JPH0187544U - - Google Patents
Info
- Publication number
- JPH0187544U JPH0187544U JP18398187U JP18398187U JPH0187544U JP H0187544 U JPH0187544 U JP H0187544U JP 18398187 U JP18398187 U JP 18398187U JP 18398187 U JP18398187 U JP 18398187U JP H0187544 U JPH0187544 U JP H0187544U
- Authority
- JP
- Japan
- Prior art keywords
- aluminum wiring
- wiring layer
- integrated circuit
- semiconductor integrated
- circuit device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 5
- 229910052782 aluminium Inorganic materials 0.000 claims description 5
- 239000004065 semiconductor Substances 0.000 claims description 2
- 239000012212 insulator Substances 0.000 description 1
Landscapes
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Semiconductor Integrated Circuits (AREA)
Description
第１図は、本考案の半導体集積回路装置におけ
るアルミ配線で、第２図は、第１図の断面図であ
る。第３図は、従来のアルミ配線の断面図である
。
各図の名称を下記に示す。１……絶縁体、２…
…他層による配線２、３……アルミ配線。
FIG. 1 shows aluminum wiring in a semiconductor integrated circuit device of the present invention, and FIG. 2 is a sectional view of FIG. 1. FIG. 3 is a cross-sectional view of a conventional aluminum wiring. The name of each figure is shown below. 1...Insulator, 2...
...Wiring 2 and 3 using other layers...Aluminum wiring.
Claims (1)
ルミ配線層長手方向に沿つて形成することを特徴
とする半導体集積回路装置。 A semiconductor integrated circuit device characterized in that a pattern of another layer is formed below an aluminum wiring layer along the longitudinal direction of the aluminum wiring layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18398187U JPH0187544U (en) | 1987-12-01 | 1987-12-01 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18398187U JPH0187544U (en) | 1987-12-01 | 1987-12-01 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0187544U true JPH0187544U (en) | 1989-06-09 |
Family
ID=31475376
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18398187U Pending JPH0187544U (en) | 1987-12-01 | 1987-12-01 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0187544U (en) |
-
1987
- 1987-12-01 JP JP18398187U patent/JPH0187544U/ja active Pending