JPS614436U - Packages for semiconductor devices - Google Patents
Packages for semiconductor devicesInfo
- Publication number
- JPS614436U JPS614436U JP8901284U JP8901284U JPS614436U JP S614436 U JPS614436 U JP S614436U JP 8901284 U JP8901284 U JP 8901284U JP 8901284 U JP8901284 U JP 8901284U JP S614436 U JPS614436 U JP S614436U
- Authority
- JP
- Japan
- Prior art keywords
- packages
- semiconductor devices
- package
- abstract
- mold
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図ａは従来のモールドパッケージの一例の外観図、
同図ｂはパッケージを回路基板に実装した一例の断面図
、第２図ａは本考案の一実施例のパッケージ外観図、同
図ｂは本考案の一実施例を回路基板に実装した断面図で
ある。
１・・・・・・モールド樹脂部、２・・・・・・外部リ
ード部、３・・・・・・突起部、４・・・・・・モール
ドパッケージ、５・・・・・・回路基板、６・・・・・
・搭載ランド部、７・・・・・・はんだ。Figure 1a is an external view of an example of a conventional molded package.
Figure 2b is a sectional view of an example of a package mounted on a circuit board, Figure 2a is an external view of a package of an embodiment of the present invention, and Figure 2b is a sectional view of an embodiment of the invention mounted on a circuit board. It is. DESCRIPTION OF SYMBOLS 1...Mold resin part, 2...External lead part, 3...Protrusion part, 4...Mold package, 5...Circuit Board, 6...
- Mounting land part, 7...Solder.
Claims (1)
ッケージが実装される基板と対向するモールドパッケー
ジ面に突起を設けた事を特徴とする半導体装置用パッケ
ージ。A package for a semiconductor device, characterized in that a mold package containing a semiconductor chip has a protrusion on the surface of the mold package facing a substrate on which the package is mounted.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8901284U JPS614436U (en) | 1984-06-15 | 1984-06-15 | Packages for semiconductor devices |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8901284U JPS614436U (en) | 1984-06-15 | 1984-06-15 | Packages for semiconductor devices |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS614436U true JPS614436U (en) | 1986-01-11 |
Family
ID=30642703
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8901284U Pending JPS614436U (en) | 1984-06-15 | 1984-06-15 | Packages for semiconductor devices |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS614436U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS637640A (en) * | 1986-06-27 | 1988-01-13 | Toshiba Corp | Manufacture of semiconductor device |
| JPH0248243U (en) * | 1988-09-22 | 1990-04-03 |
-
1984
- 1984-06-15 JP JP8901284U patent/JPS614436U/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS637640A (en) * | 1986-06-27 | 1988-01-13 | Toshiba Corp | Manufacture of semiconductor device |
| JPH0248243U (en) * | 1988-09-22 | 1990-04-03 |
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