JPS6079775U - integrated circuit device - Google Patents
integrated circuit deviceInfo
- Publication number
- JPS6079775U JPS6079775U JP17358483U JP17358483U JPS6079775U JP S6079775 U JPS6079775 U JP S6079775U JP 17358483 U JP17358483 U JP 17358483U JP 17358483 U JP17358483 U JP 17358483U JP S6079775 U JPS6079775 U JP S6079775U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- circuit device
- solder
- conductive pattern
- surface contact
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Die Bonding (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来の集積回路装置の部分平面図、第２図は第
１図の一部拡大図、第３図は第２図のＡ−Ａ線に沿う断
面図、第４図は第３図のＢ−Ｂ線に沿う断面図、第５図
は本考案の一実施例を示す部分平面図、第６図は第５図
の一部拡大図、第７図は第６図のＣ−Ｃ線に沿う断面図
、第８図及び第９図は本考案の他の各実施例を示す部分
側断面図である。
７・・・絶縁基板、８・・・導電パターン、９．９’。
９″・・・電子部品、１０・・・部品本体、１１・・・
リード、ｌｌｃ、ｌｉｄ・・・半田溜り部、１２・・・
半田。
第６図
第８図
一
第９図FIG. 1 is a partial plan view of a conventional integrated circuit device, FIG. 2 is a partially enlarged view of FIG. 1, FIG. 3 is a sectional view taken along line A-A in FIG. 2, and FIG. 5 is a partial plan view showing an embodiment of the present invention, FIG. 6 is a partially enlarged view of FIG. 5, and FIG. A sectional view taken along line C, and FIGS. 8 and 9 are partial side sectional views showing other embodiments of the present invention. 7... Insulating substrate, 8... Conductive pattern, 9.9'. 9″...Electronic component, 10...Part body, 11...
Lead, llc, lid...solder pool, 12...
solder. Figure 6 Figure 8- Figure 9
Claims (1)
に形成した導電パターンとを半田を介して面接触させ接
続したものにおいて、前記導電パターンと接続するリー
ドの面接触部分の一部を屈曲し余分な半田を吸収する半
田溜め部を形成したことを特徴とする集積回路装置。In a device in which a plurality of leads led out from the main body of an electronic component and a conductive pattern formed on an insulating substrate are connected by surface contact via solder, a part of the surface contact portion of the lead connected to the conductive pattern is bent. An integrated circuit device characterized in that a solder reservoir is formed to absorb excess solder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17358483U JPS6079775U (en) | 1983-11-08 | 1983-11-08 | integrated circuit device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17358483U JPS6079775U (en) | 1983-11-08 | 1983-11-08 | integrated circuit device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6079775U true JPS6079775U (en) | 1985-06-03 |
Family
ID=30378111
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17358483U Pending JPS6079775U (en) | 1983-11-08 | 1983-11-08 | integrated circuit device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6079775U (en) |
-
1983
- 1983-11-08 JP JP17358483U patent/JPS6079775U/en active Pending
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