JPS63100841U - - Google Patents
Info
- Publication number
- JPS63100841U JPS63100841U JP19564186U JP19564186U JPS63100841U JP S63100841 U JPS63100841 U JP S63100841U JP 19564186 U JP19564186 U JP 19564186U JP 19564186 U JP19564186 U JP 19564186U JP S63100841 U JPS63100841 U JP S63100841U
- Authority
- JP
- Japan
- Prior art keywords
- ceramic substrate
- integrated circuit
- circuit device
- hybrid integrated
- insulating material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000919 ceramic Substances 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 3
- 239000011810 insulating material Substances 0.000 claims description 2
- 239000000463 material Substances 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 1
- 239000008188 pellet Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図は本考案の一実施例で、ａは部品搭載前
のセラミツク基板の下面を示す図、ｂは部品搭載
後の混成集積回路装置の平面図、ｃはその縦断面
図、第２図は従来例である。
１……セラミツク基板、２……プリコート材、
３(1)〜３(3)，３′(1)〜３′(2)……導電部、４
……スルーホール、５……絶縁材、６……ペレツ
ト、７……部品、８……半田、９……ボンデイン
グワイヤ。
FIG. 1 shows an embodiment of the present invention, in which a is a diagram showing the bottom surface of a ceramic substrate before components are mounted, b is a plan view of the hybrid integrated circuit device after components are mounted, and c is a vertical cross-sectional view thereof. is a conventional example. 1... Ceramic substrate, 2... Precoat material,
3(1) to 3(3), 3'(1) to 3'(2)... Conductive part, 4
...Through hole, 5...Insulating material, 6...Pellet, 7...Parts, 8...Solder, 9...Bonding wire.
Claims (1)
ミツク基板の所定部位内にあるスルーホールが絶
縁材で充填されていて、前記所定部位内に搭載さ
れた各種部品がプリコート材でおおわれた構造を
有することを特徴とする混成集積回路装置。 The ceramic substrate has a structure in which the through holes are filled with an insulating material and the various components mounted in the predetermined regions are covered with a precoat material. A hybrid integrated circuit device characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19564186U JPS63100841U (en) | 1986-12-18 | 1986-12-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19564186U JPS63100841U (en) | 1986-12-18 | 1986-12-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63100841U true JPS63100841U (en) | 1988-06-30 |
Family
ID=31153712
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19564186U Pending JPS63100841U (en) | 1986-12-18 | 1986-12-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63100841U (en) |
-
1986
- 1986-12-18 JP JP19564186U patent/JPS63100841U/ja active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS63100841U (en) | ||
| JPS6338328U (en) | ||
| JPS63187330U (en) | ||
| JPS5933254U (en) | semiconductor equipment | |
| JPS63195743U (en) | ||
| JPS62145337U (en) | ||
| JPH0451145U (en) | ||
| JPH022835U (en) | ||
| JPS6448051U (en) | ||
| JPH0338633U (en) | ||
| JPS61153374U (en) | ||
| JPH0173936U (en) | ||
| JPS61114842U (en) | ||
| JPH02114941U (en) | ||
| JPS63155634U (en) | ||
| JPH0160551U (en) | ||
| JPS6316455U (en) | ||
| JPS59125835U (en) | semiconductor equipment | |
| JPH0275739U (en) | ||
| JPS633155U (en) | ||
| JPS63153550U (en) | ||
| JPS64332U (en) | ||
| JPH03120052U (en) | ||
| JPH0348235U (en) | ||
| JPS61123544U (en) |