JP6402890B2 - Light emitting device and manufacturing method thereof - Google Patents

Light emitting device and manufacturing method thereof Download PDF

Info

Publication number
JP6402890B2
JP6402890B2 JP2014043618A JP2014043618A JP6402890B2 JP 6402890 B2 JP6402890 B2 JP 6402890B2 JP 2014043618 A JP2014043618 A JP 2014043618A JP 2014043618 A JP2014043618 A JP 2014043618A JP 6402890 B2 JP6402890 B2 JP 6402890B2
Authority
JP
Japan
Prior art keywords
light emitting
conductive member
wire
emitting element
emitting device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2014043618A
Other languages
Japanese (ja)
Other versions
JP2015170679A (en
Inventor
宏明 宇川
宏明 宇川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nichia Corp
Original Assignee
Nichia Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nichia Corp filed Critical Nichia Corp
Priority to JP2014043618A priority Critical patent/JP6402890B2/en
Publication of JP2015170679A publication Critical patent/JP2015170679A/en
Application granted granted Critical
Publication of JP6402890B2 publication Critical patent/JP6402890B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Led Device Packages (AREA)

Description

本発明は、発光装置およびその製造方法に関する。   The present invention relates to a light emitting device and a method for manufacturing the same.

発光ダイオード又はレーザーダイオードのような発光素子を用いた発光装置は、室内照明等の一般照明、車載照明、液晶ディスプレイのバックライト等を含む多くの分野で用いられている。これらの発光装置で求められる性能は日増しに高まっており、更なる高出力（高輝度）、低コストの発光ダイオードが要求されている。
また、発光装置には用途により異なる仕様の発光ダイオードが求められ、種々のタイプの発光ダイオードが提供されている。 Light-emitting devices using light-emitting elements such as light-emitting diodes or laser diodes are used in many fields including general lighting such as room lighting, in-vehicle lighting, and backlights for liquid crystal displays. The performance demanded of these light emitting devices is increasing day by day, and there is a demand for light emitting diodes with higher output (high luminance) and lower cost.
Also, light emitting diodes with different specifications are required for light emitting devices, and various types of light emitting diodes are provided.

例えば、白色の発光ダイオードとして、青色発光ダイオードと黄色蛍光体（ＹＡＧ蛍光体等）とを組み合わせた発光装置が用いられている。発光ダイオードは、発光ダイオードの成長基板側を実装面とし、発光ダイオードの電極と配線基板とをワイヤで接続するフェイスアップ実装、又は半導体層側を実装面とするフリップチップ実装によって配線基板に実装され、蛍光体を含む樹脂等で被覆されることで、発光装置が構成される。   For example, as a white light emitting diode, a light emitting device in which a blue light emitting diode and a yellow phosphor (such as a YAG phosphor) are combined is used. The light emitting diode is mounted on the wiring board by face-up mounting in which the growth substrate side of the light emitting diode is the mounting surface and the electrodes of the light emitting diode and the wiring board are connected by wires, or flip chip mounting in which the semiconductor layer side is the mounting surface. The light emitting device is configured by being coated with a resin containing a phosphor.

ここで、発光ダイオードはサブマウントと呼ばれる台座上に配置されることがある。特許文献１では、基板上のサブマウントと、サブマウント上にフェイスアップ実装された半導体発光素子と、サブマウントと半導体発光素子の周囲に設けられたリフレクタとを有する半導体発光装置が開示されている。この半導体発光装置では、半導体発光素子の中心を通る基板に垂直な断面において、サブマウント、発光素子、リフレクタの位置及び形状を規定することで、光取り出し効率を改良し、高出力の発光装置を提供することを目的としている。なお、サブマウントは、シリコン、ＧａＰ、ＧａＡｓ等の半導体基板や、ガラス、サファイア等の透明基板、導電性材料等で形成することができる。   Here, the light emitting diode may be arranged on a pedestal called a submount. Patent Document 1 discloses a semiconductor light emitting device including a submount on a substrate, a semiconductor light emitting element face-up mounted on the submount, and a reflector provided around the submount and the semiconductor light emitting element. . In this semiconductor light-emitting device, the position and shape of the submount, light-emitting element, and reflector are defined in a cross section perpendicular to the substrate passing through the center of the semiconductor light-emitting element, thereby improving the light extraction efficiency and providing a high-output light-emitting device. It is intended to provide. The submount can be formed of a semiconductor substrate such as silicon, GaP, or GaAs, a transparent substrate such as glass or sapphire, a conductive material, or the like.

特開２００７−１８４３１９号公報JP 2007-184319 A

しかしながら、導電性材料からなるサブマウント上に半導体発光素子をフェイスアップ実装する場合、半導体発光素子と基板とを接続するワイヤがサブマウントに接触することで、半導体発光装置がショートする恐れがあった。   However, when a semiconductor light emitting element is mounted face-up on a submount made of a conductive material, the semiconductor light emitting device may be short-circuited when a wire connecting the semiconductor light emitting element and the substrate contacts the submount. .

そこで、本発明は、ショートが発生しにくい信頼性の高い発光装置を提供することを目的とする。さらに、発光装置のショートを防止する絶縁部材を部分的に形成することで、材料コストを削減し、発光素子からの出射光の吸収を抑えた発光装置を提供することを目的とする。
また、絶縁部材を所望の位置に容易に形成することができる発光装置の製造方法を提供することを目的とする。 In view of the above, an object of the present invention is to provide a highly reliable light-emitting device in which a short circuit is unlikely to occur. It is another object of the present invention to provide a light-emitting device in which an insulating member for preventing a short circuit of the light-emitting device is partially formed to reduce material costs and suppress absorption of light emitted from the light-emitting element.
It is another object of the present invention to provide a method for manufacturing a light emitting device that can easily form an insulating member at a desired position.

上記課題を解決するため、本発明に係る発光装置は、
発光素子と、
正又は負の第１の導電部材と、
前記発光素子が実装される正又は負の他方の第２の導電部材と、
前記発光素子と、前記第１の導電部材とを接続する第１のワイヤと、
前記発光素子と、前記第１の導電部材及び第２の導電部材の少なくとも一部とを被覆する封止部材と、を備え、
前記第２の導電部材は、断面視において前記第１のワイヤで接続されるワイヤボンディング点を結ぶ仮想直線よりも上方に突出する突出部を有し、
前記突出部の上面又は側面は、絶縁部材で被覆されることを特徴とする。 In order to solve the above problems, a light-emitting device according to the present invention includes:
A light emitting element;
A positive or negative first conductive member;
A positive or negative second conductive member on which the light emitting element is mounted;
A first wire connecting the light emitting element and the first conductive member;
A sealing member that covers the light emitting element and at least a part of the first conductive member and the second conductive member;
The second conductive member has a protruding portion that protrudes upward from a virtual straight line connecting the wire bonding points connected by the first wire in a cross-sectional view,
An upper surface or a side surface of the protrusion is covered with an insulating member.

また、本発明に係る発光装置は、
発光素子と、
発光素子が実装される素子載置部材と、
前記素子載置部材とそれぞれ離間した正又は負の第１の導電部材と、正又は負の他方の第２の導電部材と、
前記発光素子と前記第１の導電部材とを接続する第１のワイヤと、前記発光素子と前記第２の導電部材とを接続する第２のワイヤと、
前記発光素子と、前記素子載置部材と、前記第１の導電部材及び第２の導電部材の少なくとも一部とを被覆する封止部材と、を備え、
前記素子載置部材は、断面視において、前記第１のワイヤで接続されるワイヤボンディング点を結ぶ仮想直線、及び前記第２のワイヤで接続されるワイヤボンディング点を結ぶ仮想直線よりも上方に突出する突出部を有し、
前記突出部の上面又は側面は、絶縁部材で被覆されることを特徴とする。 Moreover, the light emitting device according to the present invention includes:
A light emitting element;
An element mounting member on which the light emitting element is mounted;
A positive or negative first conductive member spaced apart from the element mounting member, and the other positive or negative second conductive member;
A first wire that connects the light emitting element and the first conductive member; a second wire that connects the light emitting element and the second conductive member;
A sealing member that covers the light emitting element, the element mounting member, and at least a part of the first conductive member and the second conductive member;
The element mounting member protrudes above a virtual straight line connecting wire bonding points connected by the first wire and a virtual straight line connecting wire bonding points connected by the second wire in a sectional view. Having a protrusion to
An upper surface or a side surface of the protrusion is covered with an insulating member.

また、本発明に係る発光装置の製造方法は、
発光素子と、正又は負の第１の導電部材と、前記発光素子が実装される正又は負の他方の第２の導電部材と、前記発光素子と前記第１の導電部材とを接続する第１のワイヤと、前記発光素子と前記第１の導電部材及び第２の導電部材の少なくとも一部とを被覆する封止部材と、を備える発光装置の製造方法において、
断面視において、前記第１のワイヤで接続されるワイヤボンディング点を結ぶ仮想直線よりも上方に突出する突出部が形成された前記第２の導電部材を準備する第１の工程と、
前記突出部の上面又は側面を絶縁部材で被覆する第２の工程と、
前記第２の工程の後、前記第１のワイヤが、前記絶縁部材の上方を跨ぐように、前記発光素子と前記第１の導電部材とを接続する第３の工程と、を有することを特徴とする。 In addition, a method for manufacturing a light emitting device according to the present invention includes:
A light emitting element, a positive or negative first conductive member, a positive or negative second conductive member on which the light emitting element is mounted, and a first connecting the light emitting element and the first conductive member. In a method for manufacturing a light emitting device, comprising: 1 wire; and a sealing member that covers the light emitting element and at least a part of the first conductive member and the second conductive member.
A first step of preparing the second conductive member formed with a protruding portion protruding upward from a virtual straight line connecting wire bonding points connected by the first wire in a cross-sectional view;
A second step of covering an upper surface or a side surface of the protrusion with an insulating member;
After the second step, the third wire includes a third step of connecting the light emitting element and the first conductive member so that the first wire straddles over the insulating member. And

本発明に係る発光装置によれば、ショートが発生しにくい信頼性の高い発光装置を提供することができる。さらに、発光装置のショートを防止する絶縁部材を部分的に形成することで、材料コストを削減し、発光素子からの出射光の吸収を抑えた発光装置を提供することができる。
また、絶縁部材を所望の位置に容易に形成可能な発光装置の製造方法を提供することができる。 According to the light emitting device of the present invention, it is possible to provide a highly reliable light emitting device in which a short circuit is unlikely to occur. Furthermore, by partially forming an insulating member that prevents a short circuit of the light-emitting device, a light-emitting device in which material cost is reduced and absorption of light emitted from the light-emitting element is suppressed can be provided.
In addition, it is possible to provide a method for manufacturing a light emitting device in which an insulating member can be easily formed at a desired position.

図１は、本発明の実施形態１に係る発光装置１００Ａの構成を示す斜視図である。FIG. 1 is a perspective view showing a configuration of a light emitting device 100A according to Embodiment 1 of the present invention. 図２は、本発明の実施形態１に係る発光装置１００Ａの構成を示す上面図である。FIG. 2 is a top view showing the configuration of the light emitting device 100A according to Embodiment 1 of the present invention. 図３（ａ）は、本発明の実施形態１に係る発光装置１００Ａの構成を示す断面図である。図３（ｂ）は、図３（ａ）における突出部付近の部分拡大図である。図３（ｃ）〜（ｄ）は、図３（ｂ）の突出部と異なる形状の突出部を例示する部分拡大図である。FIG. 3A is a cross-sectional view showing the configuration of the light emitting device 100A according to Embodiment 1 of the present invention. FIG. 3B is a partially enlarged view of the vicinity of the protruding portion in FIG. FIGS. 3C to 3D are partial enlarged views illustrating protrusions having shapes different from the protrusions in FIG. 図４は、本発明の実施形態１に係る発光装置１００Ｂの構成を示すものであり、発光素子が素子載置部材に実装される場合の断面図である。FIG. 4 shows a configuration of the light-emitting device 100B according to Embodiment 1 of the present invention, and is a cross-sectional view when a light-emitting element is mounted on an element mounting member. 図５（ａ）及び図５（ｂ）は、本発明の実施形態１に係る発光装置の構成を示す断面図及び突出部付近の部分拡大図である。FIGS. 5A and 5B are a cross-sectional view and a partially enlarged view of the vicinity of the protruding portion showing the configuration of the light-emitting device according to Embodiment 1 of the present invention. 図６は、本発明の実施形態１に係る発光装置の構成を示す断面図であり、突出部付近の部分拡大図である。FIG. 6 is a cross-sectional view showing the configuration of the light emitting device according to Embodiment 1 of the present invention, and is a partially enlarged view in the vicinity of the protrusion. 図７は、本発明の実施形態１に係る発光装置１００Ａにおいて、突出部の上面を被覆する絶縁部材の位置と厚みの関係について示す部分拡大図である。FIG. 7 is a partially enlarged view showing the relationship between the position and thickness of the insulating member covering the upper surface of the protruding portion in the light emitting device 100A according to Embodiment 1 of the present invention. 図８は、本発明の実施形態１に係る発光装置１００Ａの製造方法において、第１の工程について示す斜視図である。FIG. 8 is a perspective view showing the first step in the method for manufacturing the light emitting device 100A according to Embodiment 1 of the present invention. 図９は、本発明の実施形態１に係る発光装置１００Ａの製造方法において、第２の工程について示す斜視図である。FIG. 9 is a perspective view showing the second step in the method for manufacturing the light emitting device 100A according to Embodiment 1 of the present invention. 図１０は、本発明の実施形態１に係る発光装置１００Ａの製造方法において、第３の工程について示す斜視図である。FIG. 10 is a perspective view showing a third step in the method for manufacturing the light emitting device 100A according to Embodiment 1 of the present invention. 図１１は、本発明の実施形態２に係る発光装置２００の構成を示す断面図である。FIG. 11 is a cross-sectional view showing a configuration of a light emitting device 200 according to Embodiment 2 of the present invention. 図１２（ａ）及び図１２（ｂ）は、本発明の実施形態２に係る発光装置２００の製造方法において、第２の工程について示す断面図である。12 (a) and 12 (b) are cross-sectional views illustrating the second step in the method for manufacturing the light emitting device 200 according to Embodiment 2 of the present invention. 図１３（ａ）及び図１３（ｂ）は、本発明の実施形態２に係る発光装置の構成を示す断面図であり、第２の工程後の絶縁部材の形状について例示している。FIGS. 13A and 13B are cross-sectional views illustrating the configuration of the light-emitting device according to Embodiment 2 of the present invention, illustrating the shape of the insulating member after the second step. 図１４（ａ）〜（ｄ）は、本発明の実施形態２に係る発光装置の構成を示す上面図である。図１４（ｅ）は、図１４（ａ）に係る第２の工程について示す断面図であり、図１４(ｆ)は、図１４（ｄ）の第２の工程後の断面図である。なお、図１４（ａ）〜（ｄ）は封止部材形成前の上面図である。14A to 14D are top views showing the configuration of the light-emitting device according to Embodiment 2 of the present invention. FIG. 14E is a cross-sectional view showing the second step according to FIG. 14A, and FIG. 14F is a cross-sectional view after the second step of FIG. 14D. 14A to 14D are top views before the sealing member is formed. 図１５は、本発明の実施形態３に係る発光装置３００の構成を示す断面図である。FIG. 15 is a cross-sectional view illustrating a configuration of a light emitting device 300 according to Embodiment 3 of the present invention. 図１６（ａ）〜（ｃ）は、本発明の実施形態３に係る発光装置の断面図であり、図１５の絶縁部材と異なる形状の絶縁部材を例示する部分拡大図である。16A to 16C are cross-sectional views of the light emitting device according to the third embodiment of the invention, and are partial enlarged views illustrating an insulating member having a shape different from that of the insulating member in FIG. 図１７（ａ）及び図１７（ｄ）は、本発明の実施形態４に係る発光装置４００の構成を示す断面図である。図１７（ｂ）及び図１７（ｃ）は、図１７（ａ）の絶縁部材と異なる形状の絶縁部材を例示する部分拡大図である。図１７（ｅ）は、図１７（ｄ）の絶縁部材と異なる形状の絶縁部材を例示する部分拡大図である。17 (a) and 17 (d) are cross-sectional views showing the configuration of the light emitting device 400 according to Embodiment 4 of the present invention. FIG. 17B and FIG. 17C are partially enlarged views illustrating an insulating member having a shape different from that of the insulating member in FIG. FIG. 17E is a partially enlarged view illustrating an insulating member having a shape different from that of the insulating member in FIG.

以下、本発明を実施するための態様を、図面を参照しながら詳細に説明する。しかし、以下に示す態様は、本発明の技術的思想を具体化するための発光装置を例示するものであって、本発明を以下の実施形態に限定するものではない。また、実施形態に記載されている構成部品の寸法、材質、形状、その相対的配置等は、特定的な記載がない限り、本発明の範囲をそれのみに限定する趣旨ではなく、単なる例示にすぎない。なお、各図面が示す部材の大きさや位置関係等は、説明を明確にするために誇張していることがある。以下の説明では、必要に応じて特定の方向や位置を示す用語（例えば、「上」、「下」、「右」、「左」、「前」、「後」およびそれらの用語を含む別の用語）を用いるが、それらの用語の使用は発明の理解を容易にするためであって、それらの用語の意味によって本発明の技術的範囲が制限されることはない。なお、ワイヤボンディング点等が視認しやすいように、図面の断面図において発光素子間を接続するワイヤは省略している。   Hereinafter, embodiments for carrying out the present invention will be described in detail with reference to the drawings. However, the modes described below exemplify a light emitting device for embodying the technical idea of the present invention, and the present invention is not limited to the following embodiments. In addition, the dimensions, materials, shapes, relative arrangements, and the like of the components described in the embodiments are not intended to limit the scope of the present invention only to the mere illustration unless otherwise specified. Only. Note that the size, positional relationship, and the like of the members shown in each drawing may be exaggerated for clarity of explanation. In the following description, terms that indicate a specific direction or position as necessary (for example, “up”, “down”, “right”, “left”, “front”, “back”, and other terms including those terms) However, the use of these terms is to facilitate understanding of the invention, and the technical scope of the present invention is not limited by the meaning of these terms. Note that wires for connecting the light emitting elements are omitted in the cross-sectional view of the drawing so that wire bonding points and the like can be easily seen.

≪実施形態１≫
図１は、実施形態１の発光装置１００Ａの構成を示す斜視図である。また、図２は、実施形態１に係る発光装置１００Ａの構成を示す上面図であり、図３は、実施形態１に係る発光装置１００Ａの構成を示す断面図及び部分拡大図である。以下、図１〜３を参照しながら実施形態１に係る発光装置１００Ａの構成について説明する。
実施形態１の発光装置１００Ａは、第１の導電部材１１と、第２の導電部材１２と、第２の導電部材に設けられた突出部１２ａと、第２の導電部材１２上に実装された発光素子３と、発光素子３と第１の導電部材１１とを接続する第１のワイヤ４と、突出部の上面１２ｂを被覆する絶縁部材５と、発光素子３と第１の導電部材１１及び第２の導電部材１２の少なくとも一部とを被覆する封止部材６とを備える。封止部材６は、発光素子の上方を被覆する略ドーム状のレンズ部と、レンズ部の周囲で第１の導電部材１１及び第２の導電部材１２や、後述する支持基材等を被覆する鍔部とを有している。 Embodiment 1
FIG. 1 is a perspective view illustrating a configuration of a light emitting device 100A according to the first embodiment. 2 is a top view showing the configuration of the light emitting device 100A according to the first embodiment, and FIG. 3 is a cross-sectional view and a partially enlarged view showing the configuration of the light emitting device 100A according to the first embodiment. Hereinafter, the configuration of the light emitting device 100A according to the first embodiment will be described with reference to FIGS.
The light emitting device 100 </ b> A according to the first embodiment is mounted on the first conductive member 11, the second conductive member 12, the protrusion 12 a provided on the second conductive member, and the second conductive member 12. The light emitting element 3, the first wire 4 connecting the light emitting element 3 and the first conductive member 11, the insulating member 5 covering the upper surface 12b of the protrusion, the light emitting element 3, the first conductive member 11, and And a sealing member 6 that covers at least a part of the second conductive member 12. The sealing member 6 covers a substantially dome-shaped lens portion that covers the upper side of the light emitting element, and the first conductive member 11 and the second conductive member 12 around the lens portion, a support base material that will be described later, and the like. And has a buttocks.

発光装置１００Ａにおいて、第１の導電部材１１、第２の導電部材１２及び突出部１２ａは導電性を有する。突出部１２ａは、第２の導電部材１２の一部であり、断面視において第１のワイヤ４で接続される発光素子３のワイヤボンディング点Ｂと、第１の導電部材１１のワイヤボンディング点Ｂ’とを結ぶ仮想直線Ａよりも上方に突出してなる。仮想直線Ａは、発光素子３のワイヤボンディング点Ｂと、第１の導電部材１１のワイヤボンディング点Ｂ’とを最短距離で結ぶ直線であり、図３中に一点鎖線で示される。
実施形態１の絶縁部材５は、突出部１２ａの上面を被覆しており、少なくとも第１のワイヤ４と突出部１２ａとの間に形成される。 In the light emitting device 100A, the first conductive member 11, the second conductive member 12, and the protrusion 12a have conductivity. The protrusion 12 a is a part of the second conductive member 12, and the wire bonding point B of the light emitting element 3 connected by the first wire 4 and the wire bonding point B of the first conductive member 11 in a cross-sectional view. It protrudes above the virtual straight line A connecting “ The virtual straight line A is a straight line that connects the wire bonding point B of the light emitting element 3 and the wire bonding point B ′ of the first conductive member 11 with the shortest distance, and is indicated by a one-dot chain line in FIG.
The insulating member 5 of Embodiment 1 covers the upper surface of the protruding portion 12a, and is formed at least between the first wire 4 and the protruding portion 12a.

このように、突出部１２ａの上面１２ｂ（又は側面１２ｃ）が絶縁部材５で被覆されることで、第１のワイヤ４と、第１のワイヤ４と接触しやすい第２の導電部材１２の突出部１２ａとが直接接触することを防ぐことができ、発光装置のショートを防止することができる。ワイヤボンディング工程時に第１のワイヤ４が突出部１２ａと接触することを防止できるだけでなく、封止部材形成時にかかる圧力や、発光素子３から放出される光や熱によって発生する第１のワイヤ４の撓みによるショートも回避可能である。第１のワイヤ４の撓みとは、第１のワイヤ４が上下方向（第１の導電部材１１の方向）に振れることである。   As described above, the upper surface 12b (or the side surface 12c) of the projecting portion 12a is covered with the insulating member 5 so that the first wire 4 and the projecting second conductive member 12 that easily contacts the first wire 4 are projected. The direct contact with the portion 12a can be prevented, and a short circuit of the light emitting device can be prevented. Not only can the first wire 4 be prevented from coming into contact with the projecting portion 12a during the wire bonding process, but also the first wire 4 generated by the pressure applied during the formation of the sealing member, the light emitted from the light emitting element 3, and the heat. It is possible to avoid a short circuit due to the bending. The bending of the first wire 4 means that the first wire 4 swings in the vertical direction (the direction of the first conductive member 11).

なお、図４に示されるように、発光素子３が無極性の素子載置部材１３に実装される場合も同様に、発光装置のショートを防止する効果が得られる。図４に示される発光装置１００Ｂでは、素子載置部材１３に実装される発光素子３が、第１のワイヤ４及び第２のワイヤ７によって、正又は負の導電部材である第１の導電部材１１及び第２の導電部材１２と電気的に接続されている。なお、素子載置部材１３は、第１の導電部材１１及び第２の導電部材１２とは離間して配置される。
素子載置部材１３は、例えば、発光素子３で発生した熱を効率的に外部へ放出するための放熱部材とすることができる。この場合、突出部１３ａは、発光素子３のワイヤボンディング点Ｂと第１の導電部材１１のワイヤボンディング点Ｂ’とを結ぶ仮想直線Ａと、発光素子３のワイヤボンディング点Ｄと第２の導電部材１２のワイヤボンディング点Ｄ’とを結ぶ仮想直線Ｃよりも上方に突出する素子載置部材１３の一部である。このような構成とすることで、図４に示される発光装置１００Ｂが半田等の導電性接着剤で実装基板に接続される場合、発光装置１００Ｂの裏面に露出する第１の導電部材１１、第２の導電部材１２、素子連載部材１３、が半田等で電気的に接続されることがある。この場合、例えば、第１のワイヤ４と第１の導電部材１１（又は第２のワイヤ７と第２の導電部材１２）とが直接接触していると発光装置がショートしてしまうところ、絶縁部材５によって、突出部１３ａのうちいずれかの上面及び／又は側面が被覆されることで、発光装置のショートを防止することが可能である。なお、素子載置部材１３は、放熱部材でなくてもよく、突出部１３ａを有し、且つ発光装置の実装の際に、第１の導電部材１１及び／又は第２の導電部材１２と電気的に接続される可能性を有し、導電性を有する部材で形成されていれば、特に限定されない。図４に示される発光装置１００Ｂでは、第１の導電部材１１、第２の導電部材１２、素子載置部材１３が、発光装置の実装面において略同一面上に露出されているため、各々が電気的に接続されやすい構成となっている。
また、絶縁部材５は第２の導電部材１２の一部に設けられるため、少ない材料で形成することができ、材料コストが削減できる。さらに、発光素子３からの出射光の吸収も抑えることができる。 As shown in FIG. 4, when the light emitting element 3 is mounted on the non-polar element mounting member 13, the effect of preventing the light emitting device from being short-circuited can be obtained. In the light emitting device 100 </ b> B shown in FIG. 4, the first conductive member in which the light emitting element 3 mounted on the element mounting member 13 is a positive or negative conductive member by the first wire 4 and the second wire 7. 11 and the second conductive member 12 are electrically connected. Note that the element mounting member 13 is disposed separately from the first conductive member 11 and the second conductive member 12.
The element mounting member 13 can be, for example, a heat radiating member for efficiently releasing the heat generated in the light emitting element 3 to the outside. In this case, the protruding portion 13 a includes a virtual straight line A connecting the wire bonding point B of the light emitting element 3 and the wire bonding point B ′ of the first conductive member 11, and the wire bonding point D of the light emitting element 3 and the second conductive point. This is a part of the element mounting member 13 that protrudes above the virtual straight line C that connects the wire bonding point D ′ of the member 12. With such a configuration, when the light emitting device 100B shown in FIG. 4 is connected to the mounting substrate with a conductive adhesive such as solder, the first conductive member 11 exposed on the back surface of the light emitting device 100B, the first The two conductive members 12 and the element continuous members 13 may be electrically connected with solder or the like. In this case, for example, when the first wire 4 and the first conductive member 11 (or the second wire 7 and the second conductive member 12) are in direct contact with each other, the light emitting device is short-circuited. By covering the upper surface and / or the side surface of any one of the protrusions 13a with the member 5, it is possible to prevent a short circuit of the light emitting device. Note that the element mounting member 13 does not have to be a heat dissipation member, has a protruding portion 13a, and is electrically connected to the first conductive member 11 and / or the second conductive member 12 when the light emitting device is mounted. There is no particular limitation as long as it is formed of a member having electrical conductivity and having conductivity. In the light emitting device 100B shown in FIG. 4, the first conductive member 11, the second conductive member 12, and the element mounting member 13 are exposed on substantially the same surface on the mounting surface of the light emitting device. It is configured to be easily connected electrically.
Further, since the insulating member 5 is provided in a part of the second conductive member 12, it can be formed with a small amount of material, and the material cost can be reduced. Furthermore, the absorption of the emitted light from the light emitting element 3 can also be suppressed.

以下、実施形態１に係る発光装置１００について説明する。なお、実施形態１に係る発光装置１００Ｂについては、上面に発光素子３が実装される無極性の素子載置部材１３を有し、発光素子３が第１のワイヤ４及び第２のワイヤ７によって第１の導電部材１１及び第２の導電部材１２と接続されており、突出部１３ａが素子載置部材１３の一部であること以外は、発光装置１００Ａと略同じ構成とすることが可能であるため、適宜説明を省略し、主に発光装置１００Ａの各構成部材を参照して詳述する。
＜第１の導電部材１１、第２の導電部材１２＞
第１の導電部材１１は、発光素子３と電気的に接続されるものであり、外部から電力を供給させるための正又は負の電極として機能する。また、第２の導電部材１２は、発光素子３が実装されるものであり、発光素子３への通電に寄与しない無極性である場合と、通電に寄与する正又は負の電極とする場合と、いずれの形態をとることもできる。実施形態１では、第２の導電部材１２が、正又は負の電極として機能する場合について説明する。
明している。 Hereinafter, the light emitting device 100 according to Embodiment 1 will be described. The light emitting device 100B according to the first embodiment has a non-polar element mounting member 13 on which the light emitting element 3 is mounted on the upper surface, and the light emitting element 3 is formed by the first wire 4 and the second wire 7. Except for being connected to the first conductive member 11 and the second conductive member 12, and the protruding portion 13 a being a part of the element mounting member 13, it is possible to have substantially the same configuration as the light emitting device 100 </ b> A. Therefore, the description will be omitted as appropriate, and detailed description will be made mainly with reference to each component of the light emitting device 100A.
<First conductive member 11 and second conductive member 12>
The first conductive member 11 is electrically connected to the light emitting element 3 and functions as a positive or negative electrode for supplying electric power from the outside. The second conductive member 12 is mounted with the light emitting element 3 and has a non-polarity that does not contribute to energization of the light emitting element 3, and a case where the second conductive member 12 is a positive or negative electrode that contributes to energization. Any form can be taken. In the first embodiment, a case where the second conductive member 12 functions as a positive or negative electrode will be described.
I am clear.

本実施形態において、第１の導電部材１１及び第２の導電部材１２の下面は、発光装置１００Ａの下面に露出しており、発光装置１００Ａの外表面を形成している。第１の導電部材１１及び第２の導電部材１２の上面視における形状、大きさ等については、発光装置の大きさや実装される発光素子等の数や大きさ等に応じて任意に選択することができる。   In the present embodiment, the lower surfaces of the first conductive member 11 and the second conductive member 12 are exposed on the lower surface of the light emitting device 100A, and form the outer surface of the light emitting device 100A. The shape and size of the first conductive member 11 and the second conductive member 12 as viewed from above are arbitrarily selected according to the size of the light emitting device and the number and size of the light emitting elements to be mounted. Can do.

（第１の導電部材１１）
実施形態１の第１の導電部材１１は、図３（ａ）に示されるように、その上面に発光素子３と導通させるための第１のワイヤ４が接続されるワイヤボンディング点Ｂ’を有する。第１の導電部材１１の上面は、少なくとも該ワイヤボンディングに必要な面積を有していればよく、微細な凹凸や、溝、孔等を有していてもかまわない。また、封止部材６等との密着性等を考慮し、第１の導電部材１１の側面には、傾斜や下面から離間した突起が形成されていてもよい。 (First conductive member 11)
As shown in FIG. 3A, the first conductive member 11 of the first embodiment has a wire bonding point B ′ to which the first wire 4 for conducting the light emitting element 3 is connected on the upper surface. . The upper surface of the first conductive member 11 only needs to have at least an area necessary for the wire bonding, and may have fine irregularities, grooves, holes, and the like. Further, in consideration of adhesiveness with the sealing member 6 and the like, the side surface of the first conductive member 11 may be formed with a protrusion that is inclined or separated from the lower surface.

（第２の導電部材１２）
第２の導電部材１２の上面には、接着剤等によって発光素子３が実装される。接着剤は半田等の導電性接着剤、エポキシ樹脂やシリコーン樹脂等の絶縁性接着剤を適宜選択して用いることができる。実装された発光素子３のワイヤボンディング点Ｂと、第１の導電部材１１のワイヤボンディング点Ｂ’とが第１のワイヤ４によって接続されることで、発光素子３と第１の導電部材１１とが電気的に接続される。第２の導電部材１２には、さらに発光素子３と第２の導電部材１２とを導通させるための第２のワイヤ７が接続されるワイヤボンディング点が形成されていてもかまわない。第２の導電部材１２の側面には、第１の導電部材１１と同様に、傾斜や下面から離間した突起が形成されていてもよい。 (Second conductive member 12)
The light emitting element 3 is mounted on the upper surface of the second conductive member 12 with an adhesive or the like. As the adhesive, a conductive adhesive such as solder or an insulating adhesive such as epoxy resin or silicone resin can be appropriately selected and used. The wire bonding point B of the mounted light emitting element 3 and the wire bonding point B ′ of the first conductive member 11 are connected by the first wire 4, so that the light emitting element 3 and the first conductive member 11 are connected. Are electrically connected. The second conductive member 12 may further have a wire bonding point to which the second wire 7 for conducting the light emitting element 3 and the second conductive member 12 is connected. On the side surface of the second conductive member 12, as in the first conductive member 11, a protrusion that is inclined or separated from the lower surface may be formed.

第２の導電部材１２は、突出部１２ａを有する。突出部１２ａは、断面視において前述の発光素子３のワイヤボンディング点Ｂと、第１の導電部材１１のワイヤボンディング点Ｂ’とを結ぶ仮想直線Ａよりも上方に突出した第２の導電部材１２の一部である。すなわち、突出部１２ａは、仮想直線Ａよりも第１のワイヤ４側であって、かつ第１のワイヤ４の下方に存在し、少なくとも第１のワイヤ４が跨ぐ領域に形成される。したがって、突出部１２ａは、第２の導電部材１２において特に第１のワイヤ４と接触しやすい領域である。なお、仮想直線Ａ上に存在するものも突出部１２ａに含むこととする。
突出部１２ａは、断面視において、図３（ｂ）のように上面１２ｂと側面１２ｃとによって構成される。また、突出部１２ａが断面視において２以上の複数の面から構成される場合や、図３（ｃ）のように曲面からなる場合は、突出部１２ａのうち第１のワイヤ４と最も近い最接近部Ｐよりも上方にある面を上面１２ｂ、最接近部Ｐよりも下方にある面を側面１２ｃとする。突出部１２ａは図３（ｄ）のように切欠き形状を有していてもよく、複数形成されていてもかまわない。 The second conductive member 12 has a protruding portion 12a. The projecting portion 12 a is a second conductive member 12 projecting upward from a virtual straight line A connecting the wire bonding point B of the light emitting element 3 and the wire bonding point B ′ of the first conductive member 11 in a sectional view. Is part of. In other words, the protruding portion 12a is on the first wire 4 side of the imaginary straight line A and below the first wire 4, and is formed at least in a region across the first wire 4. Therefore, the protruding portion 12 a is a region that is particularly easy to contact with the first wire 4 in the second conductive member 12. In addition, what exists on the virtual straight line A shall also be included in the protrusion part 12a.
The protrusion 12a is constituted by an upper surface 12b and a side surface 12c as shown in FIG. Further, when the protrusion 12a is composed of two or more surfaces in a cross-sectional view, or when it is formed of a curved surface as shown in FIG. 3C, the closest of the protrusion 12a to the first wire 4 is the closest. A surface above the approaching portion P is referred to as an upper surface 12b, and a surface below the closest approaching portion P is referred to as a side surface 12c. The protrusion 12a may have a notch shape as shown in FIG. 3D, or a plurality of protrusions 12a may be formed.

図３に示されるように、実施形態１の第２の導電部材１２は、台座２Ａ（サブマウント）と、その周囲において台座２Ａよりも低い部分とを有し、発光素子３は台座２Ａの上面に実装される。そうすることで、台座２Ａを設けない場合と比較し、発光部を発光装置１００Ａの光出射面に対して近くすることができ、光の取り出しを向上させることができる。さらに、封止部材６の鍔部によって、発光素子３から側方に出射される光の取り出しが低下することを防止できる。   As shown in FIG. 3, the second conductive member 12 according to the first embodiment has a base 2A (submount) and a lower part around the base 2A, and the light emitting element 3 is an upper surface of the base 2A. To be implemented. By doing so, compared with the case where the pedestal 2A is not provided, the light emitting unit can be closer to the light emitting surface of the light emitting device 100A, and light extraction can be improved. Furthermore, the flange of the sealing member 6 can prevent the extraction of light emitted from the light emitting element 3 from the side from being lowered.

実施形態１の突出部１２ａは、図３（ｂ）に示されるように、台座２Ａの上面と側面からなる角２Ａ’付近であり、角２Ａ’は突出部１２ａのうち第１のワイヤ４と最も近い最接近部Ｐとなっている。このような構成とすると、発光素子３の実装面である台座２Ａの上面と、第１の導電部材１１上面のワイヤボンディング点Ｂ’との間に段差Ｓが形成される。この段差Ｓによって、第２の導電部材１２と第１のワイヤ４とが接触しやすい構成となっている。段差Ｓが大きいほど、第２の導電部材１２と第１のワイヤ４とが接触する可能性が高くなり、発光装置１００Ａのショートが発生しやすくなる。   As shown in FIG. 3B, the protruding portion 12a of the first embodiment is near the corner 2A ′ formed by the upper surface and the side surface of the base 2A, and the corner 2A ′ is connected to the first wire 4 of the protruding portion 12a. It is the closest closest part P. With such a configuration, a step S is formed between the upper surface of the base 2 </ b> A that is the mounting surface of the light emitting element 3 and the wire bonding point B ′ on the upper surface of the first conductive member 11. Due to the step S, the second conductive member 12 and the first wire 4 are easily in contact with each other. As the level difference S is larger, the possibility that the second conductive member 12 and the first wire 4 are in contact with each other increases, and a short circuit of the light emitting device 100A is likely to occur.

実施形態１の台座２Ａの上面視形状は略矩形であるが、少なくとも発光素子３が実装できる面積を有していれば、適宜所望の形状とすることができる。なお、実施形態１では、第１導電部材１１及び第２導電部材１２の下面が略同一面上に形成されて発光装置１００Ａ下面に露出しており、第１の導電部材１１と、第２の導電部材１２の台座周囲の厚みとが略同じである。このような構成とすると、台座２Ａの上面の発光素子３から放出された熱を、台座２Ａを介して外部に効果的に放熱させることができる。しかし、第１の導電部材１１及び第２の導電部材１２の下面の高さや厚みは、同じでも異なっていてもかまわない。
また、実施形態１では、第２の導電部材１２に形成された台座２Ａの角２Ａ’付近が突出部１２ａとなる形態を示したが、突出部１２ａは台座２Ａの角２Ａ’を含んでいなくてもよく、台座２Ａによるものでなくてもよい。その他の突出部１２ａの形態については、実施形態２〜４で詳述する。 The shape of the pedestal 2 </ b> A according to Embodiment 1 in a top view is substantially rectangular, but can have a desired shape as long as it has at least an area where the light emitting element 3 can be mounted. In the first embodiment, the lower surfaces of the first conductive member 11 and the second conductive member 12 are formed on substantially the same surface and exposed on the lower surface of the light emitting device 100A, and the first conductive member 11 and the second conductive member 11 are exposed. The thickness around the base of the conductive member 12 is substantially the same. With such a configuration, heat released from the light emitting element 3 on the upper surface of the base 2A can be effectively radiated to the outside through the base 2A. However, the height and thickness of the lower surfaces of the first conductive member 11 and the second conductive member 12 may be the same or different.
In the first embodiment, the shape in which the vicinity of the corner 2A ′ of the pedestal 2A formed on the second conductive member 12 is the protruding portion 12a is shown, but the protruding portion 12a does not include the corner 2A ′ of the pedestal 2A. It does not have to be based on the pedestal 2A. Other forms of the protrusion 12a will be described in detail in Embodiments 2 to 4.

第１の導電部材１１及び第２の導電部材１２は、導電性を有する材料で形成される。第１の導電部材１１と第２の導電部材１２とは同じ材料で形成されると好ましいが、異なる材料を用いてもかまわない。具体的な材料としては、銅、ニッケル、パラジウム、タングステン、クロム、チタン、アルミニウム、銀、金、鉄、又はこれらの合金等が挙げられる。特に、発光素子３からの出射光を反射可能な材料であると好ましく、導電部材の表面に、銀、アルミニウム、ロジウム、金、銅、又はこれらの合金等の光反射膜が設けられていてもよい。これらの被膜は、鍍金、蒸着、スパッタ、印刷、塗布等で設けることができる。なお、第１の導電部材１１及び第２の導電部材１２は、少なくとも第２の導電部材１２の突出部１２ａが導電性を有していれば、樹脂やセラミックス等の絶縁性材料で形成された支持基材を有していてもよい。   The first conductive member 11 and the second conductive member 12 are formed of a conductive material. The first conductive member 11 and the second conductive member 12 are preferably formed of the same material, but different materials may be used. Specific examples of the material include copper, nickel, palladium, tungsten, chromium, titanium, aluminum, silver, gold, iron, and alloys thereof. In particular, a material that can reflect the light emitted from the light emitting element 3 is preferable, and a light reflecting film such as silver, aluminum, rhodium, gold, copper, or an alloy thereof is provided on the surface of the conductive member. Good. These coatings can be provided by plating, vapor deposition, sputtering, printing, coating, or the like. The first conductive member 11 and the second conductive member 12 are made of an insulating material such as resin or ceramics as long as at least the protruding portion 12a of the second conductive member 12 has conductivity. You may have a support base material.

実施形態１における第１の導電部材１１及び第２の導電部材１２は、リードフレームで形成されている。リードフレームは、プレス、打ち抜き、折り曲げ、エッチング等の加工によって、台座２Ａや後述する凹部２Ｂを容易に形成できるので好ましい。リードフレームの厚みや形状等は、所望の発光装置の大きさや形状等を考慮して適宜調整することができる。台座２Ａは、前述のようにリードフレームを加工することで形成してもかまわないが、導電性を有する台座を別途形成し、第２の導電部材１２上に配置することで形成してもかまわない。
なお、第１の導電部材１１及び第２の導電部材１２はリードフレームに限らず、鍍金等で形成されたものでもかまわない。鍍金等で形成された導電部材は、リードフレームと比較して熱膨張が少ないため、熱によって支持基材や封止部材等と剥離しにくく好ましい。 The first conductive member 11 and the second conductive member 12 in the first embodiment are formed of a lead frame. The lead frame is preferable because the pedestal 2A and a recess 2B described later can be easily formed by processing such as pressing, punching, bending, and etching. The thickness, shape, etc. of the lead frame can be appropriately adjusted in consideration of the desired size, shape, etc. of the light emitting device. The pedestal 2A may be formed by processing the lead frame as described above, but may be formed by separately forming a conductive pedestal and disposing it on the second conductive member 12. Absent.
The first conductive member 11 and the second conductive member 12 are not limited to the lead frame, and may be formed by plating or the like. Since the conductive member formed by plating or the like has less thermal expansion than the lead frame, it is preferable that the conductive member is not easily peeled off from the support base material or the sealing member by heat.

＜発光素子３＞
第２の導電部材１２に実装される発光素子３は、少なくとも第１導電型（ｎ型）層と第２導電型（ｐ型）層により構成され、その間に活性層を有する半導体積層構造を有していると好ましい。また、発光素子３の電極は、絶縁性の基板上に半導体積層構造を積層し、その上面側に両極性の電極を有する同一面側電極構造、導電性の支持基材上に半導体積層構造を積層し、その積層方向である上下面に各極性の電極を有する対向電極構造とすることができる。本実施形態では、同一面側電極構造を有する発光素子３を用い、絶縁性の基板側を第２の導電部材１２と接着させ、ワイヤによって発光素子３のワイヤボンディング点Ｂと、第１の導電部材１１及び第２の導電部材１２のワイヤボンディング点とを各々電気的に接続させる。または、対向電極構造を有する発光素子を用い、発光素子の一方の電極面側を導電性接着剤によって第２の導電部材と接着させ、発光素子のワイヤボンディング点と、第１の導電部材のワイヤボンディング点とを接続させてもよい。なお、発光素子３の絶縁性の基板は除去してもよく、絶縁性の基板が除去された半導体積層構造に、例えば別の絶縁性の基板を接着した構造とすることもできる。基板の除去は、支持体、装置又はサブマウント等に実装又は保持して、剥離、研磨、若しくはＬＬＯ（Laser Lift Off）することで実施できる。 <Light emitting element 3>
The light-emitting element 3 mounted on the second conductive member 12 includes at least a first conductive type (n-type) layer and a second conductive type (p-type) layer, and has a semiconductor multilayer structure having an active layer therebetween. It is preferable. The electrode of the light-emitting element 3 is formed by laminating a semiconductor laminated structure on an insulating substrate, and having a bipolar electrode on the upper surface side of the same surface side electrode structure, and a semiconductor laminated structure on a conductive support substrate. It can be set as the counter electrode structure which laminates | stacks and has an electrode of each polarity on the upper and lower surfaces which are the lamination directions. In the present embodiment, the light emitting element 3 having the same surface side electrode structure is used, the insulating substrate side is bonded to the second conductive member 12, and the wire bonding point B of the light emitting element 3 and the first conductive member are bonded by a wire. The member 11 and the wire bonding point of the second conductive member 12 are electrically connected to each other. Alternatively, a light-emitting element having a counter electrode structure is used, and one electrode surface side of the light-emitting element is bonded to the second conductive member with a conductive adhesive, and the wire bonding point of the light-emitting element and the wire of the first conductive member A bonding point may be connected. Note that the insulating substrate of the light-emitting element 3 may be removed, or a structure in which, for example, another insulating substrate is bonded to the semiconductor stacked structure from which the insulating substrate is removed may be employed. The removal of the substrate can be carried out by mounting or holding on a support, device, submount or the like and peeling, polishing, or LLO (Laser Lift Off).

発光素子３は、任意の波長の光を出力する半導体発光素子であると好ましい。特に、ＧａＮ系化合物半導体を用いると、蛍光体を効率良く励起できる短波長の可視光や紫外光が発光可能である。具体的な発光ピーク波長は、約３００ｎｍ〜５６０ｎｍ、好ましくは約３８０ｎｍ〜４７０ｎｍである。なお、この他、ＺｎＳｅ系、ＩｎＧａＡｓ系、ＡｌＩｎＧａＰ系等の半導体発光素子を用いてもよい。
実装される発光素子３の数は１つでも複数でもよく、所望の発光を実現するために適宜自由に選択することができる。さらに、発光素子３の形状や大きさ等も特に限定されない。 The light emitting element 3 is preferably a semiconductor light emitting element that outputs light having an arbitrary wavelength. In particular, when a GaN-based compound semiconductor is used, visible light and ultraviolet light having a short wavelength that can excite the phosphor efficiently can be emitted. A specific emission peak wavelength is about 300 nm to 560 nm, preferably about 380 nm to 470 nm. In addition, semiconductor light emitting elements such as ZnSe, InGaAs, and AlInGaP may be used.
The number of the light emitting elements 3 to be mounted may be one or plural, and can be freely selected as appropriate in order to realize desired light emission. Further, the shape and size of the light emitting element 3 are not particularly limited.

＜絶縁部材５＞
絶縁部材５は、絶縁性の材料で形成され、前述の第２の導電部材１２の突出部１２ａの上面１２ｂ又は側面１２ｃの少なくとも一部を被覆する。絶縁部材５は、突出部１２ａの略全面を被覆していると、第２の導電部材１２と第１のワイヤ４との接触をより確実に防ぐことができ好ましいが、絶縁部材５によって突出部１２ａと第１のワイヤ４とが直接接触しないような位置に形成されていればよい。すなわち、絶縁部材５は、少なくとも第１のワイヤ４の下方の突出部１２ａ（突出部１２ａのうち第１のワイヤ４と対向する領域）を被覆している。 <Insulating member 5>
The insulating member 5 is made of an insulating material and covers at least a part of the upper surface 12b or the side surface 12c of the protruding portion 12a of the second conductive member 12 described above. It is preferable that the insulating member 5 covers substantially the entire surface of the protruding portion 12a, so that the contact between the second conductive member 12 and the first wire 4 can be more reliably prevented. What is necessary is just to be formed in the position where 12a and the 1st wire 4 do not contact directly. That is, the insulating member 5 covers at least the protruding portion 12a below the first wire 4 (the region of the protruding portion 12a that faces the first wire 4).

実施形態１では、台座２Ａの角２Ａ’付近が突出部１２ａであり、絶縁部材５は突出部１２ａの上面１２ｂを被覆している。このように、第２の導電部材１２のうち、第１のワイヤ４と特に接触しやすい突出部１２ａが絶縁部材５で被覆されることで、効果的に発光装置１００Ａのショートを防止することができる。さらに、少ない材料で絶縁部材５が形成できるので、材料コストを削減でき、絶縁部材５による発光素子３からの出射光の吸収を低減できる。   In the first embodiment, the vicinity of the corner 2A ′ of the base 2A is the protruding portion 12a, and the insulating member 5 covers the upper surface 12b of the protruding portion 12a. As described above, the protrusion 12a that is particularly easily in contact with the first wire 4 in the second conductive member 12 is covered with the insulating member 5, thereby effectively preventing the light emitting device 100A from being short-circuited. it can. Furthermore, since the insulating member 5 can be formed with a small amount of material, the material cost can be reduced, and the absorption of light emitted from the light emitting element 3 by the insulating member 5 can be reduced.

以下、突出部１２ａの上面１２ｂ、側面１２ｃを被覆する絶縁部材５について、各々説明する。
突出部１２ａの上面１２ｂを被覆する絶縁部材５は、突出部１２ａの側面１２ｃに近い側に形成されるほど好ましい。すなわち、実施形態１では台座２Ａの角２Ａ’側に設けられるほど好ましい。つまり、実施形態１では、上面１２ｂの絶縁部材５は、最接近部Ｐである台座２Ａの角２Ａ’を被覆していると、発光装置１００Ａのショートを回避しやすい。なお、上面１２ｂの絶縁部材５は角２Ａ’を被覆していなくてもよく、適宜厚みを調節し、突出部１２ａの上面１２ｂの少なくとも一部を被覆していれば、第２の導電部材１２と第１のワイヤ４の接触を回避することが可能である。 Hereinafter, each of the insulating members 5 covering the upper surface 12b and the side surface 12c of the protruding portion 12a will be described.
The insulating member 5 that covers the upper surface 12b of the protruding portion 12a is preferably formed on the side closer to the side surface 12c of the protruding portion 12a. That is, in Embodiment 1, it is so preferable that it is provided on the corner 2A ′ side of the base 2A. That is, in Embodiment 1, if the insulating member 5 on the upper surface 12b covers the corner 2A ′ of the base 2A that is the closest part P, it is easy to avoid a short circuit of the light emitting device 100A. The insulating member 5 on the upper surface 12b does not have to cover the corner 2A ′. If the thickness is adjusted appropriately and at least part of the upper surface 12b of the protruding portion 12a is covered, the second conductive member 12 is covered. It is possible to avoid contact between the first wire 4 and the first wire 4.

次に、突出部１２ａの側面１２ｃを被覆する絶縁部材５について説明する。突出部１２ａの側面１２ｃを被覆する絶縁部材５は、突出部１２ａの上面１２ｂに近い側に形成されるほど好ましい。特に、図５のように絶縁部材５が側面１２ｃのみに形成される場合は、絶縁部材５は突出部１２ａの上面１２ｂ以上の高さを有するように形成される。そうすることで、台座２Ａの角２Ａ’が被覆され、第２の導電部材１２と第１のワイヤ４とが直接接触しにくくなる。絶縁部材５が突出部１２ａの側面１２ｃのみに形成されると、発光素子３からの出射光が吸収されにくい構成とできる。すなわち、図５（ｂ）に示されるように、側面１２ｃを被覆する絶縁部材５を台座２Ａと略同じ高さとすることで、発光素子３から側方へ出射する光の取り出しを低下させることなく、発光装置１００Ａのショートを防止することが可能である。
以上、突出部１２ａの上面１２ｂ又は側面１２ｃを被覆する絶縁部材５について説明したが、絶縁部材５は突出部１２ａの上面１２ｂ及び側面１２ｃの両方を被覆していてもよい。両方を被覆する絶縁部材５については、実施形態２で詳述する。 Next, the insulating member 5 that covers the side surface 12c of the protruding portion 12a will be described. The insulating member 5 that covers the side surface 12c of the protruding portion 12a is preferably formed on the side closer to the upper surface 12b of the protruding portion 12a. In particular, when the insulating member 5 is formed only on the side surface 12c as shown in FIG. 5, the insulating member 5 is formed to have a height equal to or higher than the upper surface 12b of the protruding portion 12a. By doing so, the corner 2A ′ of the pedestal 2A is covered, and the second conductive member 12 and the first wire 4 are less likely to be in direct contact. When the insulating member 5 is formed only on the side surface 12c of the projecting portion 12a, the light emitted from the light emitting element 3 can be hardly absorbed. That is, as shown in FIG. 5B, by making the insulating member 5 covering the side surface 12c substantially the same height as the pedestal 2A, extraction of light emitted from the light emitting element 3 to the side is not reduced. It is possible to prevent a short circuit of the light emitting device 100A.
The insulating member 5 that covers the upper surface 12b or the side surface 12c of the protruding portion 12a has been described above. However, the insulating member 5 may cover both the upper surface 12b and the side surface 12c of the protruding portion 12a. The insulating member 5 covering both will be described in detail in the second embodiment.

絶縁部材５は突出部１２ａの少なくとも一部を被覆していれば、突出部１２ａ以外の第２の導電部材を被覆していてもよく、突出部１２ａ以外の台座２Ａの上面や側面を被覆していてもかまわない。なお、図６のように、突出部１２ａ以外の第２の導電部材を被覆する絶縁部材５も、その厚みや形状を調節することで、第２の導電部材１２と第１のワイヤ４とが直接接触することを防止する効果を有することは言うまでもない。   As long as the insulating member 5 covers at least a part of the protruding portion 12a, the insulating member 5 may cover the second conductive member other than the protruding portion 12a, and covers the upper surface and side surfaces of the base 2A other than the protruding portion 12a. It does not matter. As shown in FIG. 6, the insulating member 5 that covers the second conductive member other than the protruding portion 12a also has the second conductive member 12 and the first wire 4 adjusted by adjusting the thickness and shape thereof. Needless to say, it has the effect of preventing direct contact.

絶縁部材５は任意の厚み、形状で形成することができるが、以下特に好ましい絶縁部材５の厚みと配置の関係について説明する。
絶縁部材５の材料が樹脂である場合、絶縁部材５は突出部１２ａと第１のワイヤ４とを電気的に確実に絶縁するために、少なくとも約１０〜５０μｍ以上の厚みで形成されると好ましい。また、実施形態１では、ワイヤボンディング点Ｂ’側の絶縁部材５の上端部Ｑが、最接近部Ｐである角２Ａ’と、ワイヤボンディング点Ｂ’側の発光素子３の上端部とを結んだ仮想直線Ｙ以上の高さで形成されると、突出部１２ａと第１のワイヤ４との接触をさらに確実に防止することができる。仮想直線Ｙは、図７中に二点鎖線で示される。すなわち、実施形態１の突出部１２ａの上面１２ｂを被覆する絶縁部材５は、最接近部Ｐから遠い部分にあるほど厚い方が好ましい。同様に、上面１２ｂを被覆する絶縁部材５は、最接近部Ｐから近い部分にあるほど、厚みを薄くすることができる（図７参照）。絶縁部材５を薄く形成すると、材料コストの削減となり、さらに発光素子３からの出射光の吸収を抑えることができ好ましい。 Although the insulating member 5 can be formed in any thickness and shape, the relationship between the particularly preferable thickness and arrangement of the insulating member 5 will be described below.
When the material of the insulating member 5 is resin, it is preferable that the insulating member 5 is formed with a thickness of at least about 10 to 50 μm or more in order to electrically insulate the protruding portion 12a and the first wire 4 from each other. . In Embodiment 1, the upper end portion Q of the insulating member 5 on the wire bonding point B ′ side connects the corner 2A ′ that is the closest portion P and the upper end portion of the light emitting element 3 on the wire bonding point B ′ side. However, if the height is equal to or higher than the imaginary straight line Y, the contact between the protruding portion 12a and the first wire 4 can be prevented more reliably. The virtual straight line Y is indicated by a two-dot chain line in FIG. That is, it is preferable that the insulating member 5 covering the upper surface 12b of the protruding portion 12a of the first embodiment is thicker as it is located farther from the closest portion P. Similarly, the insulating member 5 covering the upper surface 12b can be made thinner as it is closer to the closest part P (see FIG. 7). Forming the insulating member 5 thin is preferable because it reduces the material cost and further suppresses the absorption of the emitted light from the light emitting element 3.

絶縁部材５の材料としては、樹脂が好ましく、シリコーン樹脂、エポキシ樹脂、フェノール樹脂、フッ素樹脂、ポリオレフィン樹脂、ポリノルボルネン樹脂、ＢＴレジン、ＰＰＡ、ＰＥＴ、ＰＢＴ等が挙げられる。特に、絶縁性、耐熱性及び耐光性に優れ、金属等の第２の導電部材１２との密着性が良好なシリコーン樹脂が好適に用いられる。なお、ガラス、無機物等を用いることもできる。具体的には、ガラス板、単結晶体、多結晶体、アモルファス体、セラミック体等が挙げられる。さらに、絶縁部材５は光反射性の高い白色系の部材であると好ましく、例えば、酸化亜鉛、酸化チタン、酸化アルミニウム、酸化ジルコニウム、酸化マグネシウム等の反射部材が添加されると特に好ましい。絶縁部材５には、その他の反射部材が添加されていてもよく、種々の機能を持つ粒子（例えば、拡散剤や着色剤など）を添加してもよい。具体的には、シリカ、炭酸マグネシウム、水酸化マグネシウム、炭酸カルシウム、水酸化カルシウム、珪酸カルシウム、チタン酸バリウム、酸化鉄、酸化クロム、酸化マンガン、ガラス、カーボンブラックなどが挙げられる。   The material of the insulating member 5 is preferably a resin, and examples thereof include silicone resin, epoxy resin, phenol resin, fluorine resin, polyolefin resin, polynorbornene resin, BT resin, PPA, PET, PBT and the like. In particular, a silicone resin that is excellent in insulation, heat resistance, and light resistance and has good adhesion to the second conductive member 12 such as metal is preferably used. In addition, glass, an inorganic substance, etc. can also be used. Specifically, a glass plate, a single crystal body, a polycrystal body, an amorphous body, a ceramic body, etc. are mentioned. Furthermore, the insulating member 5 is preferably a white member having high light reflectivity. For example, it is particularly preferable that a reflecting member such as zinc oxide, titanium oxide, aluminum oxide, zirconium oxide, or magnesium oxide is added. Other reflective members may be added to the insulating member 5, and particles having various functions (for example, a diffusing agent, a coloring agent, etc.) may be added. Specific examples include silica, magnesium carbonate, magnesium hydroxide, calcium carbonate, calcium hydroxide, calcium silicate, barium titanate, iron oxide, chromium oxide, manganese oxide, glass, and carbon black.

また、絶縁部材５には蛍光体を含有させてもよい。例えば、ユーロピウム、セリウム等のランタノイド系元素で主に賦活される窒化物系蛍光体・酸窒化物系蛍光体、より具体的には、ユーロピウムで賦活されたα又はβサイアロン型蛍光体、各種アルカリ土類金属窒化シリケート蛍光体、ユーロピウム等のランタノイド系元素、マンガン等の遷移金属系元素により主に賦活されるアルカリ土類金属ハロゲンアパタイト蛍光体、アルカリ土類のハロシリケート蛍光体、アルカリ土類金属シリケート蛍光体、アルカリ土類金属ホウ酸ハロゲン蛍光体、アルカリ土類金属アルミン酸塩蛍光体、アルカリ土類金属ケイ酸塩、アルカリ土類金属硫化物、アルカリ土類金属チオガレート、アルカリ土類金属窒化ケイ素、ゲルマン酸塩、セリウム等のランタノイド系元素で主に賦活される希土類アルミン酸塩、希土類ケイ酸塩又はユーロピウム等のランタノイド系元素で主に賦活される有機物及び有機錯体等が挙げられる。特に、青色発光素子と組み合わせることで白色に発光するＹＡＧ（Yttrium Aluminum Garnet）系蛍光体が好適に用いられる。また、赤色蛍光体であるＫＳＦ等も用いることができる。この他にも同様の性能、効果を有する蛍光体を適宜使用することができる。このように、発光素子３からの出射光の少なくとも一部を波長変換可能な蛍光体を含有していると、発光装置１００Ａを所望の発光色とできるので好ましい。
特に、絶縁部材５をシート状樹脂とする場合、蛍光体はシート状樹脂中に含有させることができるほか、例えば２枚または２枚以上の複数のシート状樹脂を準備し、それらのシート状樹脂の間に挟むことができる。そうすることで、熱に比較的弱い蛍光体等を用いても、発光素子からの熱で劣化することを緩和することが可能である。 Further, the insulating member 5 may contain a phosphor. For example, nitride phosphors and oxynitride phosphors mainly activated by lanthanoid elements such as europium and cerium, more specifically, α or β sialon phosphors activated by europium, various alkalis Earth metal nitride silicate phosphors, lanthanoid elements such as europium, alkaline earth metal halogenapatite phosphors mainly activated by transition metal elements such as manganese, alkaline earth halosilicate phosphors, alkaline earth metals Silicate phosphor, alkaline earth metal halogen borate phosphor, alkaline earth metal aluminate phosphor, alkaline earth metal silicate, alkaline earth metal sulfide, alkaline earth metal thiogallate, alkaline earth metal nitride Rare earth aluminate mainly activated by lanthanoid elements such as silicon, germanate, cerium, Examples thereof include organic substances and organic complexes mainly activated with lanthanoid elements such as rare earth silicates or europium. In particular, a YAG (Yttrium Aluminum Garnet) phosphor that emits white light when combined with a blue light emitting element is preferably used. Moreover, KSF etc. which are red fluorescent substance can also be used. In addition, phosphors having similar performance and effects can be used as appropriate. As described above, it is preferable to include a phosphor capable of converting the wavelength of at least a part of the light emitted from the light emitting element 3 because the light emitting device 100A can have a desired emission color.
In particular, when the insulating member 5 is a sheet-like resin, the phosphor can be contained in the sheet-like resin. For example, two or more sheet-like resins are prepared, and those sheet-like resins are prepared. Can be sandwiched between. By doing so, it is possible to mitigate deterioration due to heat from the light emitting element even if a phosphor or the like that is relatively weak against heat is used.

＜封止部材６＞
封止部材６は、発光素子３を被覆すると共に、第１の導電部材１１及び第２の導電部材１２の少なくとも一部を被覆するように設けられ、発光素子３やワイヤ４，７等を塵芥や水分、外力等から保護する。封止部材６は、複数の層で構成されていてもよい。複数の層で構成される封止部材６については、実施形態４で詳述する。 <Sealing member 6>
The sealing member 6 covers the light emitting element 3 and is provided so as to cover at least a part of the first conductive member 11 and the second conductive member 12. Protect from moisture, external force, etc. The sealing member 6 may be composed of a plurality of layers. The sealing member 6 composed of a plurality of layers will be described in detail in Embodiment 4.

封止部材６は、例えばトランスファー成形等で形成することができる。封止部材６（封止部材６が複数の層で構成される場合は、最も外側の封止部材）をトランスファー成形により任意の形状に形成すると、所望の指向特性を実現できるので好ましい。なお、封止部材６の形成はトランスファー成形に限定されるものではなく、滴下法等で形成してもよい。   The sealing member 6 can be formed by, for example, transfer molding. It is preferable to form the sealing member 6 (the outermost sealing member in the case where the sealing member 6 is composed of a plurality of layers) into an arbitrary shape by transfer molding because desired directivity can be realized. The formation of the sealing member 6 is not limited to transfer molding, and may be formed by a dropping method or the like.

封止部材６の材料としては、透光性を有する樹脂が好ましく、シリコーン樹脂、エポキシ樹脂、フェノール樹脂、ポリカーボネート樹脂、アクリル樹脂、ＴＰＸ樹脂、ポリノルボルネン樹脂、又はこれらの樹脂を１種類以上含むハイブリッド樹脂等が好適に用いられ、ガラスでもかまわない。特に、シリコーン樹脂は、耐熱性や耐光性に優れるので好ましい。封止部材６には、拡散剤、着色剤、蛍光体等、種々の機能を持つ粒子が添加されてもよい。具体的には、シリカ、酸化チタン、酸化マグネシウム、炭酸マグネシウム、水酸化マグネシウム、炭酸カルシウム、水酸化カルシウム、珪酸カルシウム、酸化亜鉛、チタン酸バリウム、酸化アルミニウム、酸化鉄、酸化クロム、酸化マンガン、ガラス、カーボンブラックなどが挙げられる。蛍光体としては、前述のものを使用することができ、封止部材中だけでなく各部材どうしの間等に適宜設けてもよく、沈降させてもかまわない。   The material of the sealing member 6 is preferably a translucent resin, such as a silicone resin, an epoxy resin, a phenol resin, a polycarbonate resin, an acrylic resin, a TPX resin, a polynorbornene resin, or a hybrid containing at least one of these resins. Resin or the like is preferably used, and glass may be used. In particular, a silicone resin is preferable because it is excellent in heat resistance and light resistance. Particles having various functions such as a diffusing agent, a colorant, and a phosphor may be added to the sealing member 6. Specifically, silica, titanium oxide, magnesium oxide, magnesium carbonate, magnesium hydroxide, calcium carbonate, calcium hydroxide, calcium silicate, zinc oxide, barium titanate, aluminum oxide, iron oxide, chromium oxide, manganese oxide, glass And carbon black. As the phosphor, the above-mentioned phosphors can be used, and they may be appropriately provided not only in the sealing member but also between the members, or may be allowed to settle.

＜ワイヤ＞
実施形態１の発光装置１００Ａは、発光素子３と第１の導電部材１１とを電気的に接続する第１のワイヤ４と、発光素子３と第２の導電部材１２とを電気的に接続する第２のワイヤ７とを有する。対向電極構造を有する発光素子３を用いる場合は、第２のワイヤ７は有していなくてもよい。なお、図面中の断面図では発光素子３間を接続するワイヤは省略する。
ワイヤの材料としては、金、銅、銀、白金、アルミニウム又はこれらの合金の金属線を用いることができる。特に、封止部材６からの応力で破断が生じにくく、熱抵抗等に優れる金が好ましい。また、光の取り出しを高めるために、少なくとも表面が銀で構成されていると好ましい。
第１のワイヤ４は、発光素子３のワイヤボンディング点Ｂと第１の導電部材１１のワイヤボンディング点Ｂ’とを接続するもので、絶縁部材５の上方を延伸するように形成される。第２のワイヤ７は、発光素子３のワイヤボンディング点と第２の導電部材１２のワイヤボンディング点とを接続する。第２のワイヤ７も、絶縁部材５の上方を延伸するように形成されると好ましい。 <Wire>
The light emitting device 100A according to the first embodiment electrically connects the first wire 4 that electrically connects the light emitting element 3 and the first conductive member 11, and the light emitting element 3 and the second conductive member 12. And a second wire 7. When the light emitting element 3 having the counter electrode structure is used, the second wire 7 may not be provided. In addition, the wire which connects between the light emitting elements 3 is abbreviate | omitted in sectional drawing in drawing.
As a material of the wire, gold, copper, silver, platinum, aluminum, or a metal wire of these alloys can be used. In particular, gold that is less likely to break due to stress from the sealing member 6 and is excellent in thermal resistance or the like is preferable. In order to enhance light extraction, it is preferable that at least the surface is made of silver.
The first wire 4 connects the wire bonding point B of the light emitting element 3 and the wire bonding point B ′ of the first conductive member 11 and is formed to extend above the insulating member 5. The second wire 7 connects the wire bonding point of the light emitting element 3 and the wire bonding point of the second conductive member 12. The second wire 7 is also preferably formed so as to extend above the insulating member 5.

＜実施形態１の発光装置１００Ａの製造方法＞ <Method for Manufacturing Light Emitting Device 100A of Embodiment 1>

以下、図８〜１１を参照しながら実施形態１の発光装置１００Ａの製造方法について説明する。   Hereinafter, a method for manufacturing the light emitting device 100A of Embodiment 1 will be described with reference to FIGS.

（第１の工程）
まず、実施形態１の導電部材であるリードフレームを準備する。リードフレームは、正又は負の複数の第１の導電部材１１及び第２の導電部材１２を含んでおり、所定の位置関係を保持した状態で支持される。
第２の導電部材１２は、第１の導電部材１１よりも大きく形成し、上面には発光素子３を実装する台座２Ａを形成する。実施形態１の台座２Ａは、例えば上面視約２５００×２５００μｍの略矩形状とすることができる。第２の導電部材１２は、後述する突出部１２ａを有するように、台座２Ａの厚み約３５０μｍ、台座２Ａの周囲の厚み約２５０μｍで形成することができる。したがって、前記条件の場合、発光素子３の実装面となる台座２Ａの上面と、ワイヤボンディング点Ｂ’を有する第１の導電部材１１の上面との間には、台座２Ａによる約３５０μｍの段差Ｓが存在する。台座２Ａの側面は、傾斜を有していてもよい。なお、必要に応じて、第１の導電部材１１と第２の導電部材１２とを所定の位置で保持する支持基材を形成してもかまわない。 (First step)
First, a lead frame that is a conductive member of Embodiment 1 is prepared. The lead frame includes a plurality of positive or negative first conductive members 11 and second conductive members 12, and is supported while maintaining a predetermined positional relationship.
The second conductive member 12 is formed to be larger than the first conductive member 11, and a base 2A for mounting the light emitting element 3 is formed on the upper surface. The pedestal 2A according to the first embodiment can be formed in, for example, a substantially rectangular shape having a top view of about 2500 × 2500 μm. The second conductive member 12 can be formed with a thickness of about 350 μm of the pedestal 2 </ b> A and a thickness of about 250 μm around the pedestal 2 </ b> A so as to have a protrusion 12 a described later. Therefore, in the case of the above condition, a step S of about 350 μm is formed between the upper surface of the pedestal 2A serving as the mounting surface of the light emitting element 3 and the upper surface of the first conductive member 11 having the wire bonding point B ′. Exists. The side surface of the pedestal 2A may have an inclination. In addition, you may form the support base material which hold | maintains the 1st conductive member 11 and the 2nd conductive member 12 in a predetermined position as needed.

（第２の工程）
次に、絶縁部材５で突出部１２ａとなる部分を被覆する。実施形態１の第２の工程では、台座２Ａの第１の導電部材１１側（第１のワイヤ４が跨ぐ側）の上面に、予め成形したシリコーン樹脂によるシート状樹脂（例えば、約１００×２５００μｍ、厚み約５０μｍ、ショアＡ硬度４１等に成形したシート状樹脂）を配置することで、図９のように絶縁部材５を形成する。絶縁部材５を第２の導電部材１２に部分的に形成する場合は、シート状樹脂を用いることが最も好ましい。すなわち、シート状樹脂は、予め所望の形状に加工することができ、接着剤等を用いることなく第２の導電部材１２の所望の位置及び領域に容易に貼り付けることができる。なお、シート状樹脂は接着剤を用いずに貼り付けることが可能であるが、接着剤を用いて接着する方が、絶縁部材５を確実に所望の位置に留めることができる。その他、スプレーによる噴霧等によって、突出部１２ａに精度よく絶縁部材５を形成することが可能である。なお、絶縁部材５は、粘度を調整した樹脂をディスペンサ等で吐出することで形成してもよいし、予め所望の形状に加工した絶縁部材を接着剤等で接着することで形成してもよい。また、成型、転写等によって形成することもできる。その他、印刷で形成してもよく、３Ｄプリンタで形成してもかまわない。
実施形態１では、絶縁部材５が台座２Ａの角２Ａ’を被覆するように、シート状樹脂を台座２Ａの上面端部に配置する。このように、シート状樹脂を用いると、液状樹脂では形成困難な位置に容易に絶縁部材５を形成することが可能である。 (Second step)
Next, the part which becomes the protrusion part 12a with the insulating member 5 is covered. In the second step of the first embodiment, a sheet-like resin (for example, about 100 × 2500 μm) formed in advance on the upper surface of the pedestal 2A on the first conductive member 11 side (the side on which the first wire 4 straddles) is formed. Insulating member 5 is formed as shown in FIG. 9 by disposing a sheet-like resin having a thickness of about 50 μm and a Shore A hardness of 41 or the like. When the insulating member 5 is partially formed on the second conductive member 12, it is most preferable to use a sheet-like resin. That is, the sheet-like resin can be processed into a desired shape in advance, and can be easily attached to a desired position and region of the second conductive member 12 without using an adhesive or the like. In addition, although sheet-like resin can be affixed without using an adhesive agent, the direction which adhere | attaches using an adhesive agent can hold the insulating member 5 in a desired position reliably. In addition, the insulating member 5 can be accurately formed on the protrusion 12a by spraying or the like. The insulating member 5 may be formed by discharging a resin whose viscosity is adjusted with a dispenser or the like, or may be formed by adhering an insulating member processed in advance into a desired shape with an adhesive or the like. . It can also be formed by molding, transfer or the like. In addition, it may be formed by printing or a 3D printer.
In the first embodiment, the sheet-like resin is disposed on the upper end of the base 2A so that the insulating member 5 covers the corner 2A ′ of the base 2A. As described above, when the sheet-like resin is used, it is possible to easily form the insulating member 5 at a position difficult to form with the liquid resin.

なお、この第２の工程は、発光素子３を第２の導電部材１２上に実装する工程の前後どちらに行ってもかまわない。実施形態１では、絶縁性の基板上に半導体積層構造が積層され、同一面側電極構造を有する発光素子３を用い、接着剤によって絶縁性の基板側を台座２Ａ上に実装する。実施形態１では、例えば上面視約４６０×４６０μｍ、厚み約１５０μｍの発光素子３を用いることができ、３行×３列のマトリクス状に９個実装する。   Note that this second step may be performed either before or after the step of mounting the light emitting element 3 on the second conductive member 12. In the first embodiment, a semiconductor multilayer structure is stacked on an insulating substrate, the light emitting element 3 having the same electrode structure is used, and the insulating substrate side is mounted on the pedestal 2A with an adhesive. In the first embodiment, for example, the light emitting elements 3 having a top view of about 460 × 460 μm and a thickness of about 150 μm can be used, and nine light emitting elements 3 are mounted in a matrix of 3 rows × 3 columns.

ここで、突出部１２ａは、実装された発光素子３上のワイヤボンディング点Ｂと、第１の導電部材１１上のワイヤボンディング点Ｂ’とを結んだ仮想直線Ａよりも突出した部分である。したがって、発光素子３上のワイヤボンディング点Ｂと第１の導電部材１１上のワイヤボンディング点Ｂ’との高さ方向（ｙ軸方向）の離間距離（例えば、発光素子３の厚み約１５０μｍ＋台座の厚み約３５０μｍ）と、高さ方向に対して垂直なｘ軸方向の離間距離（約１６００μｍ）を算出することで、断面視において突出部１２ａの領域を画定することができる。すなわち、前記条件によると、実施形態１の断面視における突出部１２ａは、台座２Ａの角２Ａ’を含む上面１２ｂ約５０μｍ、側面１２ｃ約５０μｍの領域であり、この領域のうち、少なくとも第１のワイヤ４が跨ぐ下方を被覆するようにシート状樹脂を配置する。   Here, the protruding portion 12 a is a portion protruding from a virtual straight line A connecting the wire bonding point B on the mounted light emitting element 3 and the wire bonding point B ′ on the first conductive member 11. Accordingly, the distance in the height direction (y-axis direction) between the wire bonding point B on the light emitting element 3 and the wire bonding point B ′ on the first conductive member 11 (for example, the thickness of the light emitting element 3 is about 150 μm + the pedestal). By calculating the thickness (about 350 μm) and the separation distance (about 1600 μm) in the x-axis direction perpendicular to the height direction, the region of the protruding portion 12 a can be defined in a sectional view. That is, according to the above conditions, the protrusion 12a in the cross-sectional view of the first embodiment is a region having an upper surface 12b of about 50 μm and a side surface 12c of about 50 μm including the corner 2A ′ of the pedestal 2A. Sheet-like resin is arrange | positioned so that the lower part which the wire 4 straddles may be coat | covered.

（第３の工程）
第２の工程で絶縁部材５を形成した後、第３の工程において発光素子３のワイヤボンディング点Ｂと第１の導電部材１１のワイヤボンディング点Ｂ’とを第１のワイヤ４で接続する。また、適宜発光素子３のワイヤボンディング点と第２の導電部材１２のワイヤボンディング点とを第２のワイヤ７で接続する。第１のワイヤ４は、絶縁部材５の上方を跨ぐようにワイヤボンディングする。
実施形態１では、直径約２５μｍの金のワイヤを用いることができ、例えば図１０のように１つの行を構成する発光素子３について、一方の端の発光素子３の電極から隣接する発光素子３の同じ電極を順次ワイヤによって接続し、最後に発光素子３のワイヤボンディング点Ｂから第１の導電部材１１のワイヤボンディング点Ｂ’に接続する。一方、発光素子３の他方の電極についても同様に順次ワイヤによって接続し、最後に発光素子３のワイヤボンディング点から第２の導電部材１２のワイヤボンディング点に接続する。以上のワイヤボンディングを全ての行について行い、全ての発光素子３の正の電極及び負の電極をそれぞれ第１の導電部材１１及び第２の導電部材１２に電気的に接続する。これに限らず、各発光素子と各導電部材を接続することができれば、適宜自由にワイヤボンディングすることができる。 (Third step)
After forming the insulating member 5 in the second step, the wire bonding point B of the light emitting element 3 and the wire bonding point B ′ of the first conductive member 11 are connected by the first wire 4 in the third step. Further, the wire bonding point of the light emitting element 3 and the wire bonding point of the second conductive member 12 are appropriately connected by the second wire 7. The first wire 4 is wire-bonded so as to straddle the insulating member 5.
In the first embodiment, a gold wire having a diameter of about 25 μm can be used. For example, for the light emitting elements 3 constituting one row as shown in FIG. 10, the light emitting element 3 adjacent to the electrode of the light emitting element 3 at one end. The same electrodes are sequentially connected by wires, and finally connected from the wire bonding point B of the light emitting element 3 to the wire bonding point B ′ of the first conductive member 11. On the other hand, the other electrodes of the light emitting element 3 are similarly connected sequentially by wires, and finally connected from the wire bonding point of the light emitting element 3 to the wire bonding point of the second conductive member 12. The above wire bonding is performed for all rows, and the positive electrodes and the negative electrodes of all the light emitting elements 3 are electrically connected to the first conductive member 11 and the second conductive member 12, respectively. Not only this but if each light emitting element and each electrically-conductive member can be connected, it can wire-bond suitably freely.

第３の工程の後、発光素子３、第１のワイヤ４、第２のワイヤ７と、第１の導電部材１１及び第２の導電部材１２の一部とを被覆する封止部材６を適宜所望の形状、方法で形成する。実施形態１の封止部材６は、シリコーン樹脂を用いてトランスファー成形で形成し、鍔部を有する略ドーム状に形成する。また、導電部材に対する接触角が大きい樹脂を用い、樹脂の粘度を高くして滴下量を多くすることで、滴下法によってトランスファー成形で形成したようなドーム状の封止部材６を形成することも可能である。最後に、リードフレーム及び封止部材６を切断することで各発光装置１００Ａごとに個片化し、発光装置１００Ａを完成させる。   After the third step, the sealing member 6 that covers the light emitting element 3, the first wire 4, the second wire 7, and part of the first conductive member 11 and the second conductive member 12 is appropriately provided. It is formed by a desired shape and method. The sealing member 6 of Embodiment 1 is formed by transfer molding using a silicone resin, and is formed in a substantially dome shape having a collar portion. In addition, by using a resin having a large contact angle with respect to the conductive member and increasing the viscosity of the resin to increase the amount of dripping, the dome-shaped sealing member 6 formed by transfer molding by the dropping method may be formed. Is possible. Finally, the lead frame and the sealing member 6 are cut into individual pieces for each light emitting device 100A to complete the light emitting device 100A.

以上のように発光装置１００Ａを製造すると、第３の工程のワイヤボンディングの際に、第２の導電部材１２と第１のワイヤ４とが直接接触することを防止することができ、発光装置１００Ａのショートを防ぐことができる。また、さらに、絶縁部材５を第２の導電部材１２の一部に容易に形成することができるため、材料コストが削減でき、さらに発光素子３からの出射光の吸収を抑えることが可能である。
なお、発光装置１００Ａの絶縁部材５と第１のワイヤ４とは離間しているが、第１のワイヤ４によって発光素子３と第１の導電部材１１とが電気的に接続されており、第２の導電部材１２と第１のワイヤ４とが電気的に絶縁されていれば、絶縁部材５と第１のワイヤ４とが接触していてもかまわない。 When the light emitting device 100A is manufactured as described above, it is possible to prevent the second conductive member 12 and the first wire 4 from coming into direct contact during wire bonding in the third step, and the light emitting device 100A. Can prevent short circuit. Furthermore, since the insulating member 5 can be easily formed on a part of the second conductive member 12, the material cost can be reduced, and the absorption of the emitted light from the light emitting element 3 can be suppressed. .
Although the insulating member 5 and the first wire 4 of the light emitting device 100A are separated from each other, the light emitting element 3 and the first conductive member 11 are electrically connected by the first wire 4, and the first As long as the two conductive members 12 and the first wire 4 are electrically insulated, the insulating member 5 and the first wire 4 may be in contact with each other.

≪実施形態２≫
実施形態２の発光装置２００では、図１１に示されるように、突出部１２ａは第２の導電部材１２の凹部２Ｂの一部である。さらに、絶縁部材５は、突出部１２ａの上面１２ｂ及び側面１２ｃ、すなわち凹部２Ｂの縁２Ｂ’付近を被覆している。それ以外は、実施形態１の発光装置１００Ａと略同様に構成されており、適宜説明を省略する。 << Embodiment 2 >>
In the light emitting device 200 according to the second embodiment, as illustrated in FIG. 11, the protrusion 12 a is a part of the recess 2 </ b> B of the second conductive member 12. Furthermore, the insulating member 5 covers the upper surface 12b and the side surface 12c of the protruding portion 12a, that is, the vicinity of the edge 2B ′ of the recess 2B. Other than that, the configuration is substantially the same as that of the light-emitting device 100A of Embodiment 1, and the description thereof is omitted as appropriate.

実施形態２の第１の導電部材１１及び第２の導電部材１２は、実施形態１と同様にリードフレームである。実施形態２では、第２の導電部材１２が凹部２Ｂを有し、凹部２Ｂの底面に発光素子３が実装される。凹部２Ｂは、リードフレームを折り曲げ加工することで形成することができる。凹部２Ｂを形成することで、凹部２Ｂの側壁によって発光素子３からの出射光を上方へ効率的に反射させることができ、発光装置２００の光の取り出しを向上させることができる。凹部２Ｂの側壁は、光を効率的に反射させるために、上方へ広がるように傾斜させてもよい。なお、実施形態２では、第１の導電部材１１の下面と、第２の導電部材１２の凹部２Ｂの下面とが略同一面となるように配置され、第１の導電部材１１及び第２の導電部材１２の間には、それらを支持する支持基材が形成されている。   The first conductive member 11 and the second conductive member 12 of the second embodiment are lead frames as in the first embodiment. In the second embodiment, the second conductive member 12 has the recess 2B, and the light emitting element 3 is mounted on the bottom surface of the recess 2B. The recess 2B can be formed by bending the lead frame. By forming the recess 2B, the emitted light from the light emitting element 3 can be efficiently reflected upward by the side wall of the recess 2B, and the light extraction of the light emitting device 200 can be improved. In order to reflect light efficiently, the side wall of the recess 2B may be inclined so as to spread upward. In the second embodiment, the lower surface of the first conductive member 11 and the lower surface of the concave portion 2B of the second conductive member 12 are arranged so as to be substantially the same plane, and the first conductive member 11 and the second conductive member 11 Between the conductive members 12, a support base material that supports them is formed.

第１のワイヤ４は、凹部２Ｂ内に実装された発光素子３のワイヤボンディング点Ｂと、第１の導電部材１１のワイヤボンディング点Ｂ’とを接続する。実施形態２では、発光素子３の実装面である凹部２Ｂの底面と、第１の導電部材１１の上面とが略同一面上にあるため、ワイヤボンディング点Ｂ−Ｂ’間の高さの差は実質的に発光素子３の厚み分となる。しかし、第１のワイヤ４は、凹部２Ｂの側壁による段差Ｓを跨ぐ構成となるので、突出部１２ａと特に接触しやすくなっている。   The first wire 4 connects the wire bonding point B of the light emitting element 3 mounted in the recess 2 </ b> B and the wire bonding point B ′ of the first conductive member 11. In Embodiment 2, since the bottom surface of the recess 2B, which is the mounting surface of the light emitting element 3, and the top surface of the first conductive member 11 are substantially on the same plane, the difference in height between the wire bonding points BB ′. Substantially corresponds to the thickness of the light emitting element 3. However, since the first wire 4 is configured to straddle the step S due to the side wall of the recess 2B, it is particularly easy to come into contact with the protruding portion 12a.

実施形態２の突出部１２ａは、仮想直線Ａよりも上方（第１のワイヤ４側）に突出した凹部２Ｂの一部であり、凹部２Ｂの側壁の上面が突出部１２ａの上面１２ｂ、凹部２Ｂの側壁の側面が突出部１２ａの側面１２ｃとなっている。実施形態２の絶縁部材５は、図１１のように、突出部１２ａの上面１２ｂ及び側面１２ｃにわたって形成される。このように、絶縁部材５が突出部１２ａの上面１２ｂ及び側面１２ｃにわたって設けられていると、第２の導電部材１２と第１のワイヤ４とが直接接触しにくいので好ましい。   The protrusion 12a of the second embodiment is a part of the recess 2B that protrudes above the virtual straight line A (on the first wire 4 side), and the upper surface of the side wall of the recess 2B is the upper surface 12b of the protrusion 12a and the recess 2B. The side surface of the side wall is the side surface 12c of the protruding portion 12a. The insulating member 5 of Embodiment 2 is formed over the upper surface 12b and the side surface 12c of the protrusion 12a as shown in FIG. As described above, it is preferable that the insulating member 5 is provided over the upper surface 12b and the side surface 12c of the protruding portion 12a because the second conductive member 12 and the first wire 4 are difficult to contact directly.

＜実施形態２の発光装置２００の製造方法＞
以下、実施形態２の発光装置２００の製造方法のうち、特に第２の工程について図１２を参照しながら説明する。なお、第１の導電部材１１及び第２の導電部材１２を準備する第１の工程、発光素子と第１の導電部材とを接続する第３の工程については、実施形態１の発光装置１００Ａの製造方法と略同様とすることができるため、適宜省略する。 <Method for Manufacturing Light-Emitting Device 200 of Embodiment 2>
Hereinafter, the second step of the method for manufacturing the light emitting device 200 according to Embodiment 2 will be described with reference to FIG. In addition, about the 1st process of preparing the 1st conductive member 11 and the 2nd conductive member 12, and the 3rd process of connecting a light emitting element and a 1st conductive member, 100 A of light-emitting devices of Embodiment 1 are used. Since it can be substantially the same as the manufacturing method, it is omitted as appropriate.

実施形態２では、絶縁部材５を、突出部１２ａの上面１２ｂ及び側面１２ｃにわたって形成する。このような絶縁部材５は、第２の工程において、例えば、図１２（ａ）のようにシート状樹脂を凹部２Ｂの側壁上面から凹部２Ｂの開口側にはみ出るようにずらして配置することで形成できる。つまり、シート状樹脂の一部を凹部２Ｂの側壁上面へ配置し、残りの一部を凹部２Ｂの開口側に突出させるように配置する。そして、凹部２Ｂの開口側にずらして配置した部分を、シート状樹脂の柔軟性を利用し、凹部２Ｂの側壁の側面を被覆するように変形させることで、突出部１２ａの上面１２ｂ及び側面１２ｃを被覆する絶縁部材５を形成することができる。このように絶縁部材５を形成する場合、工程数を増やすことなく、突出部１２ａの上面１２ｂ及び側面１２ｃを被覆させることができる。実施形態２のシート状樹脂は、例えば上面視約１００×１００μｍ、厚み約５０μｍとすることができ、ショアＡ硬度約４１〜５６程度とすることができる。   In the second embodiment, the insulating member 5 is formed over the upper surface 12b and the side surface 12c of the protruding portion 12a. Such an insulating member 5 is formed in the second step by, for example, disposing the sheet-like resin so as to protrude from the upper surface of the side wall of the recess 2B to the opening side of the recess 2B as shown in FIG. it can. That is, a part of the sheet-like resin is disposed on the upper surface of the side wall of the recess 2B, and the remaining part is disposed so as to protrude toward the opening side of the recess 2B. Then, the upper surface 12b and the side surface 12c of the projecting portion 12a are deformed by using the flexibility of the sheet-like resin so as to cover the side surface of the concave portion 2B so as to cover the side surface of the concave portion 2B. Can be formed. Thus, when forming the insulating member 5, the upper surface 12b and the side surface 12c of the protrusion part 12a can be coat | covered, without increasing the number of processes. The sheet-like resin of Embodiment 2 can have a top view of about 100 × 100 μm, a thickness of about 50 μm, and a Shore A hardness of about 41 to 56, for example.

その他、突出部１２ａの上面１２ｂ及び側面１２ｃにわたって形成される絶縁部材５は、図１２（ｂ）のようにシート状樹脂を突出部１２ａの上面１２ｂ（好ましくは突出部１２ａの上面１２ｂ端部）に配置し、熱を加えることで溶融させ、溶融した樹脂を側面１２ｂへ垂れさせることで形成してもよい。このように形成すると、シート状樹脂を熱硬化させる工程と同時に、絶縁部材５を突出部１２ａの上面１２ｂ及び側面１２ｃにわたるように形成できる。
なお、シート状樹脂の柔軟性や垂れによる絶縁部材５の形成では、図１３（ａ）のように絶縁部材５は側面１２ｃと完全に密着していなくてもよい。また、図１３（ｂ）に示される絶縁部材５のように、絶縁部材５の一部が凹部２Ｂの開口側へ突出するように形成しても、同様に第２の導電部材１２と第１のワイヤ４とが直接接触しにくい構成とできる。 In addition, the insulating member 5 formed over the upper surface 12b and the side surface 12c of the projecting portion 12a is made of sheet-like resin as shown in FIG. 12B. The upper surface 12b of the projecting portion 12a (preferably the end of the upper surface 12b of the projecting portion 12a). It is also possible to form the resin by placing it on the substrate 12, melting it by applying heat, and dripping the molten resin onto the side surface 12 b. If formed in this way, the insulating member 5 can be formed so as to cover the upper surface 12b and the side surface 12c of the protruding portion 12a simultaneously with the step of thermosetting the sheet-like resin.
In the formation of the insulating member 5 by the flexibility of the sheet-like resin or sagging, the insulating member 5 may not be completely in close contact with the side surface 12c as shown in FIG. Moreover, even if it forms so that a part of insulating member 5 may protrude to the opening side of the recessed part 2B like the insulating member 5 shown by FIG.13 (b), the 2nd conductive member 12 and 1st are similarly formed. The wire 4 is difficult to be in direct contact.

なお、実施形態２では、絶縁部材５が突出部１２ａの上面１２ｂ及び側面１２ｃを被覆する形態を示したが、実施形態１で示したように、突出部１２ａの上面１２ｂのみを被覆する構成としてもよいし、側面１２ｃのみを被覆する構成としてもよい。また、絶縁部材５が突出部１２ａの少なくとも一部を被覆していれば、突出部１２ａ以外を被覆していてもかまわない。   In the second embodiment, the configuration in which the insulating member 5 covers the upper surface 12b and the side surface 12c of the protruding portion 12a is shown. However, as shown in the first embodiment, only the upper surface 12b of the protruding portion 12a is covered. Alternatively, only the side surface 12c may be covered. Further, as long as the insulating member 5 covers at least a part of the protruding portion 12a, the insulating member 5 may cover other than the protruding portion 12a.

また、絶縁部材５は１つでも、複数形成されていてもよい。例えば、図１４（ａ）の絶縁部材５は一体に形成されており、凹部２Ｂの縁２Ｂ’全体を被覆している。そうすることで、第２の導電部材１２とワイヤ４，７との接触をより確実に防ぐことができ、信頼性の高い発光装置とすることができる。さらに、発光素子３の周囲に一体の絶縁部材５を設けることで、絶縁部材５による発光素子３の出射光の吸収が略均一になりやすく、輝度むらを抑えた発光装置２００とすることができる。この場合、絶縁部材５の厚みは略均一であるとより好ましい。   One insulating member 5 or a plurality of insulating members 5 may be formed. For example, the insulating member 5 in FIG. 14A is integrally formed and covers the entire edge 2B 'of the recess 2B. By doing so, the contact between the second conductive member 12 and the wires 4 and 7 can be more reliably prevented, and a highly reliable light-emitting device can be obtained. Furthermore, by providing the integral insulating member 5 around the light emitting element 3, the light emitted from the light emitting element 3 by the insulating member 5 is likely to be absorbed almost uniformly, and the light emitting device 200 with reduced luminance unevenness can be obtained. . In this case, it is more preferable that the thickness of the insulating member 5 is substantially uniform.

このような絶縁部材５は、例えば図１４（ｅ）のように、予め凹部２Ｂの開口よりも小さい孔を有し、外周が凹部２Ｂの開口よりも大きいシート状樹脂を成形し、縁２Ｂ’を被覆するように配置することで容易に形成することができる。孔は、凹部２Ｂの開口と略同心形状であると好ましい。
また、凹部２Ｂの開口よりも小さい孔を有し、外周が凹部２Ｂの開口よりも小さいシート状樹脂を成形して配置すれば、突出部１２ａの側面１２ｃのみを被覆する絶縁部材５を形成することも可能である。さらに、凹部２Ｂの開口よりも大きい孔を有し、外周が凹部２Ｂの開口よりも大きいシート状樹脂を成形して配置すれば、実施形態１で示したような、突出部１２ａの上面１２ｂのみを被覆する絶縁部材５を形成することも可能である。 For example, as shown in FIG. 14 (e), such an insulating member 5 has a hole that is smaller than the opening of the recess 2 </ b> B in advance, and is molded with a sheet-like resin whose outer periphery is larger than the opening of the recess 2 </ b> B. It can form easily by arrange | positioning so that it may coat | cover. The hole is preferably substantially concentric with the opening of the recess 2B.
Further, if a sheet-like resin having a hole smaller than the opening of the recess 2B and having an outer periphery smaller than the opening of the recess 2B is formed and arranged, the insulating member 5 that covers only the side surface 12c of the protrusion 12a is formed. It is also possible. Furthermore, if a sheet-like resin having a hole larger than the opening of the recess 2B and having an outer periphery larger than the opening of the recess 2B is formed and arranged, only the upper surface 12b of the protruding portion 12a as shown in the first embodiment is provided. It is also possible to form the insulating member 5 covering the film.

第１のワイヤ４及び第２のワイヤ７を有する場合、図１４（ｂ）のように各ワイヤの下方に絶縁部材５を配置してもよい。そうすることで、実施形態１の絶縁部材５のように、一方のワイヤが跨ぐ突出部のみを被覆する場合よりも、発光装置の輝度が均一になりやすい。さらに、図１４（ａ）のような縁２Ｂ’を略全て被覆する絶縁部材５と比べ、少ない材料で絶縁部材５を形成することができる。また、複数の第１のワイヤ４（及び第２のワイヤ７）を有する場合、図１４（ｃ）のように各ワイヤの下方に複数の絶縁部材５を形成してもかまわない。そうすることで、絶縁部材５の材料コストをより削減することができ、さらに、絶縁部材５による発光素子３からの出射光の吸収を抑えることができる。また、図１４（ｄ）及び図１４（ｆ）に示されるように、ワイヤの下方に、突出部１２ａの上面１２ｂを被覆する絶縁部材５と、側面１２ｃを被覆する絶縁部材５の両方を形成してもよい。   When the first wire 4 and the second wire 7 are provided, the insulating member 5 may be disposed below each wire as shown in FIG. By doing so, the brightness | luminance of a light-emitting device becomes easy to become uniform rather than the case where only the protrusion part which one wire straddles like the insulating member 5 of Embodiment 1. FIG. Furthermore, the insulating member 5 can be formed with less material than the insulating member 5 that covers substantially the entire edge 2B 'as shown in FIG. Moreover, when it has several 1st wire 4 (and 2nd wire 7), you may form several insulation member 5 under each wire like FIG.14 (c). By doing so, the material cost of the insulating member 5 can be further reduced, and further, the absorption of the emitted light from the light emitting element 3 by the insulating member 5 can be suppressed. 14D and 14F, both the insulating member 5 that covers the upper surface 12b of the protrusion 12a and the insulating member 5 that covers the side surface 12c are formed below the wire. May be.

≪実施形態３≫
実施形態３の発光装置３００は、図１５に示されるような突出部１２ａを有している。実施形態３の突出部１２ａは、第２の導電部材１２において発光素子３と第１の導電部材１１との間に設けられた凸部２Ｃの一部である。凸部２Ｃは、例えば発光素子３を第２の導電部材１２に実装するための接着剤が、第１の導電部材１１の方向へ流れることを防ぐためのダムとして設けることができる。この場合、凸部２Ｃは、例えば上面視において第２の導電部材１２の第１の導電部材１１と向かい合う端部に沿って設けることができる。その他、突出部１２ａを有していれば、適宜所望の効果を有する凸部２Ｃを備えていてもかまわない。また、形成位置も、第２の導電部材１２上であって、第１のワイヤ４が跨ぐ領域に形成されていれば特に限定されない。
突出部１２ａが凸部２Ｃから構成される場合、絶縁部材５の厚みを適宜調整し、図１５のように突出部１２ａの上面１２ｂの一部に形成することで、凸部２Ｃと第１のワイヤ４とが直接接触することを防止できる。また、実施形態３の絶縁部材５は、図１６（ａ）に示されるように凸部２Ｃの上面及び側面の途中までを被覆するように形成してもよいし、図１６（ｂ）のように凸部２Ｃを全て被覆するように形成してもよい。その他、絶縁部材５は図１６（ｃ）のように凸部２Ｃの周囲を被覆するように形成することもでき、少なくとも突出部１２ａの一部を被覆していれば適宜自由に形成することができる。それ以外は、実施形態１及び実施形態２の発光装置１００Ａ，２００と同様の構成とすることができ、適宜説明を省略する。 << Embodiment 3 >>
The light emitting device 300 according to Embodiment 3 has a protruding portion 12a as shown in FIG. The protruding portion 12 a of the third embodiment is a part of the convex portion 2 </ b> C provided between the light emitting element 3 and the first conductive member 11 in the second conductive member 12. The convex portion 2 </ b> C can be provided as a dam for preventing, for example, an adhesive for mounting the light emitting element 3 on the second conductive member 12 from flowing in the direction of the first conductive member 11. In this case, the convex portion 2C can be provided along an end portion of the second conductive member 12 facing the first conductive member 11 in a top view, for example. In addition, as long as it has the protrusion part 12a, you may provide the convex part 2C which has a desired effect suitably. Also, the formation position is not particularly limited as long as it is formed on the second conductive member 12 and in the region where the first wire 4 straddles.
When the projecting portion 12a is composed of the projecting portion 2C, the thickness of the insulating member 5 is adjusted as appropriate and formed on a part of the upper surface 12b of the projecting portion 12a as shown in FIG. Direct contact with the wire 4 can be prevented. Further, the insulating member 5 of the third embodiment may be formed so as to cover the upper surface and the middle of the side surface of the convex portion 2C as shown in FIG. 16A, or as shown in FIG. Alternatively, the projection 2C may be entirely covered. In addition, the insulating member 5 can be formed so as to cover the periphery of the convex portion 2C as shown in FIG. 16C, and can be freely formed as long as it covers at least a part of the protruding portion 12a. it can. Other than that, it can be set as the structure similar to light-emitting device 100A, 200 of Embodiment 1 and Embodiment 2, and description is abbreviate | omitted suitably.

≪実施形態４≫
実施形態４の発光装置４００は、図１７に示されるように、封止部材６が複数の層で構成されている。それ以外は、実施形態１及び実施形態２の発光装置１００Ａ，２００と同様の構成とすることができ、適宜説明を省略する。
例えば、図１７（ａ）に示される実施形態４の発光装置４００は、発光素子３及び台座２Ａ上を被覆する第１の封止部材６ａと、第１の封止部材６ａ及びワイヤ４，７を被覆する第２の封止部材６ｂとを有している。また、図１７（ｂ）に示される封止部材６は、第２の導電部材１２で形成された凹部２Ｂに第１の封止部材６ａが充填されており、第１の封止部材６ａ及びワイヤ４，７をさらに被覆する第２の封止部材６ｂが形成されている。 << Embodiment 4 >>
As shown in FIG. 17, in the light emitting device 400 of Embodiment 4, the sealing member 6 is composed of a plurality of layers. Other than that, it can be set as the structure similar to light-emitting device 100A, 200 of Embodiment 1 and Embodiment 2, and description is abbreviate | omitted suitably.
For example, the light emitting device 400 of Embodiment 4 shown in FIG. 17A includes a first sealing member 6a covering the light emitting element 3 and the base 2A, the first sealing member 6a, and the wires 4 and 7. And a second sealing member 6b covering the surface. Further, in the sealing member 6 shown in FIG. 17B, the concave portion 2B formed by the second conductive member 12 is filled with the first sealing member 6a, and the first sealing member 6a and A second sealing member 6 b that further covers the wires 4 and 7 is formed.

以上のような２層構成とすると、第１の封止部材６ａ及び第２の封止部材６ｂの両方によって第１のワイヤ４が固定されるので、発光素子３からの光や熱、外力によってワイヤが撓みにくく、発光装置４００のショートがより発生しにくい構成とすることができる。さらに、第１の封止部材６ａのみに蛍光体を含有させると、発光素子３からの出射光の波長変換が効率的に行え、波長変換された光を指向性よく取り出すことができる。
さらに、前述のように、絶縁部材５をシート状樹脂で形成して蛍光体を含有させる（または複数のシート状樹脂の間に蛍光体を挟む）場合、第１の封止部材６ａに含有させる蛍光体と、絶縁部材５に含有させる蛍光体とを異なるものにすると、発光装置の演色性を向上させることができる。例えば、台座２Ａ上に、青色発光素子（発光波長約４３０〜４９０ｎｍ）及び／又は緑色発光素子（発光波長約４９０ｎｍ〜５７０ｎｍ）等を実装し、ＣＡＳＮ系蛍光体を含有させたシート状樹脂を、角２Ａ’を被覆するように配置し、ＹＡＧ系蛍光体を含有する第１の封止部材６ａを形成すると、演色性のよい白色を発光する発光装置とすることができる。その他、用いる発光素子の発光色、第１の封止部材６ａ及び絶縁部材５に含有させる蛍光体を適宜自由に選択し、所望の発光色の発光装置とすることができる。なお、複数の絶縁部材５を有する場合、各々の絶縁部材５に異なる蛍光体を含有させてもかまわない。 With the two-layer configuration as described above, the first wire 4 is fixed by both the first sealing member 6a and the second sealing member 6b, so that light, heat, and external force from the light emitting element 3 are used. The wire is less likely to be bent, and a short circuit of the light emitting device 400 is less likely to occur. Furthermore, when the phosphor is contained only in the first sealing member 6a, the wavelength conversion of the emitted light from the light emitting element 3 can be performed efficiently, and the wavelength converted light can be extracted with good directivity.
Further, as described above, when the insulating member 5 is formed of a sheet-like resin and contains a phosphor (or the phosphor is sandwiched between a plurality of sheet-like resins), the insulating member 5 is contained in the first sealing member 6a. If the phosphor and the phosphor contained in the insulating member 5 are different, the color rendering property of the light emitting device can be improved. For example, a sheet-like resin in which a blue light emitting element (emission wavelength of about 430 to 490 nm) and / or a green light emitting element (emission wavelength of about 490 nm to 570 nm) or the like is mounted on the pedestal 2A, and a CASN phosphor is contained, When the first sealing member 6a containing the YAG-based phosphor is formed so as to cover the corner 2A ', a light emitting device that emits white light with good color rendering properties can be obtained. In addition, the light emitting color of the light emitting element to be used and the phosphor to be contained in the first sealing member 6a and the insulating member 5 can be freely selected as appropriate to obtain a light emitting device having a desired light emitting color. In addition, when it has the some insulating member 5, you may make each insulating member 5 contain a different fluorescent substance.

また、第１の封止部材６ａを滴下法で形成する場合、絶縁部材５の形成範囲を調節すれば、金属等で形成される台座２Ａと、樹脂等で形成される絶縁部材５との濡れ性の違いを利用することで、第１の封止部材６ａを容易に所望の位置に留めることが可能である。例えば、絶縁部材５を台座２Ａの略全ての角２Ａ’に沿って突出部１２ａの上面１２ｂに形成すると、第１の封止部材６ａの表面張力が働き、図１７（ａ）のような第１の封止部材６ａを容易に形成することができる。同様に、図１７（ｂ）に示されるように、凹部２Ｂの略全ての縁２Ｂ’を被覆する絶縁部材５を形成することで、第１の封止部材６を所望の位置に形成することが可能である。
以上のように、絶縁部材５によって第１の封止部材６ａの外縁を画定する場合は、絶縁部材５は台座２Ａ又は凹部２Ｂを囲むように一体に形成されていると好ましい。さらに、第１の封止部材６ａが突出部１２ａを被覆していると、第１のワイヤ４が突出部１２ａ側に撓みにくいため、絶縁部材５は突出部１２ａにおいて外側（又は突出部１２ａの外側）に形成される方が好ましい。 Further, when the first sealing member 6a is formed by the dropping method, if the formation range of the insulating member 5 is adjusted, the pedestal 2A formed of metal or the like and the insulating member 5 formed of resin or the like are wetted. By utilizing the difference in sex, the first sealing member 6a can be easily held at a desired position. For example, when the insulating member 5 is formed on the upper surface 12b of the protruding portion 12a along substantially all the corners 2A ′ of the base 2A, the surface tension of the first sealing member 6a works, and the first member as shown in FIG. 1 sealing member 6a can be formed easily. Similarly, as shown in FIG. 17B, the first sealing member 6 is formed at a desired position by forming the insulating member 5 that covers substantially all the edges 2B ′ of the recess 2B. Is possible.
As described above, when the outer edge of the first sealing member 6a is defined by the insulating member 5, it is preferable that the insulating member 5 is integrally formed so as to surround the base 2A or the recess 2B. Further, when the first sealing member 6a covers the protruding portion 12a, the first wire 4 is difficult to bend toward the protruding portion 12a, so that the insulating member 5 is outside the protruding portion 12a (or the protruding portion 12a). It is preferable to form the outer side.

なお、実施形態４では、２層で構成された封止部材６を示したが、２層以上で構成されていてもかまわない。また、図１７（ｃ）及び図１７（ｄ）に示されるように、絶縁部材５は突出部１２ａの側面１２ｃ（台座２Ａの側面）に形成してもよい。このような構成とすると、滴下する第１の封止部材６ａの外縁が絶縁部材５によって保持されるので、第１の封止部材６ａが台座２Ａの側面にまで形成される。そうすることで、第１の封止部材６ａが蛍光体を含有している場合、波長変換された光が出射する領域を広くすることができる。また、図１７（ｅ）のように突出部１２ａの側面１２ｃ（凹部２Ｂの側壁の側面）に形成すれば、第１の封止部材６ａを凹部２Ｂから流出させることなく、確実に凹部２Ｂにとどめることも可能である。   In the fourth embodiment, the sealing member 6 composed of two layers is shown. However, the sealing member 6 may be composed of two or more layers. Moreover, as shown in FIGS. 17C and 17D, the insulating member 5 may be formed on the side surface 12c of the protrusion 12a (the side surface of the base 2A). With such a configuration, the outer edge of the dropped first sealing member 6a is held by the insulating member 5, so that the first sealing member 6a is formed even on the side surface of the base 2A. By doing so, when the 1st sealing member 6a contains fluorescent substance, the area | region where the light by which wavelength conversion was carried out radiate | emits can be enlarged. Moreover, if it forms in the side surface 12c (side surface of the side wall of the recessed part 2B) of the protrusion part 12a like FIG.17 (e), without making the 1st sealing member 6a flow out from the recessed part 2B, it will be reliably in the recessed part 2B. It is also possible to stay.

以上、本発明に係るいくつかの実施形態について例示したが、本発明は前述した実施形態に限定されるものではなく、本発明の要旨を逸脱しない限り任意のものとすることができることは言うまでもない。   As mentioned above, although several embodiments according to the present invention have been illustrated, the present invention is not limited to the above-described embodiments, and it is needless to say that any embodiment can be used without departing from the gist of the present invention. .

１００Ａ、１００Ｂ、２００、３００、４００…発光装置
１１…第１の導電部材
１２…第２の導電部材
１３…素子載置部材
１２ａ…突出部 １２ｂ…（突出部の）上面 １２ｃ…（突出部の）側面
２Ａ…台座 ２Ａ’…角 ２Ｂ…凹部 ２Ｂ’…縁 ２Ｃ…凸部 ２Ｃ’…角
３…発光素子
４…第１のワイヤ
５…絶縁部材
６…封止部材
６ａ…第１の封止部材 ６ｂ…第２の封止部材
７…第２のワイヤ
Ｂ、Ｂ’、Ｄ、Ｄ’…ワイヤボンディング点
Ａ、Ｃ、Ｙ…仮想直線
Ｐ…最接近部
Ｑ…絶縁部材の点Ｂ’側の上端部
Ｓ…段差 100A, 100B, 200, 300, 400 ... light emitting device 11 ... first conductive member 12 ... second conductive member 13 ... element mounting member 12a ... projecting portion 12b ... upper surface 12c ... (of projecting portion) ) Side surface 2A ... pedestal 2A '... corner 2B ... concave portion 2B' ... edge 2C ... convex portion 2C '... corner 3 ... light emitting element 4 ... first wire 5 ... insulating member 6 ... sealing member 6a ... first sealing Member 6b ... second sealing member 7 ... second wires B, B ', D, D' ... wire bonding points A, C, Y ... virtual straight line P ... closest part Q ... point B 'side of insulating member Upper end S ... step

Claims (10)

第１導電型層と、前記第１導電型層と極性の異なる第２導電型層と、を持つ発光素子と、
第１の導電部材と、
前記発光素子が実装される台座を備える第２の導電部材と、
前記発光素子の前記第１導電型層又は前記第２導電型層と、前記第１の導電部材と、を接続する第１のワイヤと、
前記発光素子と、前記第１の導電部材及び第２の導電部材の少なくとも一部とを被覆する封止部材と、を備え、
前記台座は、該台座の上面及び側面の少なくとも一部に、断面視において前記第１のワイヤで接続されるワイヤボンディング点を結ぶ仮想直線よりも上方に突出する突出部を有し、
前記突出部を含む、前記台座の上面の外周全て又は側面の外周全ては、絶縁部材で被覆されており、
前記封止部材は、前記台座の前記絶縁部材で囲まれた領域を被覆し、前記発光素子と、前記第１のワイヤの一部と、を被覆する第１の封止部材と、
前記第１の封止部材を被覆し、前記第１のワイヤの他の一部を被覆する第２の封止部材と、を備えることを特徴とする発光装置。 A light emitting device having a first conductivity type layer and a second conductivity type layer having a polarity different from that of the first conductivity type layer;
A first conductive member;
A second conductive member comprising a pedestal on which the light emitting element is mounted;
A first wire connecting the first conductive type layer or the second conductive type layer of the light emitting element and the first conductive member;
A sealing member that covers the light emitting element and at least a part of the first conductive member and the second conductive member;
The pedestal has a protruding portion that protrudes upward from a virtual straight line connecting wire bonding points connected by the first wire in a cross-sectional view on at least a part of an upper surface and a side surface of the pedestal,
All of the outer periphery of the upper surface of the pedestal or all of the outer periphery of the side surface including the protruding portion is covered with an insulating member,
The sealing member covers a region surrounded by the insulating member of the pedestal, and covers the light emitting element and a part of the first wire, and a first sealing member,
And a second sealing member that covers the first sealing member and covers another part of the first wire. 前記絶縁部材は、反射部材を含む請求項１に記載の発光装置。   The light emitting device according to claim 1, wherein the insulating member includes a reflective member. 前記封止部材は、鍔部を有する略ドーム形状である請求項１又２に記載の発光装置。   The light emitting device according to claim 1, wherein the sealing member has a substantially dome shape having a flange portion. 前記発光素子と、前記第２の導電部材とを接続する第２のワイヤをさらに有し、
前記突出部は、前記第２のワイヤで接続されるワイヤボンディング点を結ぶ仮想直線よりも上方に突出する請求項１〜３のいずれか１項に記載の発光装置。 A second wire connecting the light emitting element and the second conductive member;
The light emitting device according to any one of claims 1 to 3, wherein the protruding portion protrudes above a virtual straight line connecting wire bonding points connected by the second wire. 前記突出部の上面及び側面は、絶縁部材で被覆される請求項１〜４のいずれか１項に記載の発光装置。   The light emitting device according to claim 1, wherein an upper surface and a side surface of the protruding portion are covered with an insulating member. 複数の前記絶縁部材を有する請求項１〜５のいずれか１項に記載の発光装置。   The light emitting device according to claim 1, comprising a plurality of the insulating members. 前記絶縁部材は樹脂である請求項１〜６のいずれか１項に記載の発光装置。   The light emitting device according to claim 1, wherein the insulating member is a resin. 第１導電型層と、前記第１導電型層と極性の異なる第２導電型層と、を持つ発光素子と、第１の導電部材と、前記発光素子が実装される台座を備える第２の導電部材と、前記発光素子の前記第１導電型層又は前記第２導電型層と、前記第１の導電部材と、を接続する第１のワイヤと、前記発光素子と前記第１の導電部材及び第２の導電部材の少なくとも一部とを被覆する封止部材と、を備える発光装置の製造方法において、
前記台座は、該台座の上面及び側面の少なくとも一部に、断面視において前記第１のワイヤで接続されるワイヤボンディング点を結ぶ仮想直線よりも上方に突出する突出部が形成された前記第２の導電部材を準備する第１の工程と、
前記突出部を含む、前記台座の上面の外周全て又は側面の外周全てを絶縁部材で被覆する第２の工程と、
前記第２の工程の後、前記第１のワイヤが、前記絶縁部材の上方を跨ぐように、前記発光素子と前記第１の導電部材とを接続する第３の工程と、
前記第３の工程の後、前記台座の前記絶縁部材で囲まれた領域を被覆し、前記発光素子と、前記第１のワイヤの一部と、を被覆する第１の封止部材を形成する工程と、
前記第１の封止部材を被覆し、前記第１のワイヤの他の一部を被覆する第２の封止部材を形成する工程と、
を有することを特徴とする発光装置の製造方法。 A second light emitting element having a first conductive type layer and a second conductive type layer having a polarity different from that of the first conductive type layer; a first conductive member; and a second base on which the light emitting element is mounted. A conductive member; a first wire connecting the first conductive type layer or the second conductive type layer of the light emitting element; and the first conductive member; the light emitting element; and the first conductive member. And a sealing member that covers at least a part of the second conductive member,
In the pedestal, a second protrusion is formed on at least a part of an upper surface and a side surface of the pedestal so as to protrude above an imaginary straight line connecting wire bonding points connected by the first wire in a sectional view. A first step of preparing a conductive member of
A second step of covering the entire outer periphery of the upper surface of the pedestal or the entire outer periphery of the side surface with the insulating member, including the protruding portion;
After the second step, a third step of connecting the light emitting element and the first conductive member so that the first wire straddles above the insulating member;
After the third step, a region surrounded by the insulating member of the pedestal is covered to form a first sealing member that covers the light emitting element and a part of the first wire. Process,
Forming a second sealing member that covers the first sealing member and covers another part of the first wire;
A method for manufacturing a light-emitting device, comprising: 前記第２の工程において、前記絶縁部材は、シート状樹脂を用いる請求項８に記載の発光装置の製造方法。   The method for manufacturing a light emitting device according to claim 8, wherein in the second step, the insulating member uses a sheet-like resin. 前記第２の工程において、前記シート状樹脂を配置した後、熱を加えることを特徴とする請求項９に記載の発光装置の製造方法。   The method for manufacturing a light-emitting device according to claim 9, wherein, in the second step, heat is applied after the sheet-like resin is arranged.
JP2014043618A 2014-03-06 2014-03-06 Light emitting device and manufacturing method thereof Active JP6402890B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2014043618A JP6402890B2 (en) 2014-03-06 2014-03-06 Light emitting device and manufacturing method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014043618A JP6402890B2 (en) 2014-03-06 2014-03-06 Light emitting device and manufacturing method thereof

Publications (2)

Publication Number Publication Date
JP2015170679A JP2015170679A (en) 2015-09-28
JP6402890B2 true JP6402890B2 (en) 2018-10-10

Family

ID=54203170

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014043618A Active JP6402890B2 (en) 2014-03-06 2014-03-06 Light emitting device and manufacturing method thereof

Country Status (1)

Country Link
JP (1) JP6402890B2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7252820B2 (en) * 2019-04-12 2023-04-05 日機装株式会社 Semiconductor light emitting device and manufacturing method thereof

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6457660U (en) * 1987-09-30 1989-04-10
JP2503074Y2 (en) * 1991-03-14 1996-06-26 株式会社小糸製作所 Mounting structure of chip type light emitting diode
JPH0548151A (en) * 1991-08-07 1993-02-26 Nec Corp Light emitting diode
JP4215306B2 (en) * 1998-08-27 2009-01-28 シチズン電子株式会社 Semiconductor package and manufacturing method thereof
JP2000315823A (en) * 1999-04-30 2000-11-14 Runaraito Kk Light emitting diode and manufacture thereof
US7365371B2 (en) * 2005-08-04 2008-04-29 Cree, Inc. Packages for semiconductor light emitting devices utilizing dispensed encapsulants
JP2007184319A (en) * 2006-01-04 2007-07-19 Showa Denko Kk Semiconductor light emitting device
KR101114719B1 (en) * 2010-08-09 2012-02-29 엘지이노텍 주식회사 Light emitting device and lighing system
US20130009191A1 (en) * 2011-07-04 2013-01-10 Lite-On Singapore Pte. Ltd. Surface mounted led package and manufacturing method therefor
JP2013030572A (en) * 2011-07-28 2013-02-07 Sharp Corp Light emitting device and manufacturing method of the same

Also Published As

Publication number Publication date
JP2015170679A (en) 2015-09-28

Similar Documents

Publication Publication Date Title
JP4989614B2 (en) High power LED package manufacturing method
JP4706085B2 (en) Semiconductor light emitting module and manufacturing method thereof
JP5842813B2 (en) Light emitting device and method for manufacturing light emitting device
JP5994472B2 (en) Light emitting device
WO2013168802A1 (en) Led module
EP2197048B1 (en) Light-emitting device
KR20120015415A (en) Light emitting device and lighing system
US9806239B2 (en) Light emitting device
US9425373B2 (en) Light emitting module
JP2014187081A (en) Light-emitting device
JP2014229759A (en) Light emitting device
JP2016122693A (en) Light emission device
JP2017118081A (en) Light-emitting device
JP5347681B2 (en) Light emitting device
JP2017098509A (en) Substrate for placing element and light-emitting device
JP6225910B2 (en) Light emitting device
JP6521032B2 (en) Optical semiconductor device and method of manufacturing the same
JP6303457B2 (en) Light emitting device and manufacturing method thereof
JP6326830B2 (en) Light emitting device and lighting device including the same
JP5233478B2 (en) Light emitting device
JP6402890B2 (en) Light emitting device and manufacturing method thereof
JP5359662B2 (en) Light emitting device and manufacturing method thereof
JP5747947B2 (en) Light emitting device and manufacturing method thereof
JP6399057B2 (en) Light emitting device
JP2011060801A (en) Light-emitting device and method of manufacturing the same

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20170207

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20171127

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20171205

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20180125

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20180402

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20180521

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20180605

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20180718

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20180816

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20180829

R150 Certificate of patent or registration of utility model

Ref document number: 6402890

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250