JPS62180957U - - Google Patents
Info
- Publication number
- JPS62180957U JPS62180957U JP6901886U JP6901886U JPS62180957U JP S62180957 U JPS62180957 U JP S62180957U JP 6901886 U JP6901886 U JP 6901886U JP 6901886 U JP6901886 U JP 6901886U JP S62180957 U JPS62180957 U JP S62180957U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- semiconductor device
- support lead
- view
- sealed insulated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 7
- 239000011347 resin Substances 0.000 claims description 6
- 229920005989 resin Polymers 0.000 claims description 6
- 230000017525 heat dissipation Effects 0.000 claims description 2
- 238000000465 moulding Methods 0.000 claims description 2
- 238000005498 polishing Methods 0.000 claims 1
- 238000009413 insulation Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第1図a,bはこの考案の一実施例を示す樹脂
封止絶縁形半導体装置の平面図および側面図、第
2図は支持リード部の切断の一例を説明するため
の拡大断面図、第3図は支持リード部の切断前の
フレーム部分の平面図、第4図は支持リード部の
切断後に絶縁樹脂を塗布した部分拡大断面図、第
5図a,bは従来の樹脂封止絶縁形半導体装置の
平面図および側面図、第6図は従来の支持リード
部の切断前のフレーム部分の平面図、第7図は従
来の樹脂封止絶縁形半導体装置を放熱板へ取り付
けた状態を示す側面図、第8図は従来の支持リー
ド部の切断後に絶縁樹脂を塗布した拡大図、第9
図は従来の欠点を説明するための拡大図である。
図において、1はモールド樹脂、2は半導体チ
ツプ、3は放熱フイン、4a〜4cは電極リード
端子、5は支持リード部、5aは支持リード部の
切断部、7は絶縁樹脂である。なお、各図中の同
一符号は同一または相当部分を示す。
1A and 1B are a plan view and a side view of a resin-sealed insulated semiconductor device showing an embodiment of this invention, FIG. Figure 3 is a plan view of the frame portion before cutting the support lead part, Figure 4 is a partially enlarged cross-sectional view of the support lead part coated with insulating resin after cutting it, and Figures 5a and b are the conventional resin-sealed insulation type. A plan view and a side view of a semiconductor device, FIG. 6 is a plan view of a conventional frame portion before cutting the support lead part, and FIG. 7 shows a conventional resin-sealed insulated semiconductor device attached to a heat sink. A side view, Fig. 8 is an enlarged view of the conventional support lead part coated with insulating resin after cutting, and Fig. 9
The figure is an enlarged view for explaining the conventional drawbacks. In the figure, 1 is a molding resin, 2 is a semiconductor chip, 3 is a heat dissipation fin, 4a to 4c are electrode lead terminals, 5 is a support lead portion, 5a is a cut portion of the support lead portion, and 7 is an insulating resin. Note that the same reference numerals in each figure indicate the same or corresponding parts.
Claims (1)
し電極リード端子と対向側に、支持リード部を備
えた樹脂封止絶縁形半導体装置において、樹脂モ
ールド終了後電解研磨法にてモールド樹脂内部に
おいて選択的に切断可能な断面極小の切断部を前
記支持リード部に形成したことを特徴とする樹脂
封止絶縁形半導体装置。 In a resin-sealed insulated semiconductor device that has a support lead portion on the opposite side of the electrode lead terminal to the heat dissipation fin on which the semiconductor chip is placed and fixed, after resin molding is completed, the inside of the mold resin is selectively polished using electrolytic polishing. 1. A resin-sealed insulated semiconductor device, characterized in that a cutting portion having an extremely small cross section that can be cut into a shape is formed in the support lead portion.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6901886U JPS62180957U (en) | 1986-05-06 | 1986-05-06 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6901886U JPS62180957U (en) | 1986-05-06 | 1986-05-06 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS62180957U true JPS62180957U (en) | 1987-11-17 |
Family
ID=30909368
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6901886U Pending JPS62180957U (en) | 1986-05-06 | 1986-05-06 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS62180957U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01158756A (en) * | 1987-12-16 | 1989-06-21 | Sanken Electric Co Ltd | Manufacture of resin sealed semiconductor device |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS55146952A (en) * | 1979-05-02 | 1980-11-15 | Hitachi Ltd | Lead frame |
JPS58143538A (en) * | 1982-02-19 | 1983-08-26 | Matsushita Electronics Corp | Manufacture of resin seal type semiconductor device |
JPS60128646A (en) * | 1983-12-16 | 1985-07-09 | Hitachi Ltd | Semiconductor device and lead frame used for manufacturing the same device |
JPS6156420A (en) * | 1984-07-31 | 1986-03-22 | Sanken Electric Co Ltd | Manufacture of resin-sealed semiconductor device |
-
1986
- 1986-05-06 JP JP6901886U patent/JPS62180957U/ja active Pending
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS55146952A (en) * | 1979-05-02 | 1980-11-15 | Hitachi Ltd | Lead frame |
JPS58143538A (en) * | 1982-02-19 | 1983-08-26 | Matsushita Electronics Corp | Manufacture of resin seal type semiconductor device |
JPS60128646A (en) * | 1983-12-16 | 1985-07-09 | Hitachi Ltd | Semiconductor device and lead frame used for manufacturing the same device |
JPS6156420A (en) * | 1984-07-31 | 1986-03-22 | Sanken Electric Co Ltd | Manufacture of resin-sealed semiconductor device |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01158756A (en) * | 1987-12-16 | 1989-06-21 | Sanken Electric Co Ltd | Manufacture of resin sealed semiconductor device |