JPS58124978U - flexible printed circuit board - Google Patents

flexible printed circuit board

Info

Publication number
JPS58124978U
JPS58124978U JP2214582U JP2214582U JPS58124978U JP S58124978 U JPS58124978 U JP S58124978U JP 2214582 U JP2214582 U JP 2214582U JP 2214582 U JP2214582 U JP 2214582U JP S58124978 U JPS58124978 U JP S58124978U
Authority
JP
Japan
Prior art keywords
circuit board
printed circuit
flexible printed
protrusion
electronic component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2214582U
Other languages
Japanese (ja)
Inventor
哲 森田
Original Assignee
松下電器産業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 松下電器産業株式会社 filed Critical 松下電器産業株式会社
Priority to JP2214582U priority Critical patent/JPS58124978U/en
Publication of JPS58124978U publication Critical patent/JPS58124978U/en
Pending legal-status Critical Current

Links

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は従来例を示す要部断面側面図、第2図は本考案
の一実施例を示す要部断面側面図、第3図は他の実施例
の要部断面側面図である。 1・・・・・・フレキシブル基板、2・・・・・・導箔
、3・・・・・・フレキシブルプリント基板、4・・・
・・・電子部品、4a・・・・・・リード線、6・・・
・・・半田付け、7・・・・・・突起部。
FIG. 1 is a cross-sectional side view of a main part showing a conventional example, FIG. 2 is a cross-sectional side view of a main part showing one embodiment of the present invention, and FIG. 3 is a cross-sectional side view of a main part of another embodiment. 1... Flexible board, 2... Conductive foil, 3... Flexible printed circuit board, 4...
...Electronic component, 4a...Lead wire, 6...
...Soldering, 7...Protrusion.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 一′導箔が設けられたポリイミド等のフレキシブル基板
に突起部を形成し、電子部品を前記突起部上に載置した
状態でぞの電子部品のリード碑を前記導箔に半田付けし
てなるフレキシブルプリント基板。
1' A protrusion is formed on a flexible substrate made of polyimide or the like provided with a conductive foil, and with the electronic component placed on the protrusion, the lead marker of the other electronic component is soldered to the conductive foil. Flexible printed circuit board.
JP2214582U 1982-02-18 1982-02-18 flexible printed circuit board Pending JPS58124978U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2214582U JPS58124978U (en) 1982-02-18 1982-02-18 flexible printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2214582U JPS58124978U (en) 1982-02-18 1982-02-18 flexible printed circuit board

Publications (1)

Publication Number Publication Date
JPS58124978U true JPS58124978U (en) 1983-08-25

Family

ID=30034244

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2214582U Pending JPS58124978U (en) 1982-02-18 1982-02-18 flexible printed circuit board

Country Status (1)

Country Link
JP (1) JPS58124978U (en)

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