JPS63119246U - - Google Patents
Info
- Publication number
- JPS63119246U JPS63119246U JP1163687U JP1163687U JPS63119246U JP S63119246 U JPS63119246 U JP S63119246U JP 1163687 U JP1163687 U JP 1163687U JP 1163687 U JP1163687 U JP 1163687U JP S63119246 U JPS63119246 U JP S63119246U
- Authority
- JP
- Japan
- Prior art keywords
- wiring
- insulating film
- semiconductor element
- semiconductor
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 8
- 239000000758 substrate Substances 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Landscapes
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Description
第1図は本考案による半導体装置の一例の要部
の拡大断面図、第2図A〜Fは第1図に示した本
考案による半導体装置を得る製造方法の一例の工
程図である。
1は半導体基板、2は半導体素子、3は第1の
配線、4は絶縁膜、5は第2の配線、6は第3の
配線である。
FIG. 1 is an enlarged sectional view of a main part of an example of a semiconductor device according to the present invention, and FIGS. 2A to 2F are process diagrams of an example of a manufacturing method for obtaining the semiconductor device according to the present invention shown in FIG. 1 is a semiconductor substrate, 2 is a semiconductor element, 3 is a first wiring, 4 is an insulating film, 5 is a second wiring, and 6 is a third wiring.
Claims (1)
配線上の絶縁膜と上端がほぼ同一面を形成する第
2の配線と、 上記絶縁膜上に形成され上記第2の配線と接続
される第3の配線とを有して成る半導体装置。[Claims for Utility Model Registration] A semiconductor element formed on a semiconductor substrate, a first wiring on the semiconductor element, an insulating film connected to the first wiring and on the first wiring, and an upper end thereof. A semiconductor device comprising: a second wiring that forms substantially the same surface; and a third wiring that is formed on the insulating film and connected to the second wiring.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1163687U JPS63119246U (en) | 1987-01-29 | 1987-01-29 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1163687U JPS63119246U (en) | 1987-01-29 | 1987-01-29 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS63119246U true JPS63119246U (en) | 1988-08-02 |
Family
ID=30799033
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1163687U Pending JPS63119246U (en) | 1987-01-29 | 1987-01-29 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS63119246U (en) |
-
1987
- 1987-01-29 JP JP1163687U patent/JPS63119246U/ja active Pending