JPS6092469U - Printed board terminal mounting structure - Google Patents

Printed board terminal mounting structure

Info

Publication number
JPS6092469U
JPS6092469U JP1983184740U JP18474083U JPS6092469U JP S6092469 U JPS6092469 U JP S6092469U JP 1983184740 U JP1983184740 U JP 1983184740U JP 18474083 U JP18474083 U JP 18474083U JP S6092469 U JPS6092469 U JP S6092469U
Authority
JP
Japan
Prior art keywords
printed board
mounting structure
terminal
insulating substrate
conductive foil
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1983184740U
Other languages
Japanese (ja)
Inventor
上野　公司
Original Assignee
日本電気ホームエレクトロニクス株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気ホームエレクトロニクス株式会社 filed Critical 日本電気ホームエレクトロニクス株式会社
Priority to JP1983184740U priority Critical patent/JPS6092469U/en
Publication of JPS6092469U publication Critical patent/JPS6092469U/en
Pending legal-status Critical Current

Links

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は従来の構造の断面図、第２図は本案の一実施例
の゛断面図、第３図は第２図の端子の斜視図である。 ２は絶縁性基板、７は取付は孔、５は導電性箔、４は半
田、１９は非半田付着層を示す。FIG. 1 is a sectional view of a conventional structure, FIG. 2 is a sectional view of an embodiment of the present invention, and FIG. 3 is a perspective view of the terminal shown in FIG. 2 is an insulating substrate, 7 is a mounting hole, 5 is a conductive foil, 4 is solder, and 19 is a non-solder attachment layer.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 絶縁性基板に取付は孔が穿設され、前記絶縁性基板の一
面で、前記取付孔の周縁に導電性箔が形成され、前記取
付は孔に端子が挿通され、前記絶縁性基板の一面で、導
電性箔と前記端子間に半田を付着して固定されて成るも
のにおいて、前記端子は前記絶縁性基板の一面に突出さ
れた部分で、前記導電性箔と半田付けされる根元部分以
外に前記半田の付着されないアルミニウムメッキ等の非
半田付着層が形成されて成るプリント板の端子取付は構
造。For mounting, a hole is drilled in the insulating substrate, a conductive foil is formed around the periphery of the mounting hole on one side of the insulating substrate, and a terminal is inserted into the hole, and a conductive foil is formed on one side of the insulating substrate. , in which the conductive foil and the terminal are fixed by adhering solder, wherein the terminal is a portion protruding from one surface of the insulating substrate other than the base portion to be soldered to the conductive foil. The terminal mounting structure of a printed board is formed with a non-solder adhesive layer such as aluminum plating to which solder does not adhere.
JP1983184740U 1983-11-30 1983-11-30 Printed board terminal mounting structure Pending JPS6092469U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1983184740U JPS6092469U (en) 1983-11-30 1983-11-30 Printed board terminal mounting structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1983184740U JPS6092469U (en) 1983-11-30 1983-11-30 Printed board terminal mounting structure

Publications (1)

Publication Number Publication Date
JPS6092469U true JPS6092469U (en) 1985-06-24

Family

ID=30399481

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1983184740U Pending JPS6092469U (en) 1983-11-30 1983-11-30 Printed board terminal mounting structure

Country Status (1)

Country Link
JP (1) JPS6092469U (en)

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