JPS58148963U - package parts - Google Patents
package partsInfo
- Publication number
- JPS58148963U JPS58148963U JP4621182U JP4621182U JPS58148963U JP S58148963 U JPS58148963 U JP S58148963U JP 4621182 U JP4621182 U JP 4621182U JP 4621182 U JP4621182 U JP 4621182U JP S58148963 U JPS58148963 U JP S58148963U
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- package parts
- lead wire
- abstract
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は本考案によるパッケージ部品の一実施例を示す
断面図、第２図は第１図の部品の基板実装時におけるリ
ード線部分の拡大図、第３図は従来のパッケージ部品を
示す断面図、第４図は第３図の部品の基板実装時におけ
るリード線部分の拡大図である。
１・・・・・・パッケージ部品、２・・・・・・リード
線、５・・・・・・樹脂、６・・・・・・基板、６ａ・
・・・・・凸部。Figure 1 is a cross-sectional view showing an embodiment of the package component according to the present invention, Figure 2 is an enlarged view of the lead wire portion of the component shown in Figure 1 when it is mounted on a board, and Figure 3 is a cross-sectional view of a conventional package component. FIG. 4 is an enlarged view of the lead wire portion when the component shown in FIG. 3 is mounted on a board. DESCRIPTION OF SYMBOLS 1... Package parts, 2... Lead wires, 5... Resin, 6... Board, 6a.
...Protrusion.
Claims (1)
基板の外周部分が樹脂ディップされたパッケージ部品に
おいて、前記基板のリード線側に、凸部を突出形成した
ことを特徴とするパッケージ部品。1. A package component comprising a substrate and a lead wire provided substantially parallel to the substrate, and further having an outer peripheral portion of the substrate dipped in resin, characterized in that a convex portion is formed protruding from the lead wire side of the substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4621182U JPS58148963U (en) | 1982-03-31 | 1982-03-31 | package parts |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4621182U JPS58148963U (en) | 1982-03-31 | 1982-03-31 | package parts |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS58148963U true JPS58148963U (en) | 1983-10-06 |
Family
ID=30057213
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4621182U Pending JPS58148963U (en) | 1982-03-31 | 1982-03-31 | package parts |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58148963U (en) |
-
1982
- 1982-03-31 JP JP4621182U patent/JPS58148963U/en active Pending
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