JPS59111068U - Printed board - Google Patents
Printed boardInfo
- Publication number
- JPS59111068U JPS59111068U JP470283U JP470283U JPS59111068U JP S59111068 U JPS59111068 U JP S59111068U JP 470283 U JP470283 U JP 470283U JP 470283 U JP470283 U JP 470283U JP S59111068 U JPS59111068 U JP S59111068U
- Authority
- JP
- Japan
- Prior art keywords
- printed board
- view
- recess
- circuit board
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
図面はこの考案の一実施例を示し、第1〜4図はプリン
ト基板の作り方の一例を示すものであって、第1図は基
板貼合せ前の要部の斜視図、第2図は第1図のものの貼
合せ後の断面図、第3図は第2図のものの凹所に無電解
銅めっきを施した状態の断面図、第4図は第3図の無電
解銅めっきの表面にクリームはんだを印刷してはんだ付
は用ランドを形成した状態の断面図、第5図は第4図の
プリント基板の使用状態を示す断面図である。
1.3:絶縁基板、2:孔、4:凹所、5:無電解銅め
っき、6:めっきレジスト、7:クリームはんだ、8:
はんだ付は用ランド、9:端子、10:隔壁。The drawings show one embodiment of this invention, and Figs. 1 to 4 show an example of how to make a printed circuit board. Fig. 1 is a perspective view of the main part before bonding the board, and Fig. Figure 1 is a cross-sectional view of the item in Figure 2 after lamination, Figure 3 is a cross-sectional view of the item in Figure 2 with electroless copper plating applied to the recess, and Figure 4 is a cross-sectional view of the item in Figure 3 with electroless copper plating applied to the surface. FIG. 5 is a cross-sectional view showing a state in which cream solder is printed to form soldering lands, and FIG. 5 is a cross-sectional view showing the printed circuit board of FIG. 4 in use. 1.3: Insulating substrate, 2: Hole, 4: Recess, 5: Electroless copper plating, 6: Plating resist, 7: Cream solder, 8:
Land for soldering, 9: terminal, 10: bulkhead.
Claims (1)
前記端子を位置決め可能に凹設されてなるプリント基板
。The land used for soldering terminals of flat pack parts, etc.
A printed circuit board having a recess that allows the terminal to be positioned.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP470283U JPS59111068U (en) | 1983-01-19 | 1983-01-19 | Printed board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP470283U JPS59111068U (en) | 1983-01-19 | 1983-01-19 | Printed board |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS59111068U true JPS59111068U (en) | 1984-07-26 |
Family
ID=30136298
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP470283U Pending JPS59111068U (en) | 1983-01-19 | 1983-01-19 | Printed board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS59111068U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0476987A (en) * | 1990-07-19 | 1992-03-11 | Matsushita Electric Ind Co Ltd | Bonding method for electronic component |
-
1983
- 1983-01-19 JP JP470283U patent/JPS59111068U/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0476987A (en) * | 1990-07-19 | 1992-03-11 | Matsushita Electric Ind Co Ltd | Bonding method for electronic component |
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