JPS633155U - - Google Patents
Info
- Publication number
- JPS633155U JPS633155U JP9787186U JP9787186U JPS633155U JP S633155 U JPS633155 U JP S633155U JP 9787186 U JP9787186 U JP 9787186U JP 9787186 U JP9787186 U JP 9787186U JP S633155 U JPS633155 U JP S633155U
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- rod
- diode element
- shaped
- bottom part
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 239000011521 glass Substances 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図は本考案の一実施例を示す断面図、第２
図は従来のリードレスダイオードの一例を示す断
面図である。
４……電極、５……樹脂、６……盛電極、７…
…電極、８……ダイオードチツプ、９……電極、
１０……電極、１１……盛電極、１２……ダイオ
ードチツプ、１３……ガラスバルブ。
Fig. 1 is a sectional view showing one embodiment of the present invention;
The figure is a cross-sectional view showing an example of a conventional leadless diode. 4... Electrode, 5... Resin, 6... Mold electrode, 7...
...electrode, 8...diode chip, 9...electrode,
10... Electrode, 11... Mold electrode, 12... Diode chip, 13... Glass bulb.
Claims (1)
を有する第一の電極と、底部を有する円筒状の第
二の電極とを備え、前記第二の電極の前記底部上
にダイオード素子を搭載し、前記第一の電極の前
記棒状部の先端を前記ダイオード素子の頂部の電
極に接触させて電気的に接続し、前記棒状部と前
記第二の電極の円筒部との間に樹脂を充填して前
記ダイオード素子を封止したことを特徴とするリ
ードレスダイオード。 A first electrode having a rod-shaped part protruding from the center of a disc-shaped base, and a cylindrical second electrode having a bottom part, and a diode element is mounted on the bottom part of the second electrode. The tip of the rod-shaped portion of the first electrode is electrically connected by contacting the top electrode of the diode element, and a resin is filled between the rod-shaped portion and the cylindrical portion of the second electrode. A leadless diode, characterized in that the diode element is sealed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9787186U JPS633155U (en) | 1986-06-25 | 1986-06-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9787186U JPS633155U (en) | 1986-06-25 | 1986-06-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS633155U true JPS633155U (en) | 1988-01-11 |
Family
ID=30965271
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9787186U Pending JPS633155U (en) | 1986-06-25 | 1986-06-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS633155U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02114938U (en) * | 1989-03-03 | 1990-09-14 |
-
1986
- 1986-06-25 JP JP9787186U patent/JPS633155U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02114938U (en) * | 1989-03-03 | 1990-09-14 |