JPS60151138U - Hybrid integrated circuit device - Google Patents

Hybrid integrated circuit device

Info

Publication number
JPS60151138U
JPS60151138U JP3929584U JP3929584U JPS60151138U JP S60151138 U JPS60151138 U JP S60151138U JP 3929584 U JP3929584 U JP 3929584U JP 3929584 U JP3929584 U JP 3929584U JP S60151138 U JPS60151138 U JP S60151138U
Authority
JP
Japan
Prior art keywords
integrated circuit
circuit device
hybrid integrated
coated
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3929584U
Other languages
Japanese (ja)
Inventor
牛込　雅夫
佐藤　晃郎
優治 後藤
重徳 山岡
桜　茂彦
後藤　建夫
Original Assignee
日本電気株式会社
住友ベークライト株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気株式会社, 住友ベークライト株式会社 filed Critical 日本電気株式会社
Priority to JP3929584U priority Critical patent/JPS60151138U/en
Publication of JPS60151138U publication Critical patent/JPS60151138U/en
Pending legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

゛第１図は従来構造の混成集積回路を示す断面図、第２
図は本考案の一実施例による混成集積回路を示す断面図
。 １・・・基板、２・・・半導体ペレット、３・・・搭載
部品（チップコンデンサー）、４・・・外部端子、５・
・・半導体ペレットコートのシリコン樹脂、６・・・外
装エポキシ樹脂、７・・・基板コートのシリコン樹脂、
８・・・　□　一基板コートのポリウレタレ樹脂、９・
・・半導体ペレ、ットコートのフェノール樹脂。゛Figure 1 is a cross-sectional view showing a hybrid integrated circuit with a conventional structure;
The figure is a sectional view showing a hybrid integrated circuit according to an embodiment of the present invention. DESCRIPTION OF SYMBOLS 1... Board, 2... Semiconductor pellet, 3... Mounted component (chip capacitor), 4... External terminal, 5...
...Silicon resin for semiconductor pellet coating, 6.. Exterior epoxy resin, 7.. Silicone resin for substrate coating,
8... □ One substrate coated polyurethane resin, 9.
...Semiconductor pellet, phenolic resin for coating.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 基板上に搭載された半導体チップをフェノール樹脂で被
覆し、他の搭載部品を含めて基板全体をポリウレタン樹
脂で被覆し、更にエポキシ樹脂で外装したことを特徴と
する混成集積回路装置。A hybrid integrated circuit device characterized in that a semiconductor chip mounted on a board is coated with phenol resin, the entire board including other mounted components is coated with polyurethane resin, and is further packaged with epoxy resin.
JP3929584U 1984-03-19 1984-03-19 Hybrid integrated circuit device Pending JPS60151138U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3929584U JPS60151138U (en) 1984-03-19 1984-03-19 Hybrid integrated circuit device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3929584U JPS60151138U (en) 1984-03-19 1984-03-19 Hybrid integrated circuit device

Publications (1)

Publication Number Publication Date
JPS60151138U true JPS60151138U (en) 1985-10-07

Family

ID=30547119

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3929584U Pending JPS60151138U (en) 1984-03-19 1984-03-19 Hybrid integrated circuit device

Country Status (1)

Country Link
JP (1) JPS60151138U (en)

Similar Documents

Publication Publication Date Title
JPS60151138U (en) Hybrid integrated circuit device
JPS6027441U (en) Hybrid integrated circuit device
JPS6027438U (en) Hybrid integrated circuit device
JPS5858342U (en) hybrid integrated circuit
JPS614436U (en) Packages for semiconductor devices
JPS6027440U (en) Hybrid integrated circuit device
JPS6025159U (en) lead frame
JPS5918442U (en) Hybrid integrated circuit device
JPS606231U (en) Structure of hybrid integrated circuit
JPS60125738U (en) Hybrid integrated circuit device
JPS6033469U (en) hybrid integrated circuit
JPS6013743U (en) Hybrid integrated circuit device
JPS6127338U (en) Hybrid integrated circuit device
JPS6146736U (en) Semiconductor chip mounting structure
JPS5952668U (en) hybrid integrated circuit
JPS5895052U (en) semiconductor equipment
JPS6052670U (en) Chippukiyariya
JPS58147278U (en) Hybrid integrated circuit device
JPS6054340U (en) integrated circuit
JPS60935U (en) High power hybrid integrated circuit
JPS60179065U (en) printed circuit board
JPS58120647U (en) hybrid integrated circuit
JPS6142861U (en) semiconductor equipment
JPS59121863U (en) Thick film hybrid integrated circuit device
JPS58182438U (en) semiconductor equipment