JPS6448095U - - Google Patents
Info
- Publication number
- JPS6448095U JPS6448095U JP14281387U JP14281387U JPS6448095U JP S6448095 U JPS6448095 U JP S6448095U JP 14281387 U JP14281387 U JP 14281387U JP 14281387 U JP14281387 U JP 14281387U JP S6448095 U JPS6448095 U JP S6448095U
- Authority
- JP
- Japan
- Prior art keywords
- thermal conductivity
- case
- board
- surface mount
- heat dissipation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000017525 heat dissipation Effects 0.000 claims 2
- 125000006850 spacer group Chemical group 0.000 claims 1
- 239000004593 Epoxy Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
第１図は本考案の一実施例を示す断面図、第２
図は従来例を示す断面図である。
１……ガラスエポキシ基板、２……表面実装部
品、３……ケース、４……電極リード、５……放
熱フイン。
Fig. 1 is a sectional view showing one embodiment of the present invention;
The figure is a sectional view showing a conventional example. 1...Glass epoxy board, 2...Surface mount component, 3...Case, 4...Electrode lead, 5...Radiating fin.
Claims (1)
の少なくとも一部を熱伝導率の大きな材料からな
るケースで覆い、このケースと前記表面実装部品
との間に熱伝導率の大きな材料からなるスペーサ
を介在させるとともに前記ケースの反対側の面に
放熱フインを設けたことを特徴とする基板の放熱
構造。 Covering at least a part of a board with a low thermal conductivity on which a surface mount component is mounted is covered with a case made of a material with a high thermal conductivity, and a spacer made of a material with a high thermal conductivity is provided between the case and the surface mount component. 1. A heat dissipation structure for a board, characterized in that a heat dissipation fin is provided on the opposite side of the case.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14281387U JPS6448095U (en) | 1987-09-18 | 1987-09-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14281387U JPS6448095U (en) | 1987-09-18 | 1987-09-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6448095U true JPS6448095U (en) | 1989-03-24 |
Family
ID=31409075
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14281387U Pending JPS6448095U (en) | 1987-09-18 | 1987-09-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6448095U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10335863A (en) * | 1997-05-28 | 1998-12-18 | Robert Bosch Gmbh | Control device |
| JPWO2017060944A1 (en) * | 2015-10-05 | 2017-11-30 | 三菱電機株式会社 | Electronic control unit |
| JP2023022516A (en) * | 2021-08-03 | 2023-02-15 | セイコーエプソン株式会社 | Electronics |
| JP2023022515A (en) * | 2021-08-03 | 2023-02-15 | セイコーエプソン株式会社 | Electronics |
-
1987
- 1987-09-18 JP JP14281387U patent/JPS6448095U/ja active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10335863A (en) * | 1997-05-28 | 1998-12-18 | Robert Bosch Gmbh | Control device |
| JPWO2017060944A1 (en) * | 2015-10-05 | 2017-11-30 | 三菱電機株式会社 | Electronic control unit |
| JP2023022516A (en) * | 2021-08-03 | 2023-02-15 | セイコーエプソン株式会社 | Electronics |
| JP2023022515A (en) * | 2021-08-03 | 2023-02-15 | セイコーエプソン株式会社 | Electronics |
| CN115891426A (en) * | 2021-08-03 | 2023-04-04 | 精工爱普生株式会社 | Electronic device |
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