JPS59177963U - light emitting diode - Google Patents
light emitting diodeInfo
- Publication number
- JPS59177963U JPS59177963U JP7267283U JP7267283U JPS59177963U JP S59177963 U JPS59177963 U JP S59177963U JP 7267283 U JP7267283 U JP 7267283U JP 7267283 U JP7267283 U JP 7267283U JP S59177963 U JPS59177963 U JP S59177963U
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- emitting diode
- pair
- lead frames
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
図は本考案の一実施例を示すもので、第1図は成形用型
の平面図、第2図は同成形用型の一部破断状態の正面図
、第3図は同成形用型の側面側から見た半断面図、第4
図は連設されたリードフレームの外観図、第5図は一対
のリードフレーム先端部にチップを装着した発光ダイオ
ードの構成を説明するための拡大図、第6図はその平面
図、第7図は本考案による発光ダイオードの斜視図であ
する。
1・・・・・・成形用型、2・・・・・・溝、3a、
3b・・・・・・リードフレーム、4・・・・・・チ
ップ、5・・・・・・ワイヤー、6・・・・・・外装、
7・・・・・・被膜。The figures show an embodiment of the present invention, in which Fig. 1 is a plan view of the mold, Fig. 2 is a front view of the mold in a partially broken state, and Fig. 3 is a front view of the mold. Half sectional view seen from the side, No. 4
The figure is an external view of the lead frames arranged in series, FIG. 5 is an enlarged view to explain the structure of a light emitting diode with a chip attached to the tips of a pair of lead frames, FIG. 6 is a plan view thereof, and FIG. 7 is a perspective view of a light emitting diode according to the present invention. 1...Molding mold, 2...Groove, 3a,
3b... Lead frame, 4... Chip, 5... Wire, 6... Exterior,
7...Coating.
Claims (1)
ダイオードチップを装着し、他方とはワイヤポンディン
グによって接続し、樹脂モールドによって外装した発光
ダイオードにおいて、一対のリードフレームの外側縁を
外装から突出させ、該突出部分が電気的に絶縁されるよ
うに樹脂モールドと同一樹脂によって薄い被膜で被覆さ
れたことを特徴とする発光ダイオード。A light emitting diode chip is attached to a predetermined position on one side of a pair of lead frames arranged side by side, connected to the other by wire bonding, and the outer edges of the pair of lead frames protrude from the exterior of the light emitting diode which is exteriorized with resin molding. A light emitting diode characterized in that the protruding portion is covered with a thin film made of the same resin as the resin mold so as to be electrically insulated.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7267283U JPS59177963U (en) | 1983-05-16 | 1983-05-16 | light emitting diode |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7267283U JPS59177963U (en) | 1983-05-16 | 1983-05-16 | light emitting diode |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS59177963U true JPS59177963U (en) | 1984-11-28 |
Family
ID=30202807
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7267283U Pending JPS59177963U (en) | 1983-05-16 | 1983-05-16 | light emitting diode |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS59177963U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006310612A (en) * | 2005-04-28 | 2006-11-09 | Stanley Electric Co Ltd | Led lamp |
-
1983
- 1983-05-16 JP JP7267283U patent/JPS59177963U/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006310612A (en) * | 2005-04-28 | 2006-11-09 | Stanley Electric Co Ltd | Led lamp |
JP4687877B2 (en) * | 2005-04-28 | 2011-05-25 | スタンレー電気株式会社 | LED lamp |
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