JPS58177960U - printed wiring board - Google Patents
printed wiring boardInfo
- Publication number
- JPS58177960U JPS58177960U JP7502382U JP7502382U JPS58177960U JP S58177960 U JPS58177960 U JP S58177960U JP 7502382 U JP7502382 U JP 7502382U JP 7502382 U JP7502382 U JP 7502382U JP S58177960 U JPS58177960 U JP S58177960U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- chip components
- electronic circuit
- components
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来の電子部品を装着する印刷配線板の図、第
２図は本考案の一例を示す図。
２．３：チップ部品の電極をはんだ付けするための導体
ランド、５：チップ部品、６：非スルーホール孔。FIG. 1 is a diagram of a conventional printed wiring board on which electronic components are mounted, and FIG. 2 is a diagram showing an example of the present invention. 2.3: Conductor land for soldering the electrode of the chip component, 5: Chip component, 6: Non-through-hole hole.
Claims (1)
いて、チップ部品の電極をはんだ付けし、電子回路を形
成するチップ部品用導体ランド間に上記チップ部品より
小さな非支ルーホール孔を設けたことを特徴とする印刷
配線板。In a printed wiring board on which electronic components are mounted to form an electronic circuit, the electrodes of the chip components are soldered, and unsupported through-holes smaller than the chip components are provided between the conductive lands for the chip components that form the electronic circuit. A printed wiring board featuring:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7502382U JPS58177960U (en) | 1982-05-24 | 1982-05-24 | printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7502382U JPS58177960U (en) | 1982-05-24 | 1982-05-24 | printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS58177960U true JPS58177960U (en) | 1983-11-28 |
Family
ID=30084411
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7502382U Pending JPS58177960U (en) | 1982-05-24 | 1982-05-24 | printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58177960U (en) |
-
1982
- 1982-05-24 JP JP7502382U patent/JPS58177960U/en active Pending
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