JPS5832657U - semiconductor equipment - Google Patents

semiconductor equipment

Info

Publication number
JPS5832657U
JPS5832657U JP12771581U JP12771581U JPS5832657U JP S5832657 U JPS5832657 U JP S5832657U JP 12771581 U JP12771581 U JP 12771581U JP 12771581 U JP12771581 U JP 12771581U JP S5832657 U JPS5832657 U JP S5832657U
Authority
JP
Japan
Prior art keywords
external terminals
semiconductor equipment
exterior body
semiconductor device
parallel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12771581U
Other languages
Japanese (ja)
Inventor
「よし」田　弘
Original Assignee
日本電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気株式会社 filed Critical 日本電気株式会社
Priority to JP12771581U priority Critical patent/JPS5832657U/en
Publication of JPS5832657U publication Critical patent/JPS5832657U/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図ａは従来のフラットパッケージ半導体装置をプリ
ント基板に実装した状態を示す斜視図、同図すは図ａの
横断面図、第２図ａは本考案の一実施例の半導体装置を
プリント基板に実装した状態を示す斜視図、同図すは図
ａの断面図である。 １・・・外装体、２．　２ａ、　　２ｂ・・・外部端子
、３・・・プリント基板、３ａ・・・収容穴、４．　４
ａ、　　４ｂ・・・導電路。Figure 1a is a perspective view showing a state in which a conventional flat package semiconductor device is mounted on a printed circuit board, the figure is a cross-sectional view of figure a, and Figure 2a is a printed circuit board of a semiconductor device according to an embodiment of the present invention. FIG. 2 is a perspective view showing a state where the device is mounted on a board, and a sectional view of FIG. 1... Exterior body, 2. 2a, 2b...external terminal, 3...printed circuit board, 3a...accommodating hole, 4. 4
a, 4b... conductive path.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 外装体側面に複数の外部端子を有する半導体装置におい
て、前記外部端子のうちの一方の側面の外部端子の先端
部が前記外装体上面側で上面と平行となるように他方の
側面の外部端子の先端部が前記外装体の下面側で下面と
平行となるように整形されていることを特徴とする半導
体装置。In a semiconductor device having a plurality of external terminals on the side surface of the exterior body, the external terminals on the other side surface are arranged such that the tips of the external terminals on one side of the external terminals are parallel to the top surface of the exterior body. A semiconductor device characterized in that a tip portion is shaped so as to be parallel to a lower surface of the exterior body on the lower surface side.
JP12771581U 1981-08-27 1981-08-27 semiconductor equipment Pending JPS5832657U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12771581U JPS5832657U (en) 1981-08-27 1981-08-27 semiconductor equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12771581U JPS5832657U (en) 1981-08-27 1981-08-27 semiconductor equipment

Publications (1)

Publication Number Publication Date
JPS5832657U true JPS5832657U (en) 1983-03-03

Family

ID=29921436

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12771581U Pending JPS5832657U (en) 1981-08-27 1981-08-27 semiconductor equipment

Country Status (1)

Country Link
JP (1) JPS5832657U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016018842A (en) * 2014-07-07 2016-02-01 富士電機株式会社 Semiconductor device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016018842A (en) * 2014-07-07 2016-02-01 富士電機株式会社 Semiconductor device

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