JPS6163849U - - Google Patents
Info
- Publication number
- JPS6163849U JPS6163849U JP14804784U JP14804784U JPS6163849U JP S6163849 U JPS6163849 U JP S6163849U JP 14804784 U JP14804784 U JP 14804784U JP 14804784 U JP14804784 U JP 14804784U JP S6163849 U JPS6163849 U JP S6163849U
- Authority
- JP
- Japan
- Prior art keywords
- heat radiator
- support portion
- resin material
- sealed
- jig support
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 claims description 3
- 239000000463 material Substances 0.000 claims 2
- 238000007789 sealing Methods 0.000 claims 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical group [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 2
- 239000002184 metal Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/1815—Shape
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
第１図ａ，ｂは従来構造を示す平面図及び断面
図、第２図は本考案の一実施例構造を示す断面図
である。図において１は板状放熱体、１ａはリー
ド線部、１ｂは折曲げ部、２は半導体チツプ、３
はリード線、３ａは接続線、４は樹脂部、６，９
は治具支持部、７は金属放熱体、８は螺子である
。
1A and 1B are a plan view and a sectional view showing a conventional structure, and FIG. 2 is a sectional view showing an embodiment of the structure of the present invention. In the figure, 1 is a plate-shaped heat sink, 1a is a lead wire part, 1b is a bent part, 2 is a semiconductor chip, and 3
is a lead wire, 3a is a connection wire, 4 is a resin part, 6, 9
is a jig support part, 7 is a metal heat sink, and 8 is a screw.
Claims (1)
ドとを電気的に接続して該放熱体を樹脂材で密封
すると共に前記密封樹脂材に該放熱体の一面又は
他面に達する治具支持部を設け、且つ前記治具支
持部は段差形状を有することを特徴とする樹脂密
封型半導体装置。 A semiconductor chip fixed to a plate-shaped heat radiator is electrically connected to an external lead, and the heat radiator is sealed with a resin material, and a jig support portion reaching one surface or the other surface of the heat radiator is provided in the sealing resin material. 1. A resin-sealed semiconductor device, wherein the jig support portion has a stepped shape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14804784U JPS6163849U (en) | 1984-09-29 | 1984-09-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14804784U JPS6163849U (en) | 1984-09-29 | 1984-09-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6163849U true JPS6163849U (en) | 1986-04-30 |
Family
ID=30706267
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14804784U Pending JPS6163849U (en) | 1984-09-29 | 1984-09-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6163849U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6474746A (en) * | 1987-09-17 | 1989-03-20 | Toshiba Corp | Resin-insulated semiconductor device |
-
1984
- 1984-09-29 JP JP14804784U patent/JPS6163849U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6474746A (en) * | 1987-09-17 | 1989-03-20 | Toshiba Corp | Resin-insulated semiconductor device |