JPS6348170U - - Google Patents

Info

Publication number
JPS6348170U
JPS6348170U JP14053386U JP14053386U JPS6348170U JP S6348170 U JPS6348170 U JP S6348170U JP 14053386 U JP14053386 U JP 14053386U JP 14053386 U JP14053386 U JP 14053386U JP S6348170 U JPS6348170 U JP S6348170U
Authority
JP
Japan
Prior art keywords
magnetoresistive element
lead frame
element chip
bonding wire
groove
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14053386U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP14053386U priority Critical patent/JPS6348170U/ja
Publication of JPS6348170U publication Critical patent/JPS6348170U/ja
Pending legal-status Critical Current

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  • Measuring Magnetic Variables (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図および第２図は本考案の実施例を示すも
ので、第１図はモールド前の磁気抵抗素子の斜視
図、第２図は第１図のリードフレームの斜視図、
第３図は従来の磁気抵抗素子のモールド前の斜視
図、第４図はこれに使用されるリードフレームの
斜視図である。 １，１′……リードフレーム、２……接着剤、
３……磁気抵抗素子チツプ、４……接続用電極、
５……外部接続用端子、６……ボンデイングワイ
ヤ、１０１，１０１′……チツプ搭載部、１０２
……溝、１０３……チツプ搭載部の辺縁。 1 and 2 show an embodiment of the present invention; FIG. 1 is a perspective view of a magnetoresistive element before molding; FIG. 2 is a perspective view of the lead frame shown in FIG. 1;
FIG. 3 is a perspective view of a conventional magnetoresistive element before molding, and FIG. 4 is a perspective view of a lead frame used therein. 1, 1'...Lead frame, 2...Adhesive,
3... Magnetoresistive element chip, 4... Connection electrode,
5... External connection terminal, 6... Bonding wire, 101, 101'... Chip mounting part, 102
... Groove, 103 ... Edge of chip mounting section.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 磁性薄膜パターンが表面に形成された磁気抵抗
素子チツプをリードフレームに搭載し、ボンデイ
ングワイヤによつて前記磁気抵抗素子チツプの接
続用電極と前記リードフレームの外部接続用端子
とを接続した後、これらを一体にモールド成形し
てなる磁気抵抗素子において、前記リードフレー
ムの磁気抵抗素子チツプ搭載部の表面に溝を設け
たことを特徴とするモールド形磁気抵抗素子。 A magnetoresistive element chip having a magnetic thin film pattern formed on its surface is mounted on a lead frame, and after connecting the connection electrode of the magnetoresistive element chip and the external connection terminal of the lead frame with a bonding wire, these 1. A molded magnetoresistive element, characterized in that a groove is provided on the surface of the magnetoresistive element chip mounting portion of the lead frame.
JP14053386U 1986-09-16 1986-09-16 Pending JPS6348170U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14053386U JPS6348170U (en) 1986-09-16 1986-09-16

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14053386U JPS6348170U (en) 1986-09-16 1986-09-16

Publications (1)

Publication Number Publication Date
JPS6348170U true JPS6348170U (en) 1988-04-01

Family

ID=31047468

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14053386U Pending JPS6348170U (en) 1986-09-16 1986-09-16

Country Status (1)

Country Link
JP (1) JPS6348170U (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5792840A (en) * 1980-12-01 1982-06-09 Nec Corp Semiconductor assembling parts
JPS6027180A (en) * 1983-07-22 1985-02-12 Rohm Co Ltd Magnetoelectric conversion element

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5792840A (en) * 1980-12-01 1982-06-09 Nec Corp Semiconductor assembling parts
JPS6027180A (en) * 1983-07-22 1985-02-12 Rohm Co Ltd Magnetoelectric conversion element

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