JPS63195743U - - Google Patents
Info
- Publication number
- JPS63195743U JPS63195743U JP1987087253U JP8725387U JPS63195743U JP S63195743 U JPS63195743 U JP S63195743U JP 1987087253 U JP1987087253 U JP 1987087253U JP 8725387 U JP8725387 U JP 8725387U JP S63195743 U JPS63195743 U JP S63195743U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- integrated circuit
- circuit device
- hybrid integrated
- sealing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 6
- 229920005989 resin Polymers 0.000 claims description 6
- 238000007789 sealing Methods 0.000 claims description 3
- 239000002184 metal Substances 0.000 description 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Description
第１図は本考案による混成集積回路装置の実施
例１の縦断面図、第２図は実施例２の縦断面図、
第３図は金属ケースを用いて電気的にシールドし
た従来からの混成集積回路装置の縦断面図である
。
１……配線基板、２……能動素子、３……受動
素子、４……外部端子、５……封止樹脂、６，６
′……導電性樹脂、７……プリコート樹脂、８…
…金属ケース。
FIG. 1 is a longitudinal sectional view of Embodiment 1 of a hybrid integrated circuit device according to the present invention, FIG. 2 is a longitudinal sectional view of Embodiment 2,
FIG. 3 is a longitudinal sectional view of a conventional hybrid integrated circuit device electrically shielded using a metal case. 1... Wiring board, 2... Active element, 3... Passive element, 4... External terminal, 5... Sealing resin, 6, 6
'... Conductive resin, 7... Precoat resin, 8...
...Metal case.
Claims (1)
いて、該封止樹脂の上からさらに、導電性を有す
る樹脂にて、該混成集積回路装置を覆うことを特
徴とする混成集積回路装置。 A hybrid integrated circuit device formed by resin sealing, characterized in that the hybrid integrated circuit device is further covered with a conductive resin from above the sealing resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987087253U JPS63195743U (en) | 1987-06-04 | 1987-06-04 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987087253U JPS63195743U (en) | 1987-06-04 | 1987-06-04 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63195743U true JPS63195743U (en) | 1988-12-16 |
Family
ID=30944305
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987087253U Pending JPS63195743U (en) | 1987-06-04 | 1987-06-04 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63195743U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03167868A (en) * | 1989-11-28 | 1991-07-19 | Nec Corp | Integrated circuit device provided with shielding function; apparatus and method for its manufacture |
| JP2012160572A (en) * | 2011-01-31 | 2012-08-23 | Tdk Corp | Electronic circuit module component and manufacturing method of the same |
-
1987
- 1987-06-04 JP JP1987087253U patent/JPS63195743U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03167868A (en) * | 1989-11-28 | 1991-07-19 | Nec Corp | Integrated circuit device provided with shielding function; apparatus and method for its manufacture |
| JP2012160572A (en) * | 2011-01-31 | 2012-08-23 | Tdk Corp | Electronic circuit module component and manufacturing method of the same |