JPS58193662U - multilayer printed wiring board - Google Patents

multilayer printed wiring board

Info

Publication number
JPS58193662U
JPS58193662U JP9224482U JP9224482U JPS58193662U JP S58193662 U JPS58193662 U JP S58193662U JP 9224482 U JP9224482 U JP 9224482U JP 9224482 U JP9224482 U JP 9224482U JP S58193662 U JPS58193662 U JP S58193662U
Authority
JP
Japan
Prior art keywords
wiring board
printed wiring
multilayer printed
copper foil
base material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9224482U
Other languages
Japanese (ja)
Inventor
英雄 三輪
Original Assignee
松下電器産業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 松下電器産業株式会社 filed Critical 松下電器産業株式会社
Priority to JP9224482U priority Critical patent/JPS58193662U/en
Publication of JPS58193662U publication Critical patent/JPS58193662U/en
Pending legal-status Critical Current

Links

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は従来の多層プリント配線板の断面図、第2図は
本考案の一実施例における多層プリント配線板の断面図
である。 12・・・・・・絶縁基板、7.訃・・・・・銅箔、9
・・・・・・リードレス電子部品、IOA、IOB・・
・・・・半田付は部、11・・・・・・孔。
FIG. 1 is a sectional view of a conventional multilayer printed wiring board, and FIG. 2 is a sectional view of a multilayer printed wiring board according to an embodiment of the present invention. 12...Insulating substrate, 7. Death...Copper foil, 9
...Leadless electronic components, IOA, IOB...
...Soldering is part 11...hole.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 孔を設けた絶縁基材と、前記絶縁基材の片面に前記孔を
覆って形成された銅箔と、前記絶縁基材の他方の面に実
装された電子部品の一方の端子を前記孔を通して上記銅
箔に半田付けし、電子部品の他方の端子を絶縁基材の部
品実装面に形成された銅箔に半田付けしたことを特徴と
する多層プリント配線板。
An insulating base material provided with a hole, a copper foil formed on one side of the insulating base material covering the hole, and one terminal of an electronic component mounted on the other side of the insulating base material passing through the hole. A multilayer printed wiring board characterized in that the copper foil is soldered to the copper foil, and the other terminal of the electronic component is soldered to the copper foil formed on the component mounting surface of the insulating base material.
JP9224482U 1982-06-18 1982-06-18 multilayer printed wiring board Pending JPS58193662U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9224482U JPS58193662U (en) 1982-06-18 1982-06-18 multilayer printed wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9224482U JPS58193662U (en) 1982-06-18 1982-06-18 multilayer printed wiring board

Publications (1)

Publication Number Publication Date
JPS58193662U true JPS58193662U (en) 1983-12-23

Family

ID=30100419

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9224482U Pending JPS58193662U (en) 1982-06-18 1982-06-18 multilayer printed wiring board

Country Status (1)

Country Link
JP (1) JPS58193662U (en)

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