JPS6183045U - - Google Patents
Info
- Publication number
- JPS6183045U JPS6183045U JP16758284U JP16758284U JPS6183045U JP S6183045 U JPS6183045 U JP S6183045U JP 16758284 U JP16758284 U JP 16758284U JP 16758284 U JP16758284 U JP 16758284U JP S6183045 U JPS6183045 U JP S6183045U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- molded
- exposed
- semiconductor device
- support pin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 230000017525 heat dissipation Effects 0.000 claims 1
- 238000000465 moulding Methods 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 239000011265 semifinished product Substances 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Description
第１図ａ，ｂはそれぞれ本考案の絶縁形樹脂封
止半導体装置の一実施例の製造途中の半製品、完
成品を示す透視図および第２図は従来の絶縁形樹
脂封止半導体装置の一例を示す透視図である。
１……リードフレーム、２……金属支持ピン、
３，８……樹脂、４……半導体チツプ、５……ボ
ンデイングワイヤ、６……外部リード、７……成
形穴。
1a and 1b are perspective views showing a semi-finished product and a completed product, respectively, of an embodiment of the insulated resin-sealed semiconductor device of the present invention, and FIG. 2 is a perspective view of a conventional insulated resin-sealed semiconductor device. It is a perspective view showing an example. 1...Lead frame, 2...Metal support pin,
3, 8... Resin, 4... Semiconductor chip, 5... Bonding wire, 6... External lead, 7... Molding hole.
Claims (1)
止半導体装置において、リードフレームと一体成
形されている金属支持ピンの一部を露出させて樹
脂成形し、前記金属支持ピンを前記露出部で切り
離した後に該露出部を樹脂被覆してなることを特
徴とする絶縁形樹脂封止半導体装置。 In an insulated resin-sealed semiconductor device whose heat dissipation surface is electrically insulated, a part of a metal support pin integrally molded with a lead frame is exposed and molded with resin, and the metal support pin is molded in the exposed part. An insulating resin-sealed semiconductor device characterized in that the exposed portion is coated with a resin after being separated.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16758284U JPS6183045U (en) | 1984-11-05 | 1984-11-05 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16758284U JPS6183045U (en) | 1984-11-05 | 1984-11-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6183045U true JPS6183045U (en) | 1986-06-02 |
Family
ID=30725372
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16758284U Pending JPS6183045U (en) | 1984-11-05 | 1984-11-05 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6183045U (en) |
-
1984
- 1984-11-05 JP JP16758284U patent/JPS6183045U/ja active Pending