JPS592146U - Electronic component package - Google Patents
Electronic component packageInfo
- Publication number
- JPS592146U JPS592146U JP9696482U JP9696482U JPS592146U JP S592146 U JPS592146 U JP S592146U JP 9696482 U JP9696482 U JP 9696482U JP 9696482 U JP9696482 U JP 9696482U JP S592146 U JPS592146 U JP S592146U
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- component package
- connect
- pad
- chip component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来の電子部品パッケージを示す底面斜視図、
第２図はその実装状態を示す斜視図、第３図は本考案に
よる電子部品パッケージを示す拡大断面図、第４図はそ
の底面図、第５図はその上面図、第６図はプリント基板
への実装状態を示す斜視図である。
１１・・・電子部品パッケージ、１２・・・チップ部品
、１３・・・ポンディングパッド、１４・・・引き出し
パターン、１５・・・ボンディングワイヤ、１６・・・
導体、１７・・・接続パッド、１８・・・ブロービング
パッド、２０・・・ハーメチックキャップ、２１・・・
プリント基′板、２２・・・搭載用パッド。Figure 1 is a bottom perspective view of a conventional electronic component package;
Fig. 2 is a perspective view showing the mounted state, Fig. 3 is an enlarged sectional view showing the electronic component package according to the present invention, Fig. 4 is its bottom view, Fig. 5 is its top view, and Fig. 6 is the printed circuit board. FIG. DESCRIPTION OF SYMBOLS 11... Electronic component package, 12... Chip component, 13... Bonding pad, 14... Leading pattern, 15... Bonding wire, 16...
Conductor, 17... Connection pad, 18... Blobbing pad, 20... Hermetic cap, 21...
Printed circuit board, 22... mounting pad.
Claims (1)
チップ部品と連結されてプリント基板と接続するための
接続パッドを列設してなるリードレス形の電子部品パッ
ケージにおいて、上記底面の接続パッドに対応してこれ
と導通されたブロービングパッドを上面に設けたことを
特徴とする電子部品パッケージ。In a leadless electronic component package that has a chip component mounted inside and a row of connection pads on the periphery of the bottom surface to connect with the chip component and connect to a printed circuit board, the connection pad on the bottom surface is An electronic component package characterized in that a blobbing pad correspondingly and electrically connected thereto is provided on the top surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9696482U JPS592146U (en) | 1982-06-28 | 1982-06-28 | Electronic component package |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9696482U JPS592146U (en) | 1982-06-28 | 1982-06-28 | Electronic component package |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS592146U true JPS592146U (en) | 1984-01-09 |
Family
ID=30230849
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9696482U Pending JPS592146U (en) | 1982-06-28 | 1982-06-28 | Electronic component package |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS592146U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5954938U (en) * | 1982-10-01 | 1984-04-10 | 京セラ株式会社 | Multi-stage structure of leadless package |
-
1982
- 1982-06-28 JP JP9696482U patent/JPS592146U/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5954938U (en) * | 1982-10-01 | 1984-04-10 | 京セラ株式会社 | Multi-stage structure of leadless package |
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