JPS63164242U - - Google Patents
Info
- Publication number
- JPS63164242U JPS63164242U JP5684287U JP5684287U JPS63164242U JP S63164242 U JPS63164242 U JP S63164242U JP 5684287 U JP5684287 U JP 5684287U JP 5684287 U JP5684287 U JP 5684287U JP S63164242 U JPS63164242 U JP S63164242U
- Authority
- JP
- Japan
- Prior art keywords
- terminal
- lead
- groove
- thick film
- creeping
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第１図ａ，ｂは本考案の一実施例の正面図及び
側面図である。
１……厚膜基板、２……端子取付け部、３……
リード、４……溝、５……樹脂、１０……リード
端子。
Figures 1a and 1b are front and side views of an embodiment of the present invention. 1... Thick film board, 2... Terminal mounting part, 3...
Lead, 4...Groove, 5...Resin, 10...Lead terminal.
Claims (1)
回路において、前記リード端子の端子取付け部近
傍には樹脂のはい上りを防止するための溝が形成
されていることを特徴とする混成集積回路。 1. A hybrid integrated circuit in which lead terminals are attached to a thick film substrate, characterized in that a groove is formed near a terminal attachment portion of the lead terminal to prevent resin from creeping up.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5684287U JPS63164242U (en) | 1987-04-14 | 1987-04-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5684287U JPS63164242U (en) | 1987-04-14 | 1987-04-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63164242U true JPS63164242U (en) | 1988-10-26 |
Family
ID=30886021
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5684287U Pending JPS63164242U (en) | 1987-04-14 | 1987-04-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63164242U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001230453A (en) * | 1999-12-08 | 2001-08-24 | Nichia Chem Ind Ltd | Led lamp and its manufacturing method |
| US11791244B2 (en) | 2019-04-19 | 2023-10-17 | Sansha Electric Manufacturing Co., Ltd. | Semiconductor-module external terminal |
-
1987
- 1987-04-14 JP JP5684287U patent/JPS63164242U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001230453A (en) * | 1999-12-08 | 2001-08-24 | Nichia Chem Ind Ltd | Led lamp and its manufacturing method |
| US11791244B2 (en) | 2019-04-19 | 2023-10-17 | Sansha Electric Manufacturing Co., Ltd. | Semiconductor-module external terminal |