JPH01176942U - - Google Patents
Info
- Publication number
- JPH01176942U JPH01176942U JP7351888U JP7351888U JPH01176942U JP H01176942 U JPH01176942 U JP H01176942U JP 7351888 U JP7351888 U JP 7351888U JP 7351888 U JP7351888 U JP 7351888U JP H01176942 U JPH01176942 U JP H01176942U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- groove
- coating layer
- resin coating
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011247 coating layer Substances 0.000 claims description 2
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図はこの考案の一実施例を示す拡大縦断側
面図、第２図は同上の回路基板の一部を切欠した
拡大斜視図、第３図は他の実施例を示す拡大縦断
側面図、第４図は従来の混成集積回路装置の一例
を示す拡大縦断側面図である。
１１…回路基板、１２…回路電極、１３…集積
回路、１４…ワイヤー、１５…溝、１６…樹脂コ
ーテイング層、１７…電極、１８…内部配線。
FIG. 1 is an enlarged vertical side view showing one embodiment of the invention, FIG. 2 is an enlarged perspective view with a part of the same circuit board cut away, and FIG. 3 is an enlarged longitudinal side view showing another embodiment. FIG. 4 is an enlarged longitudinal sectional side view showing an example of a conventional hybrid integrated circuit device. DESCRIPTION OF SYMBOLS 11... Circuit board, 12... Circuit electrode, 13... Integrated circuit, 14... Wire, 15... Groove, 16... Resin coating layer, 17... Electrode, 18... Internal wiring.
Claims (1)
、該集積回路の周囲の基板上に溝を形成し、この
溝を含む集積回路全体を覆う樹脂コーテイング層
を設けたことを特徴とする混成集積回路装置。 A hybrid integrated circuit device in which an integrated circuit is mounted on a circuit board, characterized in that a groove is formed on the substrate around the integrated circuit, and a resin coating layer is provided to cover the entire integrated circuit including the groove. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7351888U JPH01176942U (en) | 1988-06-02 | 1988-06-02 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7351888U JPH01176942U (en) | 1988-06-02 | 1988-06-02 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01176942U true JPH01176942U (en) | 1989-12-18 |
Family
ID=31298659
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7351888U Pending JPH01176942U (en) | 1988-06-02 | 1988-06-02 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01176942U (en) |
-
1988
- 1988-06-02 JP JP7351888U patent/JPH01176942U/ja active Pending
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