JPS58120665U - lead frame - Google Patents

lead frame

Info

Publication number
JPS58120665U
JPS58120665U JP1674482U JP1674482U JPS58120665U JP S58120665 U JPS58120665 U JP S58120665U JP 1674482 U JP1674482 U JP 1674482U JP 1674482 U JP1674482 U JP 1674482U JP S58120665 U JPS58120665 U JP S58120665U
Authority
JP
Japan
Prior art keywords
lead frame
lead
tip
shape
ceramic package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1674482U
Other languages
Japanese (ja)
Inventor
冨永　芳弘
Original Assignee
九州日本電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 九州日本電気株式会社 filed Critical 九州日本電気株式会社
Priority to JP1674482U priority Critical patent/JPS58120665U/en
Publication of JPS58120665U publication Critical patent/JPS58120665U/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements

Landscapes

  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は従来のガラス封止型セラミックパッケージのリ
ードフレームの外形図、第２図は従来のリードフレーム
のリード端子の平面図である。第３図は本考案の実施例
のリードフレームのリード端子の先端に一例として切り
かきを入れた形状図、第４図はリード側にパターン認識
点をあてた図、′第５図は本考案のリードフレームと集
積回路素子部をワイヤボンディングした図である。 図中、１・・・・・・リードフレームの外形部、２・・
曲リード端子の先端部の形状、３・・・・・・集積回路
素子、４・・・・・・リード先端形状の一例、５・・間
パターン認識部、６・・・・・・ボンディングワイヤ、
である。FIG. 1 is an outline view of a lead frame of a conventional glass-sealed ceramic package, and FIG. 2 is a plan view of a lead terminal of the conventional lead frame. Figure 3 is a diagram showing the shape of the lead frame in accordance with the embodiment of the present invention, with a notch made as an example at the tip of the lead terminal, Figure 4 is a diagram showing pattern recognition points on the lead side, and Figure 5 is the shape of the lead frame according to the present invention. FIG. 3 is a diagram showing wire bonding between the lead frame and the integrated circuit element section. In the figure, 1...outline of the lead frame, 2...
Shape of tip of curved lead terminal, 3...Integrated circuit element, 4...Example of lead tip shape, 5...Interval pattern recognition section, 6...Bonding wire ,
It is.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] ガラス封止型セラミックパッケージタイプに使用される
リードフレームの先端に切りかきパターンを設けること
を特徴とするリードフレーム。A lead frame used in a glass-sealed ceramic package type, characterized by having a cut pattern at the tip of the lead frame.
JP1674482U 1982-02-09 1982-02-09 lead frame Pending JPS58120665U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1674482U JPS58120665U (en) 1982-02-09 1982-02-09 lead frame

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1674482U JPS58120665U (en) 1982-02-09 1982-02-09 lead frame

Publications (1)

Publication Number Publication Date
JPS58120665U true JPS58120665U (en) 1983-08-17

Family

ID=30029102

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1674482U Pending JPS58120665U (en) 1982-02-09 1982-02-09 lead frame

Country Status (1)

Country Link
JP (1) JPS58120665U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04111755U (en) * 1991-03-15 1992-09-29 ソニー株式会社 Inner lead shape of dip-type solid-state image sensor

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04111755U (en) * 1991-03-15 1992-09-29 ソニー株式会社 Inner lead shape of dip-type solid-state image sensor

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