JPS59117168U - light emitting diode - Google Patents

light emitting diode

Info

Publication number
JPS59117168U
JPS59117168U JP1014083U JP1014083U JPS59117168U JP S59117168 U JPS59117168 U JP S59117168U JP 1014083 U JP1014083 U JP 1014083U JP 1014083 U JP1014083 U JP 1014083U JP S59117168 U JPS59117168 U JP S59117168U
Authority
JP
Japan
Prior art keywords
lead
light emitting
emitting diode
element mounting
bonding wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1014083U
Other languages
Japanese (ja)
Inventor
向原　広章
Original Assignee
日本電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気株式会社 filed Critical 日本電気株式会社
Priority to JP1014083U priority Critical patent/JPS59117168U/en
Publication of JPS59117168U publication Critical patent/JPS59117168U/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は従来の発光ダイオードの断面図、第２図は従来
の指向性発光ダイオードの素子取付部の断面図、第３図
は従来の改良された発光ダイオードの断面図、第４図は
本考案の一実施例による発光ダイオードの断面図である
。 １・・・・・・素子搭載部を有するリードフレーム、２
゜２′、２″・・・・・・ボンディング線接続部を有す
るリードフレーム、３・・・・・・発光ダイオード素子
、４・・・・・・ボンディング線、５・・・・・・封入
樹脂、６・・・・・・リードフレーム１の端部、７・・
・・・・リードフレーム２″の端部、８・・・・・・素
子取付用皿部。Figure 1 is a sectional view of a conventional light emitting diode, Figure 2 is a sectional view of the element mounting part of a conventional directional light emitting diode, Figure 3 is a sectional view of a conventional improved light emitting diode, and Figure 4 is a sectional view of a conventional directional light emitting diode. 1 is a cross-sectional view of a light emitting diode according to an embodiment of the invention; FIG. 1...Lead frame having an element mounting part, 2
゜2', 2''...Lead frame having a bonding wire connection part, 3...Light emitting diode element, 4...Bonding wire, 5...Enclosed Resin, 6... End of lead frame 1, 7...
...End of lead frame 2'', 8...Dish for mounting element.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 素子搭載部を有するリードと素子からのボンディング線
の接続部を有するリードとを備えた発光ダイオードにお
いて、前記ホンディング線接続部を有するリードが素子
搭載部を有するリードより長く、ホンディング線接続部
が素子搭載部より上方に位置し、その対向する端部は上
下に間隔をおいて少なくとも一部重なっていることを特
徴とする発光ダイオード。In a light emitting diode comprising a lead having an element mounting part and a lead having a connection part for a bonding wire from the element, the lead having the bonding wire connection part is longer than the lead having the element mounting part, and the lead having the bonding wire connection part is longer than the lead having the element mounting part. is located above the element mounting portion, and the opposing ends thereof are vertically spaced apart and at least partially overlap.
JP1014083U 1983-01-27 1983-01-27 light emitting diode Pending JPS59117168U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1014083U JPS59117168U (en) 1983-01-27 1983-01-27 light emitting diode

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1014083U JPS59117168U (en) 1983-01-27 1983-01-27 light emitting diode

Publications (1)

Publication Number Publication Date
JPS59117168U true JPS59117168U (en) 1984-08-07

Family

ID=30141582

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1014083U Pending JPS59117168U (en) 1983-01-27 1983-01-27 light emitting diode

Country Status (1)

Country Link
JP (1) JPS59117168U (en)

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