JPS58135975U - printed wiring board - Google Patents
printed wiring boardInfo
- Publication number
- JPS58135975U JPS58135975U JP3342182U JP3342182U JPS58135975U JP S58135975 U JPS58135975 U JP S58135975U JP 3342182 U JP3342182 U JP 3342182U JP 3342182 U JP3342182 U JP 3342182U JP S58135975 U JPS58135975 U JP S58135975U
- Authority
- JP
- Japan
- Prior art keywords
- conductive foil
- printed wiring
- wiring board
- attached
- board surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
図面は本考案に係る印刷配線板の一実施例を示 、す
断面図である。
１・・・・・・絶縁基板、２．′４・・・・・・基板面
、３・・曲導電箔、５・・・・・・電子部品、６・・・
・・・ジャンパー線、５ａ、 ５ａ・・・・・・リー
ド線、９・・曲チップ部品、１１゜１２・・・・・・ハ
ンダ付け。The drawing is a sectional view showing an embodiment of a printed wiring board according to the present invention. 1...Insulating substrate, 2. '4... Board surface, 3... Curved conductive foil, 5... Electronic components, 6...
... Jumper wire, 5a, 5a ... Lead wire, 9 ... Bent chip parts, 11゜12 ... Soldering.
Claims (1)
形成し、この導電箔側の基板面にはリード線を有する電
子部品、ジャンパー線等を取り付けると共に、上記のリ
ード線を導電箔を設けていない他方の基板面に突出させ
、この導電箔のない基板面にはリード線を有しないチッ
プ部品を取り付け、このチップ部品と上記の基板面から
突出したリード線及び電子部品やジャンパー線等と導電
箔を夫々ハンダ付けするようにした印刷配線板。A printed circuit is formed using conductive foil on one side of the insulating substrate, and electronic components with lead wires, jumper wires, etc. are attached to the board surface on the side of the conductive foil, and the conductive foil is attached to the lead wires. A chip component without a lead wire is attached to the other board surface without conductive foil, and this chip component and the lead wire, electronic component, jumper wire, etc. that protrude from the above board surface are conductive. A printed wiring board with individual foils soldered to each other.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3342182U JPS58135975U (en) | 1982-03-10 | 1982-03-10 | printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3342182U JPS58135975U (en) | 1982-03-10 | 1982-03-10 | printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS58135975U true JPS58135975U (en) | 1983-09-13 |
Family
ID=30044965
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3342182U Pending JPS58135975U (en) | 1982-03-10 | 1982-03-10 | printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58135975U (en) |
-
1982
- 1982-03-10 JP JP3342182U patent/JPS58135975U/en active Pending
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