JPH0270464U - - Google Patents
Info
- Publication number
- JPH0270464U JPH0270464U JP15053388U JP15053388U JPH0270464U JP H0270464 U JPH0270464 U JP H0270464U JP 15053388 U JP15053388 U JP 15053388U JP 15053388 U JP15053388 U JP 15053388U JP H0270464 U JPH0270464 U JP H0270464U
- Authority
- JP
- Japan
- Prior art keywords
- board
- sides
- element chip
- semiconductor element
- view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 8
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 239000000758 substrate Substances 0.000 description 1
Description
第１図は本考案によるＳＭＴ半導体装置の一実
施例を示し、Ａは正面図、Ｂは右側面図、Ｃは背
面図である。第２図は本考案によるＳＭＴ半導体
装置の他の実施例を示し、Ａは正面図、Ｂは右側
面図、Ｃは背面図である。第３図は従来のＳＭＴ
半導体装置の一例を示すもので、Ａは正面図、Ｂ
は右側面図、Ｃは背面図である。
１０……ＳＭＴ半導体装置；１１……基板；１
２，１２′……アノード；１３，１３′……カソ
ード；１４，１４′……半導体素子チツプ；１５
，１５′……外側形状；１６……スルーホール；
１７……導電部。
FIG. 1 shows an embodiment of the SMT semiconductor device according to the present invention, in which A is a front view, B is a right side view, and C is a rear view. FIG. 2 shows another embodiment of the SMT semiconductor device according to the present invention, in which A is a front view, B is a right side view, and C is a rear view. Figure 3 shows conventional SMT
This shows an example of a semiconductor device, where A is a front view and B is a front view.
C is a right side view, and C is a rear view. 10...SMT semiconductor device; 11...substrate; 1
2, 12'... Anode; 13, 13'... Cathode; 14, 14'... Semiconductor element chip; 15
, 15'...Outer shape; 16...Through hole;
17... Conductive part.
Claims (1)
表面実装型半導体装置において、上記基板の両面
上に半導体素子のチツプが取り付けられ、基板の
両側を樹脂にてモールドしたことを特徴とする表
面実装型半導体装置。 A surface-mounted semiconductor device in which a semiconductor element chip is mounted on a double-sided board, characterized in that the semiconductor element chip is mounted on both sides of the board, and both sides of the board are molded with resin. Device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15053388U JPH0270464U (en) | 1988-11-18 | 1988-11-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15053388U JPH0270464U (en) | 1988-11-18 | 1988-11-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0270464U true JPH0270464U (en) | 1990-05-29 |
Family
ID=31423770
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15053388U Pending JPH0270464U (en) | 1988-11-18 | 1988-11-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0270464U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10107326A (en) * | 1996-09-30 | 1998-04-24 | Sharp Corp | Side-face light-emitting type led lamp |
| JP2003229603A (en) * | 2002-01-31 | 2003-08-15 | Citizen Electronics Co Ltd | Double-sided emitting led package |
| JP2007087991A (en) * | 2005-09-20 | 2007-04-05 | Rohm Co Ltd | Light receiving module |
-
1988
- 1988-11-18 JP JP15053388U patent/JPH0270464U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10107326A (en) * | 1996-09-30 | 1998-04-24 | Sharp Corp | Side-face light-emitting type led lamp |
| JP2003229603A (en) * | 2002-01-31 | 2003-08-15 | Citizen Electronics Co Ltd | Double-sided emitting led package |
| JP2007087991A (en) * | 2005-09-20 | 2007-04-05 | Rohm Co Ltd | Light receiving module |