JPS63170983U - - Google Patents
Info
- Publication number
- JPS63170983U JPS63170983U JP6321587U JP6321587U JPS63170983U JP S63170983 U JPS63170983 U JP S63170983U JP 6321587 U JP6321587 U JP 6321587U JP 6321587 U JP6321587 U JP 6321587U JP S63170983 U JPS63170983 U JP S63170983U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor element
- ceramic substrate
- coating
- alumina ceramic
- view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011248 coating agent Substances 0.000 claims description 7
- 238000000576 coating method Methods 0.000 claims description 7
- 239000011347 resin Substances 0.000 claims description 5
- 229920005989 resin Polymers 0.000 claims description 5
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 3
- 239000004065 semiconductor Substances 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 3
- 238000007789 sealing Methods 0.000 claims 1
- 239000004020 conductor Substances 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Description
第１図は本考案の一実施例のワイヤボンデイグ
完了後の平面図、第２図は本考案の他の実施例の
平面図、第３図は従来例のワイヤボンデイグ完了
後の平面図、第４図は従来例構造の製品の断面図
、第５図は従来例構造で、コーテイング樹脂塗布
範囲が不足している製品の断面図、第６図は従来
例構造で、コーテイグ樹脂塗布範囲が過多な製品
の断面図である。
１……アルミナセラミツク基板、２……導電体
パターン、３……半導体素子、４……金線あるい
はアルミ線、５……コーテイング樹脂、６……外
装樹脂、７……外部引き出しリード線、８……半
田、９……目印用導電体パターン。
Fig. 1 is a plan view of one embodiment of the present invention after wire bonding is completed, Fig. 2 is a plan view of another embodiment of the present invention, Fig. 3 is a plan view of a conventional example after completion of wire bonding, and Fig. 4 is a cross-sectional view of a product with a conventional structure, Figure 5 is a cross-sectional view of a product with a conventional structure and an insufficient coating area of the coating resin, and Figure 6 is a cross-sectional view of a product with a conventional structure and an excessive coating area of the coating resin. FIG. DESCRIPTION OF SYMBOLS 1... Alumina ceramic substrate, 2... Conductor pattern, 3... Semiconductor element, 4... Gold wire or aluminum wire, 5... Coating resin, 6... Exterior resin, 7... External lead wire, 8 ...Solder, 9...Conductor pattern for mark.
Claims (1)
に於て、前記半導体素子をコーテイング封止する
樹脂の塗布範囲の境界を明確に示す独立したパタ
ーンを前記アルミナセラミツク基板上に有する事
を特徴とする混成集積回路装置。 A hybrid integrated circuit device, characterized in that an alumina ceramic substrate on which a semiconductor element is mounted has an independent pattern on the alumina ceramic substrate that clearly indicates the boundary of a coating range of a resin for coating and sealing the semiconductor element. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6321587U JPS63170983U (en) | 1987-04-24 | 1987-04-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6321587U JPS63170983U (en) | 1987-04-24 | 1987-04-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63170983U true JPS63170983U (en) | 1988-11-07 |
Family
ID=30898236
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6321587U Pending JPS63170983U (en) | 1987-04-24 | 1987-04-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63170983U (en) |
-
1987
- 1987-04-24 JP JP6321587U patent/JPS63170983U/ja active Pending
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