JPS61102039U - - Google Patents

Info

Publication number
JPS61102039U
JPS61102039U JP18608084U JP18608084U JPS61102039U JP S61102039 U JPS61102039 U JP S61102039U JP 18608084 U JP18608084 U JP 18608084U JP 18608084 U JP18608084 U JP 18608084U JP S61102039 U JPS61102039 U JP S61102039U
Authority
JP
Japan
Prior art keywords
main surface
fixed
semiconductor element
metal piece
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP18608084U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP18608084U priority Critical patent/JPS61102039U/ja
Publication of JPS61102039U publication Critical patent/JPS61102039U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/3201—Structure
    • H01L2224/32012—Structure relative to the bonding area, e.g. bond pad
    • H01L2224/32013—Structure relative to the bonding area, e.g. bond pad the layer connector being larger than the bonding area, e.g. bond pad
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Wire Bonding (AREA)
  • Die Bonding (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本考案の一実施例図、第２図は従来装
置の一例図、第３図及び第４図はそれぞれ本考案
の実施例図である。 符号の説明、１……金属配線、２……基板、３
……金属片、４……半導体素子、５……ワイヤ、
６……はんだ、７……ビス、８……ヒートシンク
、９……金属片。 FIG. 1 shows an embodiment of the present invention, FIG. 2 shows an example of a conventional device, and FIGS. 3 and 4 show embodiments of the present invention. Explanation of symbols, 1...Metal wiring, 2...Substrate, 3
...Metal piece, 4...Semiconductor element, 5...Wire,
6...Solder, 7...Screw, 8...Heat sink, 9...Metal piece.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 薄板状の半導体素子の一方の主面上に設けられ
た各電極にそれぞれ接続するように該主面に各金
属片を固着し、また他方の主面にも金属片を固着
し、上記薄板状の半導体素子を基板に垂直に配置
して該基板上に設けられた金属配線に上記各金属
片を固着したことを特徴とする半導体装置。 Each metal piece is fixed to one main surface of a thin plate-shaped semiconductor element so as to be connected to each electrode provided on the main surface, and a metal piece is also fixed to the other main surface of the thin plate-shaped semiconductor element. 1. A semiconductor device characterized in that a semiconductor element is arranged perpendicularly to a substrate, and each metal piece is fixed to a metal wiring provided on the substrate.
JP18608084U 1984-12-10 1984-12-10 Pending JPS61102039U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18608084U JPS61102039U (en) 1984-12-10 1984-12-10

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18608084U JPS61102039U (en) 1984-12-10 1984-12-10

Publications (1)

Publication Number Publication Date
JPS61102039U true JPS61102039U (en) 1986-06-28

Family

ID=30743542

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18608084U Pending JPS61102039U (en) 1984-12-10 1984-12-10

Country Status (1)

Country Link
JP (1) JPS61102039U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015005664A (en) * 2013-06-21 2015-01-08 株式会社東芝 Electronic component and method of manufacturing the same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015005664A (en) * 2013-06-21 2015-01-08 株式会社東芝 Electronic component and method of manufacturing the same

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