JPS6457660U - - Google Patents
Info
- Publication number
- JPS6457660U JPS6457660U JP1987150708U JP15070887U JPS6457660U JP S6457660 U JPS6457660 U JP S6457660U JP 1987150708 U JP1987150708 U JP 1987150708U JP 15070887 U JP15070887 U JP 15070887U JP S6457660 U JPS6457660 U JP S6457660U
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- reflector
- emitting element
- tip
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011810 insulating material Substances 0.000 claims description 2
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 claims 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Description
第１図は本考案の一実施例の発光ダイオードの
断面図、第２図は、従来の発光ダイオードの断面
図である。
１，１１……発光素子、２，１２……外部リー
ド（アノード）、４，１４……反射板付リード（
カソード）、１５……エポキシ樹脂、６……絶縁
物質。
FIG. 1 is a sectional view of a light emitting diode according to an embodiment of the present invention, and FIG. 2 is a sectional view of a conventional light emitting diode. 1, 11... Light emitting element, 2, 12... External lead (anode), 4, 14... Lead with reflector (
cathode), 15... epoxy resin, 6... insulating material.
Claims (1)
反射板に固定された発光素子と、前記発光素子の
一方の電極にボンデイング線を介して電気的に接
続された外部リードとを備えている樹脂封止型の
半導体発光装置において、発光素子を固定する前
記反射板の先端部に絶縁物質が被覆されたことを
特徴とする半導体発光装置。 A resin comprising a lead with a reflector having a reflector at its tip, a light emitting element fixed to the reflector, and an external lead electrically connected to one electrode of the light emitting element via a bonding wire. What is claimed is: 1. A sealed semiconductor light emitting device, characterized in that a tip of the reflector for fixing a light emitting element is coated with an insulating material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987150708U JPS6457660U (en) | 1987-09-30 | 1987-09-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987150708U JPS6457660U (en) | 1987-09-30 | 1987-09-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6457660U true JPS6457660U (en) | 1989-04-10 |
Family
ID=31424092
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987150708U Pending JPS6457660U (en) | 1987-09-30 | 1987-09-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6457660U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04111767U (en) * | 1991-03-14 | 1992-09-29 | 株式会社小糸製作所 | Mounting structure of chip type light emitting diode |
| JP2015170679A (en) * | 2014-03-06 | 2015-09-28 | 日亜化学工業株式会社 | Light-emitting device and manufacturing method for the same |
-
1987
- 1987-09-30 JP JP1987150708U patent/JPS6457660U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04111767U (en) * | 1991-03-14 | 1992-09-29 | 株式会社小糸製作所 | Mounting structure of chip type light emitting diode |
| JP2015170679A (en) * | 2014-03-06 | 2015-09-28 | 日亜化学工業株式会社 | Light-emitting device and manufacturing method for the same |