JPS5954941U - Sealing structure of semiconductor devices - Google Patents
Sealing structure of semiconductor devicesInfo
- Publication number
- JPS5954941U JPS5954941U JP13976382U JP13976382U JPS5954941U JP S5954941 U JPS5954941 U JP S5954941U JP 13976382 U JP13976382 U JP 13976382U JP 13976382 U JP13976382 U JP 13976382U JP S5954941 U JPS5954941 U JP S5954941U
- Authority
- JP
- Japan
- Prior art keywords
- sealing structure
- circuit board
- semiconductor devices
- semiconductor device
- integrated circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図ａは従来の半導体装置封止構造の平面図、第１図
すは従来の半導体装置封止構造の断面図、第２図ａは本
考案による半導体封止構造の一実施例平面図、第２図す
は本考案による半導体封止構造の一実施例断面図である
。
１・・・・・・回路基板、２・・・・・・パターン、３
・・・・・・集積回路、４・・・・・・封止樹脂、５・
・・・・・インナーリード形成窓、６−−−−−−イン
ナーリード、１′・・・・・・ブリッジ、２′・・・・
・・ブリッジパターン。FIG. 1a is a plan view of a conventional semiconductor device encapsulation structure, FIG. 1 is a sectional view of a conventional semiconductor device encapsulation structure, and FIG. 2a is a plan view of an embodiment of a semiconductor encapsulation structure according to the present invention. , FIG. 2 is a sectional view of an embodiment of a semiconductor encapsulation structure according to the present invention. 1... Circuit board, 2... Pattern, 3
...Integrated circuit, 4... Sealing resin, 5.
...Inner lead forming window, 6-------Inner lead, 1'...Bridge, 2'...
...Bridge pattern.
Claims (1)
したミニモツド等の半導体装置に於て、前記回路基板の
インナーリード形成窓に回路基板の一部をブリッジとし
て形成すると共に集積回路と回路基板とを封止剤により
固定かつ封止することを特徴とする半導体装置の封止構
造。In a semiconductor device such as a minimod in which an integrated circuit is electrode-bonded to a circuit board having inner leads, a part of the circuit board is formed as a bridge in the inner lead forming window of the circuit board, and the integrated circuit and the circuit board are sealed. A sealing structure for a semiconductor device characterized by fixing and sealing with an encapsulant.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13976382U JPS5954941U (en) | 1982-09-14 | 1982-09-14 | Sealing structure of semiconductor devices |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13976382U JPS5954941U (en) | 1982-09-14 | 1982-09-14 | Sealing structure of semiconductor devices |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5954941U true JPS5954941U (en) | 1984-04-10 |
Family
ID=30313152
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13976382U Pending JPS5954941U (en) | 1982-09-14 | 1982-09-14 | Sealing structure of semiconductor devices |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5954941U (en) |
-
1982
- 1982-09-14 JP JP13976382U patent/JPS5954941U/en active Pending
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