JPS6424876U - - Google Patents
Info
- Publication number
- JPS6424876U JPS6424876U JP11941287U JP11941287U JPS6424876U JP S6424876 U JPS6424876 U JP S6424876U JP 11941287 U JP11941287 U JP 11941287U JP 11941287 U JP11941287 U JP 11941287U JP S6424876 U JPS6424876 U JP S6424876U
- Authority
- JP
- Japan
- Prior art keywords
- mounting land
- mounting
- wiring board
- printed wiring
- flexible printed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 2
- 238000005476 soldering Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図はこの考案によるフレキシブルプリント
配線板の一実施例を示す図、第２図は従来のフレ
キシブルプリント配線板を示す図。
１はフレキシブルプリント配線板、２は最外の
絶縁体層、２ｂ，２ｃはそれぞれ絶縁体層、３は
取り付けランド、４ａ，４ｂはそれぞれ導体層、
５は電子部品、６はリード、７は半田。なお各図
中同一符号は同一又は相当部分を示すものとする
。
FIG. 1 is a diagram showing an embodiment of a flexible printed wiring board according to this invention, and FIG. 2 is a diagram showing a conventional flexible printed wiring board. 1 is a flexible printed wiring board, 2 is the outermost insulator layer, 2b and 2c are each an insulator layer, 3 is a mounting land, 4a and 4b are each a conductor layer,
5 is an electronic component, 6 is a lead, and 7 is a solder. Note that the same reference numerals in each figure indicate the same or corresponding parts.
Claims (1)
して実装する取り付けランドを備えた内部に導体
層を有し表面を絶縁体層で形成されたフレキシブ
ルプリント配線板において、 取り付けランドを設置すべく上記表面の絶縁体
層を上記取り付けランドが設置される位置にこの
取り付けランドが挿入できる大きさだけ削除し、
露出した上記導体層に上記取り付けランドを直接
設置したことを特徴とするフレキシブルプリント
配線板。[Scope of Claim for Utility Model Registration] In a flexible printed wiring board having a conductive layer inside and an insulating layer on the surface, which is equipped with a mounting land for mounting an electronic component by bonding it to the lead of the electronic component by soldering. , In order to install the mounting land, remove the insulating layer on the surface to a size that allows the mounting land to be inserted into the position where the mounting land will be installed,
A flexible printed wiring board characterized in that the mounting land is directly installed on the exposed conductor layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11941287U JPS6424876U (en) | 1987-08-04 | 1987-08-04 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11941287U JPS6424876U (en) | 1987-08-04 | 1987-08-04 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6424876U true JPS6424876U (en) | 1989-02-10 |
Family
ID=31364618
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11941287U Pending JPS6424876U (en) | 1987-08-04 | 1987-08-04 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6424876U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7370943B2 (en) | 2002-09-27 | 2008-05-13 | Brother Kogyo Kabushiki Kaisha | Structure and method for connecting flexible printed circuit board to inkjet print head |
-
1987
- 1987-08-04 JP JP11941287U patent/JPS6424876U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7370943B2 (en) | 2002-09-27 | 2008-05-13 | Brother Kogyo Kabushiki Kaisha | Structure and method for connecting flexible printed circuit board to inkjet print head |
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