JP2007287751A - Light emitting device - Google Patents
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- JP2007287751A JP2007287751A JP2006110121A JP2006110121A JP2007287751A JP 2007287751 A JP2007287751 A JP 2007287751A JP 2006110121 A JP2006110121 A JP 2006110121A JP 2006110121 A JP2006110121 A JP 2006110121A JP 2007287751 A JP2007287751 A JP 2007287751A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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Abstract
Description
本発明は、例えば高出力型のＬＥＤ（Light Emitting Diode：発光ダイオード）装置に使用して好適な発光装置に関する。 The present invention relates to a light emitting device suitable for use in, for example, a high power LED (Light Emitting Diode) device.
近年、高出力のＬＥＤ素子の開発が進められてきており、既に数ワットの大出力タイプのものも製品化されている。ＬＥＤ素子は、発熱の少ないことが特徴であるが、高出力（高輝度）タイプのＬＥＤ素子は大電流が流れるため、無視できないレベルの発熱が生じる。このため、例えば素子搭載基板に対してＬＥＤ素子を搭載する場合、素子搭載基板に放熱板を取り付け、ＬＥＤ素子による発生熱を放熱板から効果的に放散してその信頼性を確保することが行われる。 In recent years, development of high-power LED elements has been promoted, and a high-power type of several watts has already been commercialized. The LED element is characterized by low heat generation. However, since a high current (high luminance) type LED element flows a large current, a non-negligible level of heat generation occurs. For this reason, for example, when an LED element is mounted on an element mounting board, a heat sink is attached to the element mounting board, and heat generated by the LED element is effectively dissipated from the heat sink to ensure its reliability. Is called.
従来、この種のＬＥＤ素子を備えた発光装置は、伝熱用スルーホールを有する素子搭載基板としての多層セラミック基板と、この多層セラミック基板の素子反搭載面に伝熱用スルーホールを覆うように取り付けられた放熱板（ヒートシンク）とを備えたものが知られている（特許文献１）。 Conventionally, a light-emitting device equipped with this type of LED element has a multilayer ceramic substrate as an element mounting substrate having a heat transfer through hole, and covers the heat transfer through hole on the element mounting surface of the multilayer ceramic substrate. A device provided with an attached heat sink (heat sink) is known (Patent Document 1).
このような発光装置において、ＬＥＤ素子が発光によって発熱すると、この発生熱が伝熱用スルーホールを介して放熱板に熱伝導され、放熱板から周囲に放散される。 In such a light emitting device, when the LED element generates heat due to light emission, the generated heat is thermally conducted to the heat radiating plate through the heat transfer through hole, and is dissipated from the heat radiating plate to the surroundings.
ところで、この種の発光装置の素子搭載基板には、ＬＥＤ素子と共に外部接続用のコネクタが実装されている。この場合、素子搭載基板に対するコネクタ及びＬＥＤ素子の実装には、近年の地球環境保護への見地から、鉛フリーによるリフロー実装方法が採用されている。
しかし、特許文献１において、鉛フリーのリフロー実装によってコネクタ及びＬＥＤ素子を多層セラミック基板上に搭載すると、リフロー実装時にコネクタや他の構成部材が加熱により信頼性が損なわれるという問題があった。 However, in Patent Document 1, when the connector and the LED element are mounted on the multilayer ceramic substrate by lead-free reflow mounting, there is a problem that the reliability of the connector and other components is impaired by heating at the time of reflow mounting.
また、特許文献１によると、多層セラミック基板上に回路パターンを形成するとともに、コネクタを搭載するものであるため、装置組立時の工程数が嵩み、その組立作業を煩雑にするという問題もあった。 Further, according to Patent Document 1, since a circuit pattern is formed on a multilayer ceramic substrate and a connector is mounted, the number of processes at the time of assembling the apparatus increases, and there is a problem that the assembling work becomes complicated. It was.
従って、本発明の目的は、リフロー実装によるコネクタや他の構成部材の信頼性の劣化を防止することができるとともに、装置組立作業の簡素化を図ることができる発光装置を提供することにある。 Accordingly, an object of the present invention is to provide a light-emitting device that can prevent deterioration in reliability of connectors and other components due to reflow mounting and can simplify device assembly work.
本発明は、上記目的を達成するために、発光素子と、前記発光素子に接続する回路パターン及び前記回路パターンに接続する外部接続用のコンタクトを有する基板と、前記基板に取り付けられ、前記発光素子による発生熱を放散する放熱部材とを備え、前記放熱部材と前記発光素子とは熱伝導性部材を介して熱的に接続されていることを特徴とする発光装置を提供する。 In order to achieve the above object, the present invention provides a light emitting element, a substrate having a circuit pattern connected to the light emitting element and a contact for external connection connected to the circuit pattern, and the light emitting element attached to the substrate. And a heat radiating member that dissipates the heat generated by the heat radiating member, wherein the heat radiating member and the light emitting element are thermally connected to each other through a heat conductive member.
本発明によると、リフロー実装によるコネクタや他の構成部材の信頼性の劣化を防止することができるとともに、装置組立作業の簡素化を図ることができる。 According to the present invention, it is possible to prevent deterioration in reliability of connectors and other components due to reflow mounting, and it is possible to simplify apparatus assembly work.
[実施の形態]
図１は、本発明の実施の形態に係る発光装置を説明するために示す斜視図である。図２は、本発明の実施の形態に係る発光装置を説明するために示す断面図である。図３は、本発明の実施の形態に係る発光装置のＬＥＤ素子を説明するために示す断面図である。
[Embodiment]
FIG. 1 is a perspective view for explaining a light emitting device according to an embodiment of the present invention. FIG. 2 is a cross-sectional view for explaining the light emitting device according to the embodiment of the present invention. FIG. 3 is a cross-sectional view for explaining an LED element of the light emitting device according to the embodiment of the present invention.
〔発光装置１の全体構成〕
図１において、発光装置１は、発光素子としてのＬＥＤ素子２と、このＬＥＤ素子２を搭載するフレキシブル基板３と、このフレキシブル基板３上のＬＥＤ素子２による発生熱を放散する放熱部材４とから大略構成されている。
[Overall configuration of light-emitting device 1]
In FIG. 1, a light emitting device 1 includes an LED element 2 as a light emitting element, a flexible substrate 3 on which the LED element 2 is mounted, and a heat radiating member 4 that dissipates heat generated by the LED element 2 on the flexible substrate 3. It is roughly structured.
（ＬＥＤ素子２の構成）
ＬＥＤ素子２は、図３に示すように、パッド電極（ｐ側電極）１０及びｎ側電極１１を有する例えばフェイスアップ型の紫外線ＬＥＤ素子からなり、シリコーン等の樹脂材料からなる封止部材８（図１に示す）によって封止され、かつフレキシブル基板３の素子搭載側面上にスルーホール（後述）の素子搭載側開口面を覆うように縦横方向に複数個（図１では１個のみ示す）ずつ（例えば縦３個×横３個＝９個）並列して搭載されている。ＬＥＤ素子２は、サファイア（Ａｌ2Ｏ3）基板２４上にＡｌＮバッファ層２５及びｎ−ＧａＮ層２６・発光層２７・ｐ−ＧａＮ２８層を順次結晶成長させることにより形成されている。そして、ピーク発光波長が３６０ｎｍ〜４００ｎｍである紫外線を発するように構成されている。ＬＥＤ素子２には、パッド電極１０のサファイア基板側に位置し、かつｐ−ＧａＮ層２８のパッド電極側面を覆う電流拡散導電膜としての酸化インジウム・酸化錫（ＩＴＯ）からなる透明電極２９が配設されている。また、ＬＥＤ素子２には、パッド電極１０とｎ側電極１１との間に介在し、かつマイグレーションによる電極間の短絡発生を防止するための保護膜３０が配設されている。ＬＥＤ素子２の平面縦横寸法は、例えば縦寸法及び横寸法をそれぞれ約０．３ｍｍとする平面サイズに設定されている。
(Configuration of LED element 2)
As shown in FIG. 3, the LED element 2 is composed of, for example, a face-up type ultraviolet LED element having a pad electrode (p-side electrode) 10 and an n-side electrode 11, and a sealing member 8 ( 1) and a plurality of (only one is shown in FIG. 1) vertically and horizontally so as to cover an element mounting side opening surface of a through hole (described later) on the element mounting side surface of the flexible substrate 3. (For example, 3 vertical × 3 horizontal = 9) are mounted in parallel. The LED element 2 is formed by sequentially growing an AlN buffer layer 25, an n-GaN layer 26, a light emitting layer 27, and a p-GaN 28 layer on a sapphire (Al 2 O 3 ) substrate 24. And it is comprised so that the ultraviolet-ray whose peak light emission wavelength may be 360 nm-400 nm is emitted. The LED element 2 is provided with a transparent electrode 29 made of indium oxide / tin oxide (ITO) as a current diffusion conductive film which is located on the sapphire substrate side of the pad electrode 10 and covers the side surface of the pad electrode of the p-GaN layer 28. It is installed. Further, the LED element 2 is provided with a protective film 30 that is interposed between the pad electrode 10 and the n-side electrode 11 and prevents a short circuit between the electrodes due to migration. The plane vertical and horizontal dimensions of the LED element 2 are set to a plane size in which the vertical dimension and the horizontal dimension are about 0.3 mm, for example.
（フレキシブル基板３の構成）
フレキシブル基板３は、図１及び図２に示すように、例えばポリイミドフィルムからなる基部材３Ａの表面側（素子搭載側）に銅箔等の回路パターン３Ｂ，３Ｃを設けることにより形成されている。本実施の形態では、フレキシブル基板３を用いているが、ガラスエポキシ基板等、ある程度の剛性を有する基板を用いてもよい。回路パターン３Ｂ，３Ｃの素子搭載側面は、ＬＥＤ素子２のパッド電極（ｐ側電極）１０及びｎ側電極１１（共に図３に示す）にそれぞれ金（Ａｕ）からなるワイヤ１２，１３を介して接続されている。フレキシブル基板３には、ＬＥＤ素子２と放熱部材４を熱的に接続する処理が施されている。この処理は、基部材３Ａに貫通孔５Ａを設けるとともに、この貫通孔５Ａ内に例えばポッティングによってＡｇペースト等の熱伝導性部材５Ｂを塗布することにより実施される。フレキシブル基板３の片側側縁には、回路パターン３Ｂ，３Ｃに接続する外部接続用のコンタクトとなるＦＦＣ（Ｆｌｅｘｉｂｌｅ Ｆｌａｔ Ｃａｂｌｅ）端子６が一体に形成されている。
(Configuration of flexible substrate 3)
As shown in FIGS. 1 and 2, the flexible substrate 3 is formed by providing circuit patterns 3B and 3C such as copper foil on the surface side (element mounting side) of a base member 3A made of, for example, a polyimide film. Although the flexible substrate 3 is used in the present embodiment, a substrate having a certain degree of rigidity, such as a glass epoxy substrate, may be used. The element mounting side surfaces of the circuit patterns 3B and 3C are connected to the pad electrode (p-side electrode) 10 and the n-side electrode 11 (both shown in FIG. 3) of the LED element 2 via wires 12 and 13 made of gold (Au), respectively. It is connected. The flexible substrate 3 is subjected to a process of thermally connecting the LED element 2 and the heat dissipation member 4. This process is performed by providing the base member 3A with a through hole 5A and applying a heat conductive member 5B such as an Ag paste into the through hole 5A by, for example, potting. An FFC (Flexible Flat Cable) terminal 6 serving as an external connection contact connected to the circuit patterns 3B and 3C is integrally formed on one side edge of the flexible substrate 3.
（放熱部材４の構成）
放熱部材４は、フレキシブル基板３の裏面に熱伝導性両面テープ又は熱伝導性接着剤（図示せず）によって取り付けられ、全体がアルミニウム（Ａｌ）合金や銅（Ｃｕ）合金等の熱伝導性材料からなる平面矩形状の板部材によって形成されている。そして、ＬＥＤ素子２による発生熱をスルーホール５（熱伝導性部材５Ｂ）から受けて周囲に放散するように構成されている。
(Configuration of heat dissipation member 4)
The heat radiating member 4 is attached to the back surface of the flexible substrate 3 by a heat conductive double-sided tape or a heat conductive adhesive (not shown), and the whole is a heat conductive material such as an aluminum (Al) alloy or a copper (Cu) alloy. It is formed by the planar rectangular plate member which consists of. And it is comprised so that the heat generated by the LED element 2 may be received from the through hole 5 (thermal conductive member 5B) and dissipated to the surroundings.
〔発光装置１の動作〕
ＬＥＤ素子２に電源からＦＦＣ端子６及び回路パターン３Ｂ，３Ｃ・ワイヤ１２，１３を介して電圧が印加されると、ＬＥＤ素子２の発光層２７において紫外線を発し、この光がＬＥＤ素子２の光取出面から封止部材８に入射する。次に、ＬＥＤ素子２からの出射光が封止部材８を透過し、その光出射面から外部に出射される。この際、封止部材８の光学形状に基づいた光取出側における所定の方向に紫外線が出射される。
[Operation of Light Emitting Device 1]
When a voltage is applied to the LED element 2 from the power source via the FFC terminal 6 and the circuit patterns 3B, 3C and wires 12 and 13, ultraviolet rays are emitted from the light emitting layer 27 of the LED element 2, and this light is emitted from the LED element 2. The light enters the sealing member 8 from the extraction surface. Next, the emitted light from the LED element 2 passes through the sealing member 8 and is emitted from the light emitting surface to the outside. At this time, ultraviolet rays are emitted in a predetermined direction on the light extraction side based on the optical shape of the sealing member 8.
次に、本実施の形態に係る発光装置の組立方法につき、図４（ａ）〜（ｄ）を用いて説明する。 Next, a method for assembling the light emitting device according to this embodiment will be described with reference to FIGS.
図４（ａ）〜（ｄ）は、本発明の実施の形態に係る発光装置の組立方法を説明するために示す図である。図４（ａ）はフレキシブル基板の取付工程を、図４（ｂ）はダイボンド剤の塗布工程を、図４（ｃ）はＬＥＤ素子の搭載工程を、図４（ｄ）はＬＥＤ素子の封止工程をそれぞれ説明するために示す断面図である。 4A to 4D are views for explaining a method for assembling the light emitting device according to the embodiment of the present invention. 4A shows a flexible substrate mounting process, FIG. 4B shows a die bonding agent coating process, FIG. 4C shows an LED element mounting process, and FIG. 4D shows LED element sealing. It is sectional drawing shown in order to demonstrate each process.
本実施の形態に示す発光装置の組立方法は、「フレキシブル基板の取り付け」及び「ダイボンド剤の塗布工程」・「ＬＥＤ素子の搭載」・「ＬＥＤ素子の封止」の各工程が順次実施されるため、これら各工程を順次説明する。 In the method of assembling the light-emitting device shown in this embodiment, the steps of “attaching a flexible substrate” and “application process of a die bond agent”, “mounting an LED element”, and “sealing an LED element” are sequentially performed. Therefore, each of these steps will be described sequentially.
「フレキシブル基板の取り付け」
予め貫通孔５Ａが複数個設けられたコンタクト付きのフレキシブル基板３を熱伝導性両面テープ又は熱伝導性接着剤（図示せず）によってＡｌ合金又はＣｕ合金からなる放熱部材４の素子搭載側面（基板取付面）に貼り付ける。この場合、フレキシブル基板３が放熱部材４に貼り付けられると、図４（ａ）に示すようにフレキシブル基板３の裏面と放熱部材４の素子搭載側面とが熱伝導性両面テープ又は熱伝導性接着剤（図示せず）を介して密着する。
"Attaching a flexible board"
An element mounting side surface (substrate) of a heat radiating member 4 made of an Al alloy or a Cu alloy by using a heat conductive double-sided tape or a heat conductive adhesive (not shown) on a flexible substrate 3 with a contact in which a plurality of through holes 5A are provided in advance. Affix to the mounting surface. In this case, when the flexible substrate 3 is attached to the heat radiating member 4, as shown in FIG. 4A, the back surface of the flexible substrate 3 and the element mounting side surface of the heat radiating member 4 are thermally conductive double-sided tape or heat conductive adhesive. It adheres via an agent (not shown).
「ダイボンド剤の塗布工程」
フレキシブル基板３の貫通孔５Ａ内にＡｇペーストからなる熱伝導性部材５Ｂを例えばポッティングによって塗布する。
"Die bond agent coating process"
A heat conductive member 5B made of Ag paste is applied to the through hole 5A of the flexible substrate 3 by, for example, potting.
「ＬＥＤ素子の搭載」
先ず、フレキシブル基板３の貫通孔５Ａに塗布された熱伝導性部材５Ｂ上にＬＥＤ素子２を搭載する。次に、フレキシブル基板３の回路パターン３Ｂ，３Ｃにそれぞれワイヤ１２，１３によってＬＥＤ素子２のパッド電極１０及びｎ側電極１１（共に図３に示す）を接続する。この場合、ＬＥＤ素子２のパッド電極１０及びｎ側電極１１が回路パターン３Ｂ，３Ｃに接続されると、図４（ｃ）に示すように、放熱部材４に熱伝導性部材５Ｂを介して熱的に接続されたＬＥＤ素子２がフレキシブル基板３上に搭載される。
"Installation of LED elements"
First, the LED element 2 is mounted on the heat conductive member 5 </ b> B applied to the through hole 5 </ b> A of the flexible substrate 3. Next, the pad electrode 10 and the n-side electrode 11 (both shown in FIG. 3) of the LED element 2 are connected to the circuit patterns 3B and 3C of the flexible substrate 3 by wires 12 and 13, respectively. In this case, when the pad electrode 10 and the n-side electrode 11 of the LED element 2 are connected to the circuit patterns 3B and 3C, the heat radiating member 4 is heated via the heat conductive member 5B as shown in FIG. Connected LED elements 2 are mounted on a flexible substrate 3.
「ＬＥＤ素子の封止」
図４（ｄ）に示すように、シリコーン等の樹脂材料からなる封止部材８によってフレキシブル基板３上のＬＥＤ素子２を封止する。
このようにして、発光装置１を組み立てることができる。
"LED element sealing"
As shown in FIG. 4D, the LED element 2 on the flexible substrate 3 is sealed with a sealing member 8 made of a resin material such as silicone.
In this way, the light emitting device 1 can be assembled.
[実施の形態の効果]
以上説明した実施の形態によれば、次に示す効果が得られる。
[Effect of the embodiment]
According to the embodiment described above, the following effects can be obtained.
（１）コネクタと接続するコンタクト６がフレキシブル基板３と一体に設けられているので、リフロー実装する必要がなく、リフロー実装時の加熱による構成部材の信頼性の劣化が生じない。これにより、高い信頼性を有する発光装置を製造することができる。 (1) Since the contact 6 to be connected to the connector is provided integrally with the flexible substrate 3, there is no need for reflow mounting, and the reliability of the structural members due to heating during reflow mounting does not occur. Thereby, a light emitting device having high reliability can be manufactured.
（２）回路パターン３Ｂ，３Ｃ及びコンタクト６はフレキシブル基板３に一体に設けられているため、従来必要とした回路パターンの形成工程及びコネクタの搭載工程が不要になる。これにより、発光装置１の組立工程数を削減することができ、その組立作業の簡素化を図ることができる。 (2) Since the circuit patterns 3B and 3C and the contact 6 are integrally provided on the flexible substrate 3, a circuit pattern forming process and a connector mounting process which are conventionally required are not required. Thereby, the assembly process number of the light-emitting device 1 can be reduced, and the assembly operation can be simplified.
以上、本発明の発光装置を上記の実施の形態に基づいて説明したが、本発明は上記の実施の形態に限定されるものではなく、その要旨を逸脱しない範囲で種々の態様において実施することが可能であり、例えば次に示すような変形も可能である。 As mentioned above, although the light-emitting device of this invention was demonstrated based on said embodiment, this invention is not limited to said embodiment, It implements in a various aspect in the range which does not deviate from the summary. For example, the following modifications are possible.
（１）本実施の形態では、貫通孔５Ａ内に熱伝導性部材５Ｂを介してＬＥＤ素子を搭載する場合について説明したが、本発明はこれに限定されず、図５に示すように、フレキシブル基板３のＬＥＤ素子２の搭載部に回路パターン３Ｂ，３Ｃと同様の銅によりフレキシブル基板と一体に形成されたサーマルビア５１を設けてもよい。図５の場合、ＬＥＤ素子の寸法に応じて、単一のＬＥＤ素子２に対して複数のサーマルビア５１を設けている。 (1) In the present embodiment, the case where the LED element is mounted in the through hole 5A via the heat conductive member 5B has been described. However, the present invention is not limited to this, and as shown in FIG. A thermal via 51 formed integrally with the flexible substrate with copper similar to the circuit patterns 3B and 3C may be provided on the mounting portion of the LED element 2 of the substrate 3. In the case of FIG. 5, a plurality of thermal vias 51 are provided for a single LED element 2 in accordance with the dimensions of the LED element.
（２）本実施の形態では、フレキシブル基板３を放熱部材４の素子搭載側面（片面）に配置する場合について説明したが、本発明はこれに限定されず、図６に示すように放熱部材４の両面にそれぞれフレキシブル基板６１，６２を配置してもよい。この場合、フレキシブル基板６１，６２の各素子搭載側面にはＬＥＤ素子２（図１に示す）が搭載されている。 (2) In the present embodiment, the case where the flexible substrate 3 is arranged on the element mounting side surface (one side) of the heat radiating member 4 has been described. However, the present invention is not limited to this, and the heat radiating member 4 as shown in FIG. The flexible substrates 61 and 62 may be disposed on both sides of each. In this case, the LED element 2 (shown in FIG. 1) is mounted on each element mounting side surface of the flexible substrates 61 and 62.
（３）本実施の形態では、放熱部材４が矩形板によって形成されている場合について説明したが、本発明はこれに限定されず、図７（ａ）及び（ｂ）に示すように一方側に反るような曲面板７１Ａ，折曲板７１Ｂによって、また図７（ｃ）に示すようにジグザク状の折曲板７１Ｃによって、図７（ｄ）に示すように互いに直角な板部からなる折曲板７１Ｄによってそれぞれ放熱板を形成してもよい。この場合、フレキシブル基板３は、曲面板７１Ａ又は折曲板７１Ｂ〜７１Ｄの基板取付面（素子搭載側面）に適合する曲面板又は折曲板によって形成されている。 (3) In the present embodiment, the case where the heat radiating member 4 is formed of a rectangular plate has been described. However, the present invention is not limited to this, and one side as shown in FIGS. 7 (a) and (b). The curved plate 71A and the bent plate 71B warp each other, and the zigzag bent plate 71C as shown in FIG. 7 (c) comprises the plate portions perpendicular to each other as shown in FIG. 7 (d). A heat radiating plate may be formed by each of the bent plates 71D. In this case, the flexible substrate 3 is formed of a curved plate or a bent plate that matches the substrate mounting surface (element mounting side surface) of the curved plate 71A or the bent plates 71B to 71D.
（４）本実施の形態では、ＬＥＤ素子２が紫外線ＬＥＤ素子である場合について説明したが、本発明はこれに限定されず、可視光を発するＬＥＤ素子であってもよい。この場合、ＬＥＤ素子から発せられる色光を受けて励起されることにより波長変換光を発する蛍光体板を備えた発光装置であっても何等差し支えない。 (4) In the present embodiment, the case where the LED element 2 is an ultraviolet LED element has been described. However, the present invention is not limited to this, and may be an LED element that emits visible light. In this case, there is no problem even if the light emitting device includes a phosphor plate that emits wavelength-converted light by receiving and exciting color light emitted from the LED element.
１…発光装置、２…ＬＥＤ素子、３，６１，６２…フレキシブル基板、３Ａ…基部材、３Ｂ，３Ｃ…回路パターン、４…放熱部材、５Ａ…貫通孔、５Ｂ…熱伝導性部材、６…ＦＦＣ端子（コンタクト）、８…封止部材、１２，１３…ワイヤ、１０…パッド電極、１１…ｎ側電極、１２，１３…ワイヤ、２４…サファイア基板、２５…ＡｌＮバッファ層、２６…ｎ−ＧａＮ層、２７…発光層、２８…ｐ−ＧａＮ層、２９…透明電極、３０…保護膜、５１…サーマルビア、７１Ａ…曲面板、７１Ｂ〜７１Ｄ…折曲板 DESCRIPTION OF SYMBOLS 1 ... Light-emitting device, 2 ... LED element, 3, 61, 62 ... Flexible substrate, 3A ... Base member, 3B, 3C ... Circuit pattern, 4 ... Heat radiation member, 5A ... Through-hole, 5B ... Thermally conductive member, 6 ... FFC terminal (contact), 8 ... sealing member, 12, 13 ... wire, 10 ... pad electrode, 11 ... n-side electrode, 12, 13 ... wire, 24 ... sapphire substrate, 25 ... AlN buffer layer, 26 ... n- GaN layer, 27 ... light emitting layer, 28 ... p-GaN layer, 29 ... transparent electrode, 30 ... protective film, 51 ... thermal via, 71A ... curved plate, 71B-71D ... bent plate
Claims (6)
前記発光素子に接続する回路パターン及び前記回路パターンに接続する外部接続用のコンタクトを有する基板と、
前記基板に取り付けられ、前記発光素子による発生熱を放散する放熱部材とを備え、
前記放熱部材と前記発光素子とは熱伝導性部材を介して熱的に接続されていることを特徴とする発光装置。 A light emitting element;
A substrate having a circuit pattern connected to the light emitting element and an external connection contact connected to the circuit pattern;
A heat dissipating member attached to the substrate and dissipating heat generated by the light emitting element;
The light-emitting device, wherein the heat radiating member and the light-emitting element are thermally connected via a heat conductive member.
前記基板は、前記放熱部材の基板取付面に適合する曲面板又は折曲板によって形成されていることを特徴とする請求項１に記載の発光装置。 The heat dissipation member is formed of a curved plate or a bent plate,
The light-emitting device according to claim 1, wherein the substrate is formed of a curved plate or a bent plate that matches a substrate mounting surface of the heat radiating member.
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| WO2009090972A1 (en) * | 2008-01-16 | 2009-07-23 | Showa Denko K.K. | Light source, light emitting device, and display device |
| JP2011096991A (en) * | 2009-10-29 | 2011-05-12 | Samsung Electro-Mechanics Co Ltd | Light-emitting element package and method for manufacturing the same |
| WO2011077778A1 (en) * | 2009-12-24 | 2011-06-30 | 日本メクトロン株式会社 | Lighting device and process for production thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| WO2009090972A1 (en) * | 2008-01-16 | 2009-07-23 | Showa Denko K.K. | Light source, light emitting device, and display device |
| JP2009170672A (en) * | 2008-01-16 | 2009-07-30 | Showa Denko Kk | Light source, light emitting device, and display |
| JP2011096991A (en) * | 2009-10-29 | 2011-05-12 | Samsung Electro-Mechanics Co Ltd | Light-emitting element package and method for manufacturing the same |
| WO2011077778A1 (en) * | 2009-12-24 | 2011-06-30 | 日本メクトロン株式会社 | Lighting device and process for production thereof |
| JP2011134874A (en) * | 2009-12-24 | 2011-07-07 | Nippon Mektron Ltd | Lighting device and method of manufacturing the same |
| US8562177B2 (en) | 2009-12-24 | 2013-10-22 | Nippon Mektron, Ltd. | Lighting device with LEDs mounted on flexible circuit board self maintained in bellows shape and manufacturing method thereof |
| JP2014090170A (en) * | 2012-10-29 | 2014-05-15 | Lsi Corp | Low inductance flex bond with low thermal resistance |
| WO2014115443A1 (en) * | 2013-01-24 | 2014-07-31 | シャープ株式会社 | Electronic device and method for producing same |
| US9192049B2 (en) | 2014-01-14 | 2015-11-17 | Shinko Electric Industries Co., Ltd. | Wiring substrate and semiconductor package |
| CN104900781A (en) * | 2014-03-05 | 2015-09-09 | 晶元光电股份有限公司 | light emitting device |
| CN104538536A (en) * | 2014-12-17 | 2015-04-22 | 陕西科技大学 | Integrated LED plant growth lamp and manufacturing method thereof |
| JP2015079994A (en) * | 2015-01-09 | 2015-04-23 | シャープ株式会社 | Light-emitting device and luminaire |
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