JPS60136146U - Hybrid integrated circuit device - Google Patents
Hybrid integrated circuit deviceInfo
- Publication number
- JPS60136146U JPS60136146U JP2160784U JP2160784U JPS60136146U JP S60136146 U JPS60136146 U JP S60136146U JP 2160784 U JP2160784 U JP 2160784U JP 2160784 U JP2160784 U JP 2160784U JP S60136146 U JPS60136146 U JP S60136146U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- hybrid integrated
- circuit device
- resin cap
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図ａは、従来の混成集積回路装置の外観図、同図す
はその断面図、第２図ａは本考案の一実施例の外観図、
同図すは第２図ａのＡ −Ａ’断面図、同図Ｃは第２図
ａのＢ−Ｂ’断面図である。
１・・・・・・回路基板、２・・・・・・半導体チップ
、３・・間ボンディングワイヤ、４・・・・・・プリコ
ート樹脂、５・・・・・・外部リード、６・・・・・・
防湿樹脂、７・・曲樹脂キャップつめ、８・・・・・・
樹脂キャップ、９・・・・・・樹脂キャップ開口部、１
０・・曲樹脂キャップ基板との接触部、１１・・・・・
・配線パターン部。FIG. 1a is an external view of a conventional hybrid integrated circuit device, which is a sectional view thereof, and FIG. 2a is an external view of an embodiment of the present invention.
2A is a cross-sectional view taken along the line A-A' in FIG. 2A, and FIG. 2C is a cross-sectional view taken along the B-B' line in FIG. 2A. DESCRIPTION OF SYMBOLS 1... Circuit board, 2... Semiconductor chip, 3... Bonding wire between, 4... Precoat resin, 5... External lead, 6...・・・・・・
Moisture-proof resin, 7...Curved resin cap claw, 8...
Resin cap, 9...Resin cap opening, 1
0...Contact part with curved resin cap board, 11...
・Wiring pattern section.
Claims (1)
で塗布され樹脂キャップが装着されてい２ る混成集
積回路において、前記樹脂キャップの基板表面接触部が
回路パターン形成部分以外と接触する樹脂キャップを装
着していることを特徴とする混成集積回路装置。In a hybrid integrated circuit in which a semiconductor chip is mounted on a circuit board, the entire surface is coated with a moisture-proof resin, and a resin cap is attached, a resin cap is attached in which the substrate surface contact portion of the resin cap comes into contact with a portion other than the circuit pattern forming portion. A hybrid integrated circuit device characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2160784U JPS60136146U (en) | 1984-02-17 | 1984-02-17 | Hybrid integrated circuit device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2160784U JPS60136146U (en) | 1984-02-17 | 1984-02-17 | Hybrid integrated circuit device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS60136146U true JPS60136146U (en) | 1985-09-10 |
Family
ID=30513150
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2160784U Pending JPS60136146U (en) | 1984-02-17 | 1984-02-17 | Hybrid integrated circuit device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60136146U (en) |
-
1984
- 1984-02-17 JP JP2160784U patent/JPS60136146U/en active Pending
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