JPS642452U - - Google Patents
Info
- Publication number
- JPS642452U JPS642452U JP9759087U JP9759087U JPS642452U JP S642452 U JPS642452 U JP S642452U JP 9759087 U JP9759087 U JP 9759087U JP 9759087 U JP9759087 U JP 9759087U JP S642452 U JPS642452 U JP S642452U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- circuit board
- printed circuit
- view
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 8
- 229920005989 resin Polymers 0.000 claims description 8
- 238000007789 sealing Methods 0.000 claims description 5
- 239000004065 semiconductor Substances 0.000 claims description 5
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第１図ａ，ｂは本考案に係る半導体装置の樹脂
封止前の状態を示す正面図と側面図、第２図ａ，
ｂは同じく樹脂封止後の状態を示す正面図と側面
図、第３図ａ，ｂはプリント基板に実装された状
態を一部を断面して示す正面図と側面図、第４図
は樹脂封止前の樹脂コーテイング型半導体装置を
示す正面図と側面図、第５図ａ，ｂは樹脂封止後
の状態を示す正面図と側面図、第６図ａ，ｂはプ
リント基板に実装された状態を一部を断面して示
す正面図と側面図である。
６……コーテイング樹脂、７……プリント基板
、１１……樹脂コーテイング型半導体装置、１２
……リード端子、１２ａ……基部、１２ｃ……括
れ部。
1a and 1b are a front view and a side view showing the state of the semiconductor device according to the present invention before being sealed with resin, and FIGS. 2a and 2b are
Similarly, b is a front view and a side view showing the state after resin sealing, Fig. 3 a and b are a front view and side view partially showing the state mounted on a printed circuit board, and Fig. 4 is a resin sealing state. A front view and a side view showing a resin-coated semiconductor device before sealing, FIGS. 5a and 5b are a front view and a side view showing the state after resin sealing, and FIGS. FIG. 4 is a front view and a side view showing a partially sectional state. 6... Coating resin, 7... Printed circuit board, 11... Resin coated semiconductor device, 12
... Lead terminal, 12a ... Base, 12c ... Constriction.
Claims (1)
るリードを有する半導体装置において、前記リー
ドの基部にプリント基板と当接する位置決め用突
起を設けると共に、この突起の封止樹脂で覆われ
る部位に括れを設けたことを特徴とする半導体装
置。 In a semiconductor device that is entirely resin-sealed and has a lead that is inserted into a printed circuit board, a positioning protrusion that contacts the printed circuit board is provided at the base of the lead, and a portion of the protrusion that is covered with the sealing resin is tightened. A semiconductor device characterized by being provided with.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9759087U JPS642452U (en) | 1987-06-24 | 1987-06-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9759087U JPS642452U (en) | 1987-06-24 | 1987-06-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS642452U true JPS642452U (en) | 1989-01-09 |
Family
ID=31323159
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9759087U Pending JPS642452U (en) | 1987-06-24 | 1987-06-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS642452U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09102654A (en) * | 1995-10-04 | 1997-04-15 | Teikoku Tsushin Kogyo Co Ltd | Resin molding to be mounted on flexible board |
-
1987
- 1987-06-24 JP JP9759087U patent/JPS642452U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09102654A (en) * | 1995-10-04 | 1997-04-15 | Teikoku Tsushin Kogyo Co Ltd | Resin molding to be mounted on flexible board |