JPS5844858U - lead frame - Google Patents

lead frame

Info

Publication number
JPS5844858U
JPS5844858U JP13998581U JP13998581U JPS5844858U JP S5844858 U JPS5844858 U JP S5844858U JP 13998581 U JP13998581 U JP 13998581U JP 13998581 U JP13998581 U JP 13998581U JP S5844858 U JPS5844858 U JP S5844858U
Authority
JP
Japan
Prior art keywords
lead frame
paste
concave structure
recorded
electronic filing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13998581U
Other languages
Japanese (ja)
Inventor
秀樹 栗原
良和 中村
Original Assignee
日本電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気株式会社 filed Critical 日本電気株式会社
Priority to JP13998581U priority Critical patent/JPS5844858U/en
Publication of JPS5844858U publication Critical patent/JPS5844858U/en
Pending legal-status Critical Current

Links

Landscapes

  • Die Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は、エツチング加工によって作られた本考案のリ
ードフレームの一実施例の断面概略図であり、第２図は
、プレス加工によって作られた本考案のリードフレーム
の他の実施例の断面概略図である。 なお図面において、１・・・・・・アイランド、２・・
・・・・　　′エツチング加工による凹構造部分、３・
・・・・・リード端子、４・・・・・・アイランド、５
・・・・；・プレス加工による凹構造部分、６・・・・
・・リード端子である。Fig. 1 is a schematic cross-sectional view of one embodiment of the lead frame of the present invention made by etching processing, and Fig. 2 is a cross-sectional diagram of another embodiment of the lead frame of the present invention produced by press processing. It is a schematic diagram. In the drawings, 1...island, 2...
...' Concave structure part by etching, 3.
...Lead terminal, 4...Island, 5
・・・・・・;・Concave structure part by press processing, 6...
...This is a lead terminal.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 導電性ペーストを用いて、グイボンディングされるリー
ドフレームにおいて、上記ペーストが塗布される部分に
、凹構造を有することを特徴とするリードフレーム。1. A lead frame that is bonded using a conductive paste, the lead frame having a concave structure in a portion to which the paste is applied.
JP13998581U 1981-09-21 1981-09-21 lead frame Pending JPS5844858U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13998581U JPS5844858U (en) 1981-09-21 1981-09-21 lead frame

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13998581U JPS5844858U (en) 1981-09-21 1981-09-21 lead frame

Publications (1)

Publication Number Publication Date
JPS5844858U true JPS5844858U (en) 1983-03-25

Family

ID=29933160

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13998581U Pending JPS5844858U (en) 1981-09-21 1981-09-21 lead frame

Country Status (1)

Country Link
JP (1) JPS5844858U (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59201433A (en) * 1983-04-30 1984-11-15 Fujitsu Ltd Semiconductor device
JPS6385077U (en) * 1986-11-20 1988-06-03
JPS63155372U (en) * 1987-03-30 1988-10-12
WO2014013848A1 (en) * 2012-07-19 2014-01-23 日産自動車株式会社 Semiconductor device

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50140202A (en) * 1974-04-27 1975-11-10

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50140202A (en) * 1974-04-27 1975-11-10

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59201433A (en) * 1983-04-30 1984-11-15 Fujitsu Ltd Semiconductor device
JPS6385077U (en) * 1986-11-20 1988-06-03
JPH0451588Y2 (en) * 1986-11-20 1992-12-04
JPS63155372U (en) * 1987-03-30 1988-10-12
WO2014013848A1 (en) * 2012-07-19 2014-01-23 日産自動車株式会社 Semiconductor device

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