via bonding wires 138, respectively. Thus, by applying a voltage between the electrode terminal 157a of the electrode layer 157 and the electrode terminal 158a of the electrode layer 158, a current flows to the LED element 132 through the bonding wires 137 and 138, and each LED element 132 is Emits light at a specific wavelength. When these LED elements 132 emit light simultaneously, the colors are mixed and emitted. In this case, only the LED element 132 that emits blue light is mounted, and the phosphor is dispersed in the translucent member 134 so that the light emitted from the surface-mounted LED 130 becomes white light. It may be configured. Note that the bonding wires 137 and 138 are made of fine metal wires such as Au and Al.

  In addition, the reflection frame 133 is made of a metal material mainly composed of aluminum having excellent heat dissipation characteristics, and is formed in a planar shape having almost the same size as the substrate 131 as shown in FIG. . Specifically, the reflection frame 133 is formed in a square shape having a length of about 3.5 mm in the X direction and also having a length of about 3.5 mm in the Y direction when seen in a plan view. Has been. Moreover, the reflective frame 133 has a thickness of about 0.6 mm.

  Further, as shown in FIGS. 2 and 3, an opening 133 a penetrating from the upper surface to the lower surface is formed in the central portion of the reflection frame 133. The opening 133 a is configured such that the inner side surface 133 b functions as a reflection surface that reflects the light emitted from the LED element 132. Further, the surface of the inner side surface 133b of the opening 133a is subjected to a silver plating process or an alumite process in order to increase the reflectance. Further, as shown in FIG. 6, the opening 133 a is formed in a circular shape when the inner side surface 133 b is seen in plan view in order to uniformly collect the light emitted from the LED element 132. Furthermore, as shown in FIGS. 2 and 3, the opening 133a is formed so as to expand in a tapered shape toward the upper side of the opening 133a. As described above, the inner side surface 133b of the opening 133a is configured to efficiently reflect the light emitted from the LED element 132 upward.

  Further, as shown in FIG. 10, the reflection frame 133 is bonded (fixed) on the substrate 131 by a resin adhesive 140 made of epoxy resin, acrylic resin, or the like. Specifically, the reflecting frame 133 is formed such that at least a part of the bottom surface 133c is a nonpolar electrode by the resin adhesive 140 applied on the outer peripheral region where the nonpolar electrode layer 146 is not formed on the substrate 131. It is adhered on the substrate 131 so as to be in direct contact with the upper surface of the layer 146. That is, the reflective frame 133 is bonded (fixed) on the substrate 131 so as to be in thermal contact with the nonpolar electrode layer 146. 9 and 10, a resist layer 143 is formed in a predetermined region on the substrate 131, and the resin adhesive 140 is formed on the substrate 131 through the resist layer 143.

  Further, as shown in FIG. 2, a corner portion constituted by a bottom surface 133 c (see FIG. 10) of the reflection frame 133 and one end surface (side surface on the X1 direction side) of the reflection frame 133, and the reflection frame 133 A notch 139 having an arcuate cross section is formed at each corner formed by the bottom surface 133c (see FIG. 10) and the other end surface (side surface on the X2 direction side) of the reflecting frame 133. The notch 139 is covered with an insulating member 150.

  The translucent member 134 is made of a resin material such as epoxy resin or silicon resin. As shown in FIGS. 2 and 3, the LED element 132 and the bonding member are formed in the opening 133 a of the reflection frame 133. Wires 137 and 138 are provided to seal. The translucent member 134 has a function of suppressing the LED element 132 and the bonding wires 137 and 138 from coming into contact with air or moisture by sealing the LED element 132 and the bonding wires 137 and 138. Yes.

  The surface-mounted LED 130 configured as described above is surface-mounted by the solder 160 on the upper surface of the metal base substrate 120 described above, and thereby the light emitting module according to the first embodiment is configured. At this time, in the surface-mounted LED 130, as shown in FIG. 3, the lower electrode layer 156 and the heat-dissipating conductor layer 126b of the metal base substrate 120 are thermally connected by the solder 160. At the same time, the electrode terminals 157 a and 158 a on the lower surface side and the wiring conductor layer 126 a of the metal base substrate 120 are electrically connected by the solder 160.

  For this reason, the heat generated by the light emission of the LED element 132 of the surface mount LED 130 is transferred to the heat radiating conductor layer 126b of the metal base substrate 120 through the nonpolar electrode layer 146 and the heat radiating electrode layer 156. In addition, the heat from the surface-mounted LED 130 that has been transferred to the heat-dissipating conductor layer 126b is transferred to the base portion 121 of the metal base substrate 120 through the copper plating layer 128, and is transmitted from the base portion 121. Heat is dissipated to the outside. The heat generated by the light emission of the LED element 132 is also radiated by the nonpolar electrode layer 146 formed on the upper surface of the insulating base material 142, and the nonpolar electrode layer is passed through the through hole 142 b of the insulating base material 142. The heat is also radiated by the heat radiation electrode layer 156 that is thermally connected to 146. Further, the heat generated by the light emission of the LED element 132 is also radiated from the reflection frame 133 that is in direct contact with the nonpolar electrode layer 146. Thus, since the light emitting module 110 according to the first embodiment is configured to be able to effectively dissipate the heat generated in the LED element 132, the light emission efficiency (light emission) due to the temperature rise of the LED element 132 is achieved. Characteristic) is suppressed, high luminance proportional to the amount of current is obtained, and the effects of improving the functionality and life of the surface-mounted LED 130 are obtained.

  In the first embodiment, as described above, the groove portion 127 having the bottom surface formed in the base material portion 121 by penetrating the heat-dissipating conductor layer 126b and the insulating layer 125 is provided in the metal base substrate 120, and the groove portion 127 is provided. By forming the copper plating layer 128 on the inner surface of the metal base substrate 120, the heat from the surface-mounted LED 130 surface-mounted on the conductor layer 126 of the metal base substrate 120 is transferred to the copper plating layer 128 formed on the inner surface of the groove 127. Can be efficiently transmitted to the base part 121 of the metal base substrate 120. For this reason, the heat from the surface-mounted LED 130 can be efficiently dissipated from the base material part 121 having a heat dissipation function. In addition, by configuring the metal base substrate 120 as described above, heat from the surface mount LED 130 is transmitted from the base portion 121 of the metal base substrate 120 even when the surface mounted LED 130 to be surface mounted has a large amount of heat generation. Since the heat can be efficiently radiated, the metal base substrate 120 that can cope with the high output of the surface-mounted LED 130 can be obtained.

  Further, in the configuration of the metal base substrate 120 described above, since the conductor layer 126 and the base material portion 121 are thermally connected via the copper plating layer 128, the surface mount type LED 130 is surface-mounted on the conductor layer 126. As a result, the surface-mounted LED 130 can be indirectly brought into thermal contact (thermally connected) with the base member 121 via the conductor layer 126. For this reason, unlike the configuration in which the surface of the base part 121 is exposed by removing the insulating layer 125 and a part of the surface-mounted LED 130 is in direct contact with the exposed region of the base part 121, the bonding surface is different. Even when a flat general surface-mounted LED 130 is surface-mounted, the surface-mounted LED 130 can be thermally connected to the base portion 121. Thereby, the heat from the surface-mounted LED 130 can be efficiently radiated from the base part 121 without changing the design of the surface-mounted LED 130 to be surface-mounted.

  In the first embodiment, a plurality of grooves 127 provided on the metal base substrate 120 are formed at predetermined intervals, and the plurality of grooves 127 extend in a predetermined direction parallel to the upper surface of the base member 121. In this way, since the heat contact area between the heat-dissipating conductor layer 126b and the base member 121 can be easily increased, the heat from the surface-mounted LED 130 can be easily transferred to the copper. It can be transmitted to the base material part 121 through the plating layer 128. Thereby, the heat dissipation characteristic of the metal base substrate 120 can be easily improved.

  In the first embodiment, the base portion 121 of the metal base substrate 120 is made of aluminum, and the copper plating layer 128 formed on the inner surface of the groove portion 127 is made of copper, thereby forming the metal base substrate 120. The heat from the surface-mounted LED 130 can be more efficiently transferred to the base member part 121 and the transmitted heat from the surface-mounted LED 130 can be transmitted more efficiently while reducing the weight and improving the corrosion resistance. Can be dissipated from the base material portion 121.

  In the first embodiment, the base portion 121 of the metal base substrate 120 is configured to include a zincate treatment layer, a nickel layer, and a copper layer 124 that are sequentially formed from the front surface side, so that the inner surface of the groove portion 127 is formed. When the copper plating layer 128 is formed, it is possible to prevent the adhesion of the copper plating layer 128 from being lowered.

  In the first embodiment, the conductor layer 126 includes the heat dissipating conductor layer 126b and the heat dissipating conductor layer 126b and the wiring conductor layer 126a electrically insulated and separated from the heat dissipating conductor layer 126b. By forming the groove 127 and the heat radiating conductor layer 126b in the formation region, the copper plating layer 128 is formed on the inner surface of the groove 127, so that the conductor layer 126 and the base member 121 are interposed via the copper plating layer 128. Even if it is electrically connected, an electrical short circuit of the conductor layer 126 can be suppressed. Accordingly, the surface-mounted LED 130 can be surface-mounted on the conductor layer 126 of the metal base substrate 120 without considering an electrical short circuit.

  Moreover, in 1st Embodiment, the heat dissipation characteristic of the light emitting module 110 can be improved by carrying out the surface mounting of the surface mount type LED130 which has an above-described structure on the metal base substrate 120 mentioned above. That is, the light emitting module 110 having good heat dissipation characteristics can be easily configured.

  The solder 160 for fixing the surface-mounted LED 130 on the metal base substrate 120 is embedded in the groove 127 by flowing into the groove 127, and the solder 160 flowing into the groove 127 is surface-mounted by its surface tension. A strong downward pulling force is generated on the LED 130. Due to the strong downward tensile force applied to the surface-mounted LED 130, the thickness of the solder 160 interposed between the conductor layer 126 and the surface-mounted LED 130 is reduced, so that the space between the conductor layer 126 and the surface-mounted LED 130 is reduced. Even if the solder 160 is interposed, the thermal resistance of the interposed solder 160 is reduced. For this reason, since heat from the surface-mounted LED 130 can be efficiently transferred to the conductor layer 126b for heat dissipation, the heat from the surface-mounted LED 130 is transferred via the copper plating layer 128 provided in the groove 127. It can be easily transmitted to the base material part 121. Accordingly, the heat dissipation characteristics of the light emitting module 110 can be improved also by this.

  11 to 15 are cross-sectional views for explaining a method of manufacturing a metal base substrate that is a component of the light emitting module according to the first embodiment. Next, with reference to FIGS. 4 and 5 and FIGS. 11 to 15, a method of manufacturing the metal base substrate 120 that is a component of the light emitting module 110 according to the first embodiment will be described. In FIGS. 12 to 14, the zincate treatment layer 122, the nickel layer 123, and the copper layer 124 formed on the surface of the plate-like member (base material portion) 121 are omitted for simplification of the drawings.

  First, as shown in FIG. 11, a zincate treatment layer 122 having a thickness of about 0.05 μm to 0.2 μm is formed on the surface portion of a plate-like member (base material portion) 121 made of aluminum by a zincate treatment. . Next, a nickel layer 123 having a thickness of about 2 μm is formed on the upper surface of the zincate treatment layer 122 by electroless plating. Next, a copper layer 124 having a thickness of 5 μm or more is formed on the upper surface of the nickel layer 123 by plating. Thereafter, the surface portion of the copper layer 124 is roughened.

  Subsequently, as shown in FIG. 12, on one main surface (upper surface) of the plate-like member (base material portion) 121 and on the upper surface of the roughened copper layer 124 (see FIG. 11), An insulating layer 125 having a thickness of about 25 μm to about 80 μm is formed on the entire surface. Note that since the surface portion of the copper layer 124 has been subjected to a roughening treatment, a decrease in adhesion between the copper layer 124 and the insulating layer 125 is suppressed. Thereafter, a conductor layer 126 is formed on the entire surface of the insulating layer 125.

  Next, as shown in FIG. 13, a predetermined region of the conductor layer 126 is removed using a photolithography technique and an etching technique. Then, as shown in FIG. 14, the insulating layer 125 in the region where the conductor layer 126 has been removed is removed using a laser processing method. Thereby, as shown in FIG. 4, a plurality of elongated grooves 127 are formed. At this time, the plurality of groove portions 127 penetrate the conductor layer 126 and the insulating layer 125, so that the bottom surfaces of the respective groove portions 127 are on the plate-like member (base material portion) 121 and are roughened. It forms so that it may form in the copper layer 124 (refer FIG. 11).

  Next, after the upper surface of the copper layer is roughened by a roughening treatment, a copper plating layer 128 having a thickness of about 25 μm is formed on the entire upper surface of the conductor layer 126 by a plating treatment. Thereby, as shown in FIG. 15, a copper plating layer 128 is formed in the groove portion 127 so as to cover the inner surface of the groove portion 127. Specifically, the copper plating layer 128 is covered on the bottom surface and the inner surface of the groove portion 127.

  Finally, by removing a predetermined region of the conductor layer 126 using a photolithography technique and an etching technique, the conductor layer 126 is formed in a predetermined pattern shape as shown in FIGS. As a result, the heat dissipating conductor layer 126b and the wiring conductor layer 126a are formed. Note that the conductor layer 126 is patterned so that the groove 127 described above is disposed in the formation region of the heat dissipating conductor layer 126b.

  In this way, the metal base substrate 120 that is a constituent member of the light emitting module 110 according to the first embodiment is manufactured.

  Then, the surface-mounted LED 130 is surface-mounted on the upper surface of the metal base substrate 120 manufactured as described above, whereby the light emitting module 110 according to the first embodiment shown in FIG. 1 is manufactured.

  In the first embodiment, as described above, in the method for manufacturing the metal base substrate 120, the groove 127 can be reduced by forming the groove 127 using the laser processing method. More groove portions 127 can be formed in the formation region of the layer 126b. Therefore, a heat dissipation path (a portion that thermally connects the conductor layer 126 and the base material portion 121) formed by forming the copper plating layer 128 on the inner side surface of the groove portion 127 by increasing the groove portion 127. Can be increased. In the case where a material that can be etched such as polyimide is used for the plate-like member (base material portion) 121, the groove 127 can be formed by, for example, an etching process in addition to the laser processing method. . In this case, the groove 127 can be formed with the same accuracy as the laser processing method.

  Further, in the first embodiment, by forming the copper layer 124 with a thickness of 5 μm or more on the upper surface of the nickel layer 123, the bottom surface of the groove portion 127 even when the roughening process is performed after the step of forming the groove portion 127. In addition, the aluminum member of the plate-like member (base material portion) 121 can be suppressed from being exposed. For this reason, in the process of forming the copper plating layer 128 on the inner surface of the groove portion 127, it is possible to suppress a decrease in the adhesion of the copper plating layer 128.

  FIG. 16 is a perspective view showing a part of a metal base substrate according to a first modification of the first embodiment. Referring to FIG. 16, in the metal base substrate 220 according to the first modification of the first embodiment, the wiring substrate 261 is attached to the adhesive sheet 262 on one main surface (upper surface) of the base portion 121 made of aluminum. It is fixed by. The wiring board 261 has a structure in which a conductor layer 126 similar to that of the first embodiment is formed on the upper surface of the insulating base 225. That is, a heat radiation conductor layer 126b and a wiring conductor layer 126a are formed on the upper surface of the insulating base 225. The insulating base material 225 and the adhesive sheet 262 of the wiring board 261 are examples of the “insulating layer” in the present invention. In addition to the adhesive sheet 262, the wiring board 261 may be fixed on one main surface (upper surface) of the base member 121 with an adhesive.

  Further, a plurality of elongated grooves 127 are formed in the region where the heat-dissipating conductor layer 126b is formed, like the metal base substrate 120 according to the first embodiment. Each of the plurality of grooves 127 penetrates through the heat-dissipating conductor layer 126b, the insulating base material 225, and the adhesive sheet 262, so that the bottom surface is formed in the base material part 121.

  The remaining configuration of the metal base substrate 220 according to the first modification of the first embodiment is the same as that of the first embodiment.

(Second Embodiment)
FIG. 17 is an overall perspective view of a light emitting module according to a second embodiment of the present invention. 18 is an exploded perspective view of the light emitting module according to the second embodiment of the present invention shown in FIG. 19 to 21 are views for explaining the structure of a light emitting module according to a second embodiment of the present invention. Next, the structure of the light emitting module 310 according to the second embodiment of the present invention will be described with reference to FIGS. 4, 5, and 17 to 21.

  In the light emitting module 310 according to the second embodiment, as shown in FIGS. 17 and 18, the surface-mounted LED 130 similar to that of the first embodiment is surface-mounted on the upper surface of the metal base substrate 320. The metal base substrate 320 of the second embodiment is different from the metal base substrate 120 of the first embodiment in that the heat dissipation conductor layer 326b includes a bonding region (mounting region) 326c and a heat sink region (heat dissipation region) 326d. Is included. Here, the bonding region 326c is a region where the heat radiation electrode layer 156 (see FIG. 21) of the surface-mounted LED 130 is bonded by the solder 160 (see FIG. 21), and the heat sink region 326d is formed from the surface-mounted LED 130. It is a region that dissipates the heat. The metal base substrate 320 is an example of the “heat dissipating member” in the present invention, and the heat dissipating conductor layer 326b is an example of the “heat dissipating first conductor layer” in the present invention.

  Further, as shown in FIG. 19, the joining region 326c of the heat dissipation conductor layer 326b has substantially the same planar shape as the heat dissipation conductor layer 126b (see FIG. 4) of the metal base substrate 120 according to the first embodiment. Is formed. In addition, the heat sink region 326d of the heat-dissipating conductor layer 326b is formed on the one end side (Y1 direction side) of the bonding region 326c in the Y direction and the other end side (Y2 direction side) of the bonding region 326c in the Y direction, respectively. It is formed to extend in the direction. The heat sink region 326d is connected to the bonding region 326c on one end side (Y1 direction side) and the other end side (Y2 direction side) of the bonding region 326c in the Y direction.

  Further, in the region where the heat-dissipating conductor layer 326b is formed, a plurality of grooves 327 dug by laser processing in the thickness direction of the metal base substrate 320 from the upper surface side of the conductor layer 326b are formed as in the first embodiment. ing. Each of the plurality of grooves 327 is formed in an elongated shape so as to extend along a predetermined direction parallel to the upper surface of the base member 121. Specifically, some of the groove portions 327 of the plurality of groove portions 327 spread outward from the center portion (substantially central portion of the bonding region 326c) in a plan view in the central region of the bonding region 326c. Are arranged radially. On the other hand, each of the remaining groove portions 327b among the plurality of groove portions 327 is formed to extend in the Y direction in the other region of the bonding region 326c and the heat sink region 326d, and the extending direction of the groove portion 327b (Y Are arranged at a predetermined interval in a direction (X direction) orthogonal to (direction).

  Further, as in the first embodiment, a copper plating layer 128 (see FIG. 5) is formed on the inner surface of each of the plurality of groove portions 327 so as to cover the inner side surface of the groove portion 327 and the bottom surface of the groove portion 327. ing.

  Here, in the metal base substrate 320 of the second embodiment, as shown in FIGS. 19 to 21, a dam member 329 made of resist is provided at a boundary portion between the bonding region 326 c and the heat sink region 326 d. . The dam member 329 is formed in an elongated shape so as to extend in a predetermined direction (X direction) parallel to the upper surface of the base member 121. Further, the dam member 329 is formed so as to divide the groove portion 327 extending in the Y direction at the boundary portion between the joining region 326c and the heat sink region 326d. Furthermore, the dam member 329 is formed so as to slightly protrude from the upper surface of the heat-dissipating conductor layer 326b. That is, the dam member 329 is configured to prevent the solder 160 from flowing from the bonding region 326c to the heat sink region 326d when the surface-mounted LED 130 is surface-mounted. Instead of the dam member 329, a discontinuous region (a portion that divides the groove) is formed in a part of the groove 327 so that the discontinuous portion has the same function as the dam member 329. Good. In other words, a discontinuous region (not shown) formed in a part of the groove portion 327 may be positioned in the region where the dam member 329 is formed.

  In the metal base substrate 320 configured as described above, as shown in FIG. 21, when the surface-mounted LED 130 is surface-mounted, the flow of the solder 160 from the bonding region 326c is blocked by the dam member 329. For this reason, since the solder 160 flows into the heat sink region 326d is suppressed, the solder 160 flows into the heat sink region 326d, resulting in a disadvantage that the solder 160 is embedded in the groove portion 327 in the heat sink region 326d. Can be suppressed. As a result, the heat sink region 326d is configured such that the contact area with the air is increased by the plurality of groove portions 327, so that heat from the surface mount LED 130 can be efficiently transferred from the heat sink region 326d via the base member portion 121. It is possible to dissipate heat.

  In addition, the other structure of the metal base substrate 320 of 2nd Embodiment is the same as that of the said 1st Embodiment.

  In the second embodiment, as described above, the heat-dissipating conductor layer 326b is composed of the joining region 326c and the heat sink region 326d, and the flow of the solder 160 is flowed to the boundary portion between the joining region 326c and the heat sink region 326d. By providing the dam member 329 for blocking, the groove portion 327 of the heat sink region 326d can be suppressed from being embedded by the solder 160 from the bonding region 326c. Thereby, the heat from the surface-mounted LED 130 can be dissipated not only from the base material part 121 but also from the heat sink region 326d, so that the heat dissipation characteristics of the metal base substrate 320 can be improved more easily.

  Other effects of the second embodiment are the same as those of the first embodiment.

  The embodiment disclosed this time should be considered as illustrative in all points and not restrictive. The scope of the present invention is shown not by the above description of the embodiments but by the scope of claims for patent, and further includes all modifications within the meaning and scope equivalent to the scope of claims for patent.

  For example, in the first and second embodiments, the present invention is applied to a metal base substrate having a plate-like base material portion. However, the present invention is not limited to this, and the present invention is applied to a heat dissipation member other than the metal base substrate. You may apply.

  In the first and second embodiments, the metal base substrate is formed by sequentially forming a zincate treatment layer, a nickel layer, and a copper layer from the surface side of the base portion made of aluminum. The metal base substrate may be configured using a clad material having a dissimilar metal layer such as copper on the surface of aluminum serving as a part. At this time, it can suppress that the adhesiveness of the copper plating layer formed on the inner surface of a groove part falls by dissimilar metals, such as copper of the aluminum surface.

  In the first and second embodiments, the example in which the light-emitting module is configured by surface mounting the surface-mounted LED having the above-described configuration on the upper surface of the metal base substrate is shown. However, the light-emitting module may be configured by surface-mounting a surface-mounted LED having a configuration other than the surface-mounted LED. It is also possible to surface-mount a surface-mounted component other than the surface-mounted LED on the upper surface of the metal base substrate of the first and second embodiments.

  In the first and second embodiments, the copper plating layer is formed on the inner surface of each of the plurality of grooves. However, the present invention is not limited to this, and part of the inner surfaces of the plurality of grooves is provided. The structure by which the copper plating layer is formed in may be sufficient.

  Moreover, in the said 1st and 2nd embodiment, although the example which formed the bottom face of the groove part in the copper layer of the base material part was shown, this invention is not restricted to this, The bottom face of a groove part is made into the nickel layer of a base material part. It may be formed.

  In the first and second embodiments, as shown in FIG. 22, solder 160 may be embedded in at least part of the inner surface of the groove 127 (327) via a copper plating layer 128. In addition to the solder 160, a conductive paste such as an Ag paste may be embedded on the inner surface of the groove 127 (327). In this case, in addition to the copper plating layer 128 coated on the bottom surface of the groove portion 127 (327) and the inner surface of the groove portion 127 (327), the solder 160 embedded in the groove portion 127 (327) or The conductive paste can also transfer heat from the surface-mounted LED to the base 121, so that the bottom surface of the groove 127 (327) and the inner surface of the groove 127 (327) are covered with the copper plating layer 128. The heat from the surface-mounted LED can be easily transmitted to the base member 121 as compared with the configuration that is merely provided.

  In the first and second embodiments, an example in which the copper plating layer is formed on the inner surface of the groove by plating is shown. However, the present invention is not limited to this, and vapor deposition methods other than plating, sputtering, or You may form the film as a heat conductive member on the inner surface of a groove part by flux processing, solder, etc. In this case, it is preferable to thicken the upper surface of the formed film by plating.

  Moreover, in the said 1st and 2nd embodiment, although the example which comprised the base material part of the metal base board | substrate from aluminum was shown, this invention is not restricted to this, Metal other than aluminum is used for the base material part of a metal base board | substrate. You may comprise from a material. Moreover, in the said 1st and 2nd embodiment, although the example which comprised the heat conductive member formed on the inner surface of a groove part from a copper plating layer was shown, this invention is not limited to this, It forms on the inner surface of a groove part. You may comprise a heat conductive member from materials other than a copper plating layer.

  In the first and second embodiments, the example in which the surface-mounted LED is surface-mounted using solder on the upper surface of the metal base substrate is shown. However, the present invention is not limited to this, and the present invention is not limited to this. The adhesive layer for surface mounting may be a conductive paste in addition to solder.

  In the first and second embodiments, the example in which the reflective frame of the surface-mounted LED is made of a metal material mainly composed of aluminum is shown. However, the present invention is not limited to this, and the surface-mounted LED is used. You may comprise the reflective frame body of LED from pure Al, magnesium, and another metal material. Moreover, you may comprise a reflective frame body from ceramic materials other than a metal material. Further, the reflection frame may be made of a material in which a metal is dispersed in a resin.

  In the first and second embodiments, the example in which the LED element, which is an example of the light emitting element, is provided in the surface mount type LED is shown. You may make it provide in an apparatus. For example, the organic EL element may be provided in the surface mount type LED.

  In the first and second embodiments, the surface-mounted LED is provided on the metal base substrate. However, a predetermined number of LED elements are arranged directly on the heat dissipation conductor layer of the metal base substrate. The electrode portion and the conductor layer for wiring of the metal base substrate may be electrically connected to each other through a bonding wire.

  Moreover, in the said 1st and 2nd embodiment, although it comprised so that a reflective frame and a nonpolar electrode layer might contact directly in surface mount type LED, this invention is not limited to this, A reflective frame and non-polarity The conductive electrode layer may be configured to contact indirectly through a conductive member such as a conductive paste.

  Further, in the first embodiment, as shown in FIG. 23, the groove portion 127 of the metal base substrate may be embedded with the copper plating layer 128. At this time, by configuring the width of the groove 127 to be 0.1 mm or less (about 25 μm), the inside of the groove 127 can be easily embedded by the copper plating layer 128. In this case, heat from the surface-mounted LED can be more efficiently transferred to the base member 121. Therefore, heat from the surface-mounted LED can be more efficiently transferred from the base member 121. Heat can be dissipated.

  In the first embodiment, as shown in FIG. 24, the groove portion 127 of the metal base substrate may be directly embedded with solder 160 as an example of a heat conducting member. Further, in addition to the solder 160, it may be configured to be directly embedded with a conductive paste such as an Ag paste.

  In the second embodiment, the configuration of the metal base substrate in which the conductor layer is formed on the upper surface of the base material portion via the insulating layer is shown. However, the present invention is not limited to this, and the first embodiment described above. As in the first modified example, the metal base substrate may be configured such that the wiring substrate on which the conductor layer is formed is bonded onto the base material portion with an adhesive sheet or the like.

1 is an overall perspective view of a light emitting module according to a first embodiment of the present invention. FIG. 2 is an exploded perspective view of the light emitting module according to the first embodiment of the present invention shown in FIG. 1. FIG. 2 is a cross-sectional view of the light emitting module according to the first embodiment of the present invention shown in FIG. 1. FIG. 2 is a plan view of a metal base substrate constituting the light emitting module according to the first embodiment of the present invention shown in FIG. 1. FIG. 2 is an enlarged cross-sectional view illustrating a part of a metal base substrate constituting the light emitting module according to the first embodiment of the present invention illustrated in FIG. 1. FIG. 2 is a plan view of a surface-mounted LED constituting the light emitting module according to the first embodiment of the present invention shown in FIG. 1. It is the reverse view which abbreviate | omitted and showed a part of surface mounted LED which comprises the light emitting module by 1st Embodiment of this invention shown in FIG. FIG. 2 is a rear view of the surface-mounted LED constituting the light emitting module according to the first embodiment of the present invention shown in FIG. 1. It is the top view which showed the board | substrate of surface mount type LED which comprises the light emitting module by 1st Embodiment of this invention shown in FIG. It is sectional drawing which expanded and showed a part of surface mount type LED which comprises the light emitting module by 1st Embodiment of this invention shown in FIG. It is sectional drawing for demonstrating the manufacturing method of the metal base substrate which is a structural member of the light emitting module by 1st Embodiment. It is sectional drawing for demonstrating the manufacturing method of the metal base substrate which is a structural member of the light emitting module by 1st Embodiment. It is sectional drawing for demonstrating the manufacturing method of the metal base substrate which is a structural member of the light emitting module by 1st Embodiment. It is sectional drawing for demonstrating the manufacturing method of the metal base substrate which is a structural member of the light emitting module by 1st Embodiment. It is sectional drawing for demonstrating the manufacturing method of the metal base substrate which is a structural member of the light emitting module by 1st Embodiment. It is the perspective view which showed a part of metal base board | substrate by the 1st modification of 1st Embodiment. It is a whole perspective view of the light emitting module by 2nd Embodiment of this invention. FIG. 18 is an exploded perspective view of the light emitting module according to the second embodiment of the present invention shown in FIG. 17. FIG. 18 is a plan view of a metal base substrate constituting the light emitting module according to the second embodiment of the present invention shown in FIG. 17. FIG. 18 is a plan view of a light emitting module according to the second embodiment of the present invention shown in FIG. 17. It is sectional drawing along the A-A 'line | wire of FIG. It is sectional drawing which expanded and showed a part of metal base board | substrate by the modification of this invention. It is sectional drawing which expanded and showed a part of metal base board | substrate by the 2nd modification of 1st Embodiment. It is sectional drawing which expanded and showed a part of metal base board | substrate by the 3rd modification of 1st Embodiment. It is sectional drawing which showed the state which mounted the conventional LED package described in patent document 1 on the metal base substrate.

Explanation of symbols

110, 310 Light emitting module 120, 220, 320 Metal base substrate (heat dissipation member)
121 Substrate (metal member)
122 Jincate treatment layer (metal layer)
123 Nickel layer (metal layer)
124 Copper layer (metal layer)
125 Insulating layer 126 Conductor layer 126a Conductor layer for wiring 126b, 326b Conductive layer for heat dissipation 127, 327 Groove 128 Copper plating layer (heat conduction member, metal plating layer)
130 Surface Mount Type LED (Light Emitting Device)
132 LED element (light emitting element)
133 Reflective frame 142 Insulating substrate 143 Resist layer 146 Nonpolar electrode layer (first electrode layer on the upper surface side)
147, 148 Polarized electrode layer (third electrode layer for wiring)
156 Electrode layer for heat dissipation (second electrode layer on the lower surface side)
157, 158 Wiring electrode layer (wiring third electrode layer)
160 Solder 225 Insulating base material (insulating layer)
261 Wiring board 262 Adhesive sheet (insulating layer)
326d Heat sink area 326c Bonding area 329 Dam member

Claims (19)

A metal member;
A conductor layer formed on an upper surface of the metal member via an insulating layer;
A groove portion having an open end on the upper surface side of the conductor layer and having a bottom surface formed in the metal member by penetrating the conductor layer and the insulating layer;
And a heat conducting member formed on at least a part of the inner surface of the groove. A plurality of the groove portions are formed at a predetermined interval from each other,
2. The heat radiating member according to claim 1, wherein the plurality of grooves are formed in an elongated shape so as to extend in a predetermined direction parallel to an upper surface of the metal member.   The heat radiating member according to claim 1, wherein the heat conducting member is composed of a metal plating layer.   The heat radiating member according to claim 3, wherein the metal plating layer is formed so as to cover a bottom surface of the groove and an inner surface of the groove.   The heat radiating member according to claim 4, wherein solder or conductive paste is embedded in at least a part of the inner surface of the groove portion through the metal plating layer.   The heat radiating member according to claim 5, wherein a dam member for blocking a flow of the solder or the conductive paste is provided in a predetermined region of the conductor layer.   The heat radiating member according to claim 3, wherein the metal plating layer is formed so as to fill the groove. The metal member is made of aluminum,
The heat radiating member according to claim 3, wherein the metal plating layer is made of copper.   The heat dissipating member according to claim 8, wherein the metal member made of aluminum includes a metal layer made of a metal material different from aluminum formed on the surface thereof.   9. The metal member made of aluminum includes a zincate treatment layer formed on a surface portion by a zincate treatment, and a nickel layer formed on the zincate treatment layer by a plating treatment. Or the heat radiating member of Claim 9.   The heat radiating member according to claim 10, wherein the metal member made of aluminum further includes a copper layer formed on the nickel layer. The conductor layer includes a first conductor layer for heat dissipation and a second conductor layer for wiring that is electrically insulated and separated from the first conductor layer,
The heat radiating member according to claim 1, wherein the groove is formed in a region where the first heat radiating conductor layer is formed. A light emitting device including the light emitting element;
A light emitting module comprising: the heat dissipating member according to claim 1.   The light-emitting device includes a reflective frame whose inner peripheral surface is a reflective surface that reflects light from the light-emitting element, and the reflective frame is made of a heat dissipation material, The light emitting module according to claim 13. The light emitting device includes a first electrode layer on an upper surface side and a second electrode layer on a lower surface side, and the first electrode layer and the second electrode layer are thermally connected to each other through a through hole formed in a predetermined region. And further comprising a substrate connected to
The light emitting element is mounted on the first electrode layer on the upper surface side, and the second electrode layer on the lower surface side thermally connected to the first electrode layer on the upper surface side is attached to the heat dissipation member. The light emitting module according to claim 13 or 14, wherein the light emitting module is thermally connected to the metal member of the heat radiating member through the provided heat conducting member.   The reflective frame body is fixed on the upper surface of the insulating substrate so as to be in direct contact with the first electrode layer on the upper surface side or indirectly in contact with a conductive member. Item 16. The light emitting module according to Item 15.   The light emitting module according to any one of claims 14 to 16, wherein the reflective frame is made of a metal material mainly composed of aluminum. The insulating substrate further includes a third electrode layer for wiring for supplying power to the light emitting element,
The first electrode layer on the upper surface side and the second electrode layer on the lower surface side are electrically insulated and separated from the third electrode layer for wiring, respectively. The light emitting module of any one of Claims.   The light emitting module according to claim 13, wherein the light emitting element is a light emitting diode element.

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