JPH0215702U - - Google Patents
Info
- Publication number
- JPH0215702U JPH0215702U JP9416388U JP9416388U JPH0215702U JP H0215702 U JPH0215702 U JP H0215702U JP 9416388 U JP9416388 U JP 9416388U JP 9416388 U JP9416388 U JP 9416388U JP H0215702 U JPH0215702 U JP H0215702U
- Authority
- JP
- Japan
- Prior art keywords
- chip resistor
- electrode
- solder
- adhere
- integrated circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Landscapes
- Details Of Resistors (AREA)
- Non-Adjustable Resistors (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図ａ，ｂは本考案の一実施例による縦断面
図および同図ａのＡ―Ａ線での断面図、第２図ａ
，ｂは本考案の他の実施例による縦断面図および
同図ａのＡ―Ａ線での断面図、第３図ａ，ｂは従
来のチツプ抵抗の縦断面図および同図ａのＡ―Ａ
線での断面図である。
１……回路基板、１１……導体、２，２１，２
２……電極、２３……電極除去部分、２４……樹
脂コーテング部分、３……チツプ抵抗。
Figures 1a and b are a longitudinal cross-sectional view of one embodiment of the present invention, a cross-sectional view taken along the line A--A in Figure a, and Figure 2a.
, b are longitudinal cross-sectional views according to other embodiments of the present invention and cross-sectional views taken along the line A--A in FIG. A
FIG. 1... Circuit board, 11... Conductor, 2, 21, 2
2... Electrode, 23... Electrode removed portion, 24... Resin coating portion, 3... Chip resistor.
Claims (1)
、該チツプ抵抗の電極の一部に半田が付着しない
部分を形成したことを特徴とするチツプ抵抗。 1. A chip resistor mounted on a hybrid integrated circuit, characterized in that a portion of an electrode of the chip resistor is formed with a portion to which solder does not adhere.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9416388U JPH0215702U (en) | 1988-07-15 | 1988-07-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9416388U JPH0215702U (en) | 1988-07-15 | 1988-07-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0215702U true JPH0215702U (en) | 1990-01-31 |
Family
ID=31318664
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9416388U Pending JPH0215702U (en) | 1988-07-15 | 1988-07-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0215702U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005251904A (en) * | 2004-03-03 | 2005-09-15 | Denso Corp | Substrate front surface mounting part, substrate circuit, substrate, solder connecting method and method of manufacturing substrate circuit |
| WO2022190879A1 (en) * | 2021-03-12 | 2022-09-15 | Koa株式会社 | Mounting structure for chip component |
-
1988
- 1988-07-15 JP JP9416388U patent/JPH0215702U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005251904A (en) * | 2004-03-03 | 2005-09-15 | Denso Corp | Substrate front surface mounting part, substrate circuit, substrate, solder connecting method and method of manufacturing substrate circuit |
| WO2022190879A1 (en) * | 2021-03-12 | 2022-09-15 | Koa株式会社 | Mounting structure for chip component |