JPH01113356U - - Google Patents
Info
- Publication number
- JPH01113356U JPH01113356U JP768788U JP768788U JPH01113356U JP H01113356 U JPH01113356 U JP H01113356U JP 768788 U JP768788 U JP 768788U JP 768788 U JP768788 U JP 768788U JP H01113356 U JPH01113356 U JP H01113356U
- Authority
- JP
- Japan
- Prior art keywords
- flat plate
- lead frame
- resin molded
- chip
- plate part
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 4
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図、第２図はそれぞれ本考案の一実施例を
示す側面図、平面図、第３図は第２図のＡＡ′面
を断面とする断面図、第４図、第５図はそれぞれ
従来のリードフレームの一例を示す側面図、平面
図、第６図は第５図のＢＢ′面を断面とする断面
図である。
１ａ……リードフレームの半導体チツプがマウ
ントされる平板部、１１ａ……突起、１２ａ……
タブ、２……外部リード、３……機器への取付け
面となる平板部、４……モールド樹脂。なお図中
同一符号は同一または相当する部分を示す。
1 and 2 are a side view and a plan view showing an embodiment of the present invention, respectively. FIG. 3 is a sectional view taken along plane AA' in FIG. 2, and FIGS. 4 and 5 are respectively A side view and a plan view showing an example of a conventional lead frame, and FIG. 6 is a sectional view taken along plane BB' in FIG. 5. 1a...Flat plate portion of the lead frame on which the semiconductor chip is mounted, 11a...Protrusion, 12a...
Tab, 2...External lead, 3...Flat plate part that becomes the mounting surface to the device, 4...Mold resin. Note that the same reference numerals in the figures indicate the same or corresponding parts.
Claims (1)
プのボンデイングパツドと外部リードがワイヤボ
ンドされて樹脂モールドされる半導体素子用リー
ドフレームにおいて、樹脂モールドされる平板部
に側辺部が一部切断されて折り曲げられ該平板部
の面と３０°乃至６０°の角度をなすタブを備え
たことを特徴とする半導体素子用リードフレーム
。 In a lead frame for a semiconductor element in which a semiconductor chip is mounted on a flat plate part, bonding pads of the chip and external leads are wire bonded and resin molded, a side part of the flat plate part to be resin molded is partially cut off. A lead frame for a semiconductor device, comprising a tab that is bent and forms an angle of 30° to 60° with the surface of the flat plate portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP768788U JPH01113356U (en) | 1988-01-26 | 1988-01-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP768788U JPH01113356U (en) | 1988-01-26 | 1988-01-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01113356U true JPH01113356U (en) | 1989-07-31 |
Family
ID=31212909
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP768788U Pending JPH01113356U (en) | 1988-01-26 | 1988-01-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01113356U (en) |
-
1988
- 1988-01-26 JP JP768788U patent/JPH01113356U/ja active Pending