JPS63153550U - - Google Patents
Info
- Publication number
- JPS63153550U JPS63153550U JP4557387U JP4557387U JPS63153550U JP S63153550 U JPS63153550 U JP S63153550U JP 4557387 U JP4557387 U JP 4557387U JP 4557387 U JP4557387 U JP 4557387U JP S63153550 U JPS63153550 U JP S63153550U
- Authority
- JP
- Japan
- Prior art keywords
- package
- ceramic substrate
- film hybrid
- hole
- thick
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000919 ceramic Substances 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 239000004020 conductor Substances 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案の一実施例を示す厚膜混成ＩＣ
の実装断面図、第２図および第３図は従来例を示
す厚膜混成ＩＣの実装断面図である。
１……セラミツク基板、２……貫通孔、３……
ＩＣパツケージのモールド部、４……ＩＣパツケ
ージのリードフレーム、５……導体ランド、６…
…半田。
Figure 1 shows a thick film hybrid IC showing an embodiment of the present invention.
FIGS. 2 and 3 are cross-sectional views of a conventional thick film hybrid IC. 1...Ceramic substrate, 2...Through hole, 3...
Mold part of IC package, 4...Lead frame of IC package, 5...Conductor land, 6...
…solder.
Claims (1)
の翼状のリードフレームを有するＩＣパツケージ
を実装する厚膜混成ＩＣにおいて、ＩＣパツケー
ジに対向するセラミツク基板に、ＩＣパツケージ
のモールド部よりやや大きい貫通孔を設け、モー
ルド部全体が貫通孔に入るようにＩＣパツケージ
の上下を反転させて実装したことを特徴とする厚
膜混成ＩＣの構造。 In a thick-film hybrid IC in which an IC package having a seagull wing-shaped lead frame is mounted on a ceramic substrate using solder connection technology, a through hole slightly larger than the mold part of the IC package is provided in the ceramic substrate facing the IC package. A thick film hybrid IC structure characterized in that the IC package is mounted upside down so that the entire part fits into the through hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4557387U JPS63153550U (en) | 1987-03-30 | 1987-03-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4557387U JPS63153550U (en) | 1987-03-30 | 1987-03-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63153550U true JPS63153550U (en) | 1988-10-07 |
Family
ID=30864431
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4557387U Pending JPS63153550U (en) | 1987-03-30 | 1987-03-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63153550U (en) |
-
1987
- 1987-03-30 JP JP4557387U patent/JPS63153550U/ja active Pending