JPS62158835U - - Google Patents
Info
- Publication number
- JPS62158835U JPS62158835U JP1986046740U JP4674086U JPS62158835U JP S62158835 U JPS62158835 U JP S62158835U JP 1986046740 U JP1986046740 U JP 1986046740U JP 4674086 U JP4674086 U JP 4674086U JP S62158835 U JPS62158835 U JP S62158835U
- Authority
- JP
- Japan
- Prior art keywords
- lead wires
- film
- board
- wires
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 2
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Wire Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案の回路基板の一部切欠平面図、
第２図は第１図の―線断面図、第３図、第４
図、第５図は他の実施例を示す平面図、第６図は
第４図の―線断面図、第７図は従来例を示す
断面図である。
尚、図中、Ａ：半導体装置、１：基板、２：回
路基板（フイルムキヤリア）、２ａ：フイルム板
、３：配線部、４：外部リード線、５：インナリ
ード線、６：連結線、ａ：ＩＣチツプを夫々示す
。
FIG. 1 is a partially cutaway plan view of the circuit board of the present invention.
Figure 2 is a sectional view taken along the line - - of Figure 1, Figures 3 and 4.
5 is a plan view showing another embodiment, FIG. 6 is a sectional view taken along the line -- in FIG. 4, and FIG. 7 is a sectional view showing a conventional example. In the figure, A: semiconductor device, 1: substrate, 2: circuit board (film carrier), 2a: film board, 3: wiring section, 4: external lead wire, 5: inner lead wire, 6: connecting wire, a: Indicates each IC chip.
Claims (1)
インナーリード線、連結線よりなる配線部を配列
形成したフイルム状の回路基板を装置し、該外部
リード線をフイルム板により一体的に連結して形
成した半導体装置。 External lead wires are attached to the board on which the IC chip is mounted.
A semiconductor device comprising a film-like circuit board on which a wiring section consisting of inner lead wires and connecting wires is arranged, and the outer lead wires are integrally connected by a film plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986046740U JPS62158835U (en) | 1986-03-28 | 1986-03-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986046740U JPS62158835U (en) | 1986-03-28 | 1986-03-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62158835U true JPS62158835U (en) | 1987-10-08 |
Family
ID=30866681
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986046740U Pending JPS62158835U (en) | 1986-03-28 | 1986-03-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62158835U (en) |
-
1986
- 1986-03-28 JP JP1986046740U patent/JPS62158835U/ja active Pending