JPS5974761U - printed wiring board - Google Patents

printed wiring board

Info

Publication number
JPS5974761U
JPS5974761U JP17062282U JP17062282U JPS5974761U JP S5974761 U JPS5974761 U JP S5974761U JP 17062282 U JP17062282 U JP 17062282U JP 17062282 U JP17062282 U JP 17062282U JP S5974761 U JPS5974761 U JP S5974761U
Authority
JP
Japan
Prior art keywords
wiring board
printed wiring
conductive foil
foil section
abstract
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP17062282U
Other languages
Japanese (ja)
Inventor
久利　孝一
Original Assignee
株式会社東芝
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社東芝 filed Critical 株式会社東芝
Priority to JP17062282U priority Critical patent/JPS5974761U/en
Publication of JPS5974761U publication Critical patent/JPS5974761U/en
Pending legal-status Critical Current

Links

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は従来の印刷配線基板の半田付は構体を示す構成
図、第２図はこの考案の一実施例を示す構成図、第３図
乃至第６図はそれぞれこの考案の他の実施例を示す構成
図である。 ２１・・・リード付き部品、２２・・・リードレス部品
、２３・・・印刷配線基板、２３１〜２３４・・・導電
箔部、２４〜２７・・・穴、３１〜３４・・・半田ペー
スト。Fig. 1 is a configuration diagram showing the structure of conventional soldering of printed wiring boards, Fig. 2 is a configuration diagram showing one embodiment of this invention, and Figs. 3 to 6 are respective examples of other embodiments of this invention. FIG. 21... Leaded component, 22... Leadless component, 23... Printed wiring board, 231-234... Conductive foil portion, 24-27... Hole, 31-34... Solder paste .

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 少なくとも一方の面に導電箔によるパターン印刷が施さ
れ、他方の面側から前記導電箔部に向って、該導電箔部
を残して開設された穴を有した絶縁性基板と該導電箔部
に前記他方の面側からリード端子又は電極が半田付けさ
れた電気部品とを具備したことを特徴とする印刷配線基
板。An insulating substrate having a pattern printed with conductive foil on at least one surface and having a hole opened from the other surface toward the conductive foil section leaving the conductive foil section and the conductive foil section. A printed wiring board comprising: an electrical component having lead terminals or electrodes soldered from the other surface side.
JP17062282U 1982-11-11 1982-11-11 printed wiring board Pending JPS5974761U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17062282U JPS5974761U (en) 1982-11-11 1982-11-11 printed wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17062282U JPS5974761U (en) 1982-11-11 1982-11-11 printed wiring board

Publications (1)

Publication Number Publication Date
JPS5974761U true JPS5974761U (en) 1984-05-21

Family

ID=30372431

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17062282U Pending JPS5974761U (en) 1982-11-11 1982-11-11 printed wiring board

Country Status (1)

Country Link
JP (1) JPS5974761U (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53126163A (en) * 1977-04-09 1978-11-04 Chuo Meiban Kougiyou Kk Method of mounting part lead or like in printed circuit board

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53126163A (en) * 1977-04-09 1978-11-04 Chuo Meiban Kougiyou Kk Method of mounting part lead or like in printed circuit board

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