JPS62158836U - - Google Patents
Info
- Publication number
- JPS62158836U JPS62158836U JP1986046741U JP4674186U JPS62158836U JP S62158836 U JPS62158836 U JP S62158836U JP 1986046741 U JP1986046741 U JP 1986046741U JP 4674186 U JP4674186 U JP 4674186U JP S62158836 U JPS62158836 U JP S62158836U
- Authority
- JP
- Japan
- Prior art keywords
- lead wire
- external lead
- board
- wire
- film board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 5
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Wire Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案の回路基板の一部切欠平面図、
第２図は第１図の―線断面図、第３図、第４
図、第５図は他の実施例を示す平面図、第６図は
第４図の―線断面図である。
尚、図中、１：回路基板（フイルムキヤリア）
、２：フイルム板、３：配線部、４：外部リード
線、５：インナーリード線、６：連結線、７：熱
圧着用開口部を夫々示す。
FIG. 1 is a partially cutaway plan view of the circuit board of the present invention.
Figure 2 is a sectional view taken along the - line in Figure 1, Figures 3 and 4.
5 is a plan view showing another embodiment, and FIG. 6 is a sectional view taken along the line -- in FIG. 4. In addition, in the figure, 1: Circuit board (film carrier)
, 2: film board, 3: wiring section, 4: external lead wire, 5: inner lead wire, 6: connecting wire, and 7: opening for thermocompression, respectively.
Claims (1)
、連結線によりなる配線部が配列形成された回路
基板において、該外部リード線のフイルム板に熱
圧着用開口部を開穿したことを特徴とする回路基
板。 A circuit board in which a wiring section consisting of an external lead wire, an inner lead wire, and a connecting wire is arranged and formed on a film board, characterized in that an opening for thermocompression is formed in the film board for the external lead wire. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986046741U JPS62158836U (en) | 1986-03-28 | 1986-03-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986046741U JPS62158836U (en) | 1986-03-28 | 1986-03-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62158836U true JPS62158836U (en) | 1987-10-08 |
Family
ID=30866683
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986046741U Pending JPS62158836U (en) | 1986-03-28 | 1986-03-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62158836U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01217933A (en) * | 1988-02-26 | 1989-08-31 | Hitachi Ltd | Tape carrier |
| JPH0278346U (en) * | 1988-12-01 | 1990-06-15 |
-
1986
- 1986-03-28 JP JP1986046741U patent/JPS62158836U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01217933A (en) * | 1988-02-26 | 1989-08-31 | Hitachi Ltd | Tape carrier |
| JPH0278346U (en) * | 1988-12-01 | 1990-06-15 |