JPH0179846U - - Google Patents
Info
- Publication number
- JPH0179846U JPH0179846U JP1987176919U JP17691987U JPH0179846U JP H0179846 U JPH0179846 U JP H0179846U JP 1987176919 U JP1987176919 U JP 1987176919U JP 17691987 U JP17691987 U JP 17691987U JP H0179846 U JPH0179846 U JP H0179846U
- Authority
- JP
- Japan
- Prior art keywords
- package
- integrated circuit
- semiconductor device
- semiconductor integrated
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 6
- 239000000463 material Substances 0.000 claims 1
- 239000002184 metal Substances 0.000 description 1
Description
第１図は本考案の実施例の縦断面図、第２図は
従来の半導体装置の縦断面図である。
１……キヤツプ、２……半導体集積回路、３…
…金属配線、４……パツケージ、５……熱伝導層
。
FIG. 1 is a longitudinal sectional view of an embodiment of the present invention, and FIG. 2 is a longitudinal sectional view of a conventional semiconductor device. 1...Cap, 2...Semiconductor integrated circuit, 3...
...Metal wiring, 4...Package, 5...Heat conductive layer.
Claims (1)
、パツケージにフエイスダウン法でマウントされ
た半導体集積回路とパツケージのマウント面との
間に熱伝導性の良い物質層を有することを特徴と
する半導体装置。 A semiconductor device mounted with a semiconductor integrated circuit, characterized in that the semiconductor device has a material layer with good thermal conductivity between the semiconductor integrated circuit mounted on a package by a face-down method and the mounting surface of the package.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987176919U JPH0179846U (en) | 1987-11-18 | 1987-11-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987176919U JPH0179846U (en) | 1987-11-18 | 1987-11-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0179846U true JPH0179846U (en) | 1989-05-29 |
Family
ID=31468613
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987176919U Pending JPH0179846U (en) | 1987-11-18 | 1987-11-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0179846U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09293808A (en) * | 1996-04-25 | 1997-11-11 | Fujitsu Ltd | Semiconductor device |
-
1987
- 1987-11-18 JP JP1987176919U patent/JPH0179846U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09293808A (en) * | 1996-04-25 | 1997-11-11 | Fujitsu Ltd | Semiconductor device |
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