JPS58109254U - Chip carrier for face-down connected chips - Google Patents
Chip carrier for face-down connected chipsInfo
- Publication number
- JPS58109254U JPS58109254U JP506982U JP506982U JPS58109254U JP S58109254 U JPS58109254 U JP S58109254U JP 506982 U JP506982 U JP 506982U JP 506982 U JP506982 U JP 506982U JP S58109254 U JPS58109254 U JP S58109254U
- Authority
- JP
- Japan
- Prior art keywords
- chip
- face
- chip carrier
- dimension
- down connected
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来公知のチップキャリヤーの断面図第２図は
本考案でなるチップキャリヤーの一実施例を示す断面図
、第３図はその平面図、第４図は本考案のキャビティ寸
法を示す断面図、第５図は、導体パターンにはんだ層を
形成した断面図である。
１１・・・・・・第１のセラミック層、１２・・・・・
・第２のセラミック層、１３・・・・・・セラミックキ
ャップ、１５・・・・・・フェースダウン接続形集積回
路チップ、１６・・・・・・第１の導体パターン、１６
Ａ・・・・・・チップ接続ペターン、１７・・・・・・
第２の導体パターン、１−８′・・・・・・封止用導体
パターン、１９・・・・・・外部接続用導体パターン、
２０・・・・・・はんだ接続部、２１・・・ 。
・・・はんだ封止層、２２・・・・・・はんだ層、Ｗ・
・・・・・チップ電ｔ１寸Ｌ ｓ・・・・・・スペース
、Ｃ・・・・・・キャビティ寸法。Fig. 1 is a sectional view of a conventionally known chip carrier; Fig. 2 is a sectional view showing an embodiment of the chip carrier of the present invention; Fig. 3 is a plan view thereof; and Fig. 4 shows the cavity dimensions of the present invention. The cross-sectional view, FIG. 5, is a cross-sectional view in which a solder layer is formed on a conductor pattern. 11...First ceramic layer, 12...
- Second ceramic layer, 13...Ceramic cap, 15...Face-down connection type integrated circuit chip, 16...First conductor pattern, 16
A...Chip connection pattern, 17...
2nd conductor pattern, 1-8'...conductor pattern for sealing, 19...conductor pattern for external connection,
20...Solder connection part, 21... ...Solder sealing layer, 22...Solder layer, W.
...Chip electric t1 dimension L s ... Space, C ... Cavity dimension.
Claims (1)
る第１の導体パターンを形成した第１のセラミック層と
、該第１のセラミック層上に封止用の第２の導体パター
ンを形成したチップ収納キャビティを有する第２のセラ
ミック層より成り、該キャビティ寸法とチップ外形寸法
とのスペースを、チップ電極寸法に等しいか、それ以下
としたことを特徴とするフェースダウン接続形チップ用
チップキャリヤー。 ゛A first ceramic layer having a first conductive pattern connected to a solder electrode of a face-down integrated circuit chip, and a chip housing cavity having a second conductive pattern for sealing formed on the first ceramic layer. 1. A chip carrier for a face-down connected chip, characterized in that the space between the cavity dimension and the chip outer dimension is equal to or less than the chip electrode dimension.゛
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP506982U JPS58109254U (en) | 1982-01-20 | 1982-01-20 | Chip carrier for face-down connected chips |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP506982U JPS58109254U (en) | 1982-01-20 | 1982-01-20 | Chip carrier for face-down connected chips |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS58109254U true JPS58109254U (en) | 1983-07-25 |
Family
ID=30017883
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP506982U Pending JPS58109254U (en) | 1982-01-20 | 1982-01-20 | Chip carrier for face-down connected chips |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58109254U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07254655A (en) * | 1994-11-21 | 1995-10-03 | Matsushita Electron Corp | Electronic device and manufacture thereof |
| JPH08264676A (en) * | 1996-04-24 | 1996-10-11 | Matsushita Electron Corp | Electronic component |
-
1982
- 1982-01-20 JP JP506982U patent/JPS58109254U/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07254655A (en) * | 1994-11-21 | 1995-10-03 | Matsushita Electron Corp | Electronic device and manufacture thereof |
| JPH08264676A (en) * | 1996-04-24 | 1996-10-11 | Matsushita Electron Corp | Electronic component |
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