JPS6194358U - - Google Patents

Info

Publication number
JPS6194358U
JPS6194358U JP1984179109U JP17910984U JPS6194358U JP S6194358 U JPS6194358 U JP S6194358U JP 1984179109 U JP1984179109 U JP 1984179109U JP 17910984 U JP17910984 U JP 17910984U JP S6194358 U JPS6194358 U JP S6194358U
Authority
JP
Japan
Prior art keywords
heat sink
resin
semiconductor chip
notch
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1984179109U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1984179109U priority Critical patent/JPS6194358U/ja
Publication of JPS6194358U publication Critical patent/JPS6194358U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本考案の一実施例による放熱板の平面
図であり、第２図は従来の樹脂封止半導体装置の
断面図、第３図は従来の樹脂封止半導体装置の平
面図である。 １……放熱板、２……半導体チツプ、３……リ
ード端子、４……金属細線、５……封止樹脂、６
……取りつけ穴、７……切欠部。 FIG. 1 is a plan view of a heat sink according to an embodiment of the present invention, FIG. 2 is a cross-sectional view of a conventional resin-sealed semiconductor device, and FIG. 3 is a plan view of a conventional resin-sealed semiconductor device. . DESCRIPTION OF SYMBOLS 1... Heat sink, 2... Semiconductor chip, 3... Lead terminal, 4... Fine metal wire, 5... Sealing resin, 6
...Mounting hole, 7...Notch.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 半導体チツプを取りつけた放熱板と、該半導体
チツプおよび放熱板の主要部の全面を封止した樹
脂とを有し、前記放熱板には切欠部を備えた取り
つけ用ネジ穴部を有することを特徴とする樹脂封
止半導体装置。 The heat sink has a heat sink to which a semiconductor chip is attached, and a resin that seals the entire surface of the semiconductor chip and the main parts of the heat sink, and the heat sink has a mounting screw hole with a notch. Resin-sealed semiconductor device.
JP1984179109U 1984-11-26 1984-11-26 Pending JPS6194358U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1984179109U JPS6194358U (en) 1984-11-26 1984-11-26

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1984179109U JPS6194358U (en) 1984-11-26 1984-11-26

Publications (1)

Publication Number Publication Date
JPS6194358U true JPS6194358U (en) 1986-06-18

Family

ID=30736672

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1984179109U Pending JPS6194358U (en) 1984-11-26 1984-11-26

Country Status (1)

Country Link
JP (1) JPS6194358U (en)

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