JPS58193662U - multilayer printed wiring board - Google Patents
multilayer printed wiring boardInfo
- Publication number
- JPS58193662U JPS58193662U JP9224482U JP9224482U JPS58193662U JP S58193662 U JPS58193662 U JP S58193662U JP 9224482 U JP9224482 U JP 9224482U JP 9224482 U JP9224482 U JP 9224482U JP S58193662 U JPS58193662 U JP S58193662U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- multilayer printed
- copper foil
- base material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来の多層プリント配線板の断面図、第２図は
本考案の一実施例における多層プリント配線板の断面図
である。
１２・・・・・・絶縁基板、７．訃・・・・・銅箔、９
・・・・・・リードレス電子部品、ＩＯＡ、ＩＯＢ・・
・・・・半田付は部、１１・・・・・・孔。FIG. 1 is a sectional view of a conventional multilayer printed wiring board, and FIG. 2 is a sectional view of a multilayer printed wiring board according to an embodiment of the present invention. 12...Insulating substrate, 7. Death...Copper foil, 9
...Leadless electronic components, IOA, IOB...
...Soldering is part 11...hole.
Claims (1)
覆って形成された銅箔と、前記絶縁基材の他方の面に実
装された電子部品の一方の端子を前記孔を通して上記銅
箔に半田付けし、電子部品の他方の端子を絶縁基材の部
品実装面に形成された銅箔に半田付けしたことを特徴と
する多層プリント配線板。An insulating base material provided with a hole, a copper foil formed on one side of the insulating base material covering the hole, and one terminal of an electronic component mounted on the other side of the insulating base material passing through the hole. A multilayer printed wiring board characterized in that the copper foil is soldered to the copper foil, and the other terminal of the electronic component is soldered to the copper foil formed on the component mounting surface of the insulating base material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9224482U JPS58193662U (en) | 1982-06-18 | 1982-06-18 | multilayer printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9224482U JPS58193662U (en) | 1982-06-18 | 1982-06-18 | multilayer printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS58193662U true JPS58193662U (en) | 1983-12-23 |
Family
ID=30100419
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9224482U Pending JPS58193662U (en) | 1982-06-18 | 1982-06-18 | multilayer printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58193662U (en) |
-
1982
- 1982-06-18 JP JP9224482U patent/JPS58193662U/en active Pending
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