JPS59180470U - Printed circuit board connection structure - Google Patents
Printed circuit board connection structureInfo
- Publication number
- JPS59180470U JPS59180470U JP7423783U JP7423783U JPS59180470U JP S59180470 U JPS59180470 U JP S59180470U JP 7423783 U JP7423783 U JP 7423783U JP 7423783 U JP7423783 U JP 7423783U JP S59180470 U JPS59180470 U JP S59180470U
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- circuit board
- connection structure
- board
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Combinations Of Printed Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は本考案のプリント基板の接続構造の一実施例を
示す斜視図、第２図ａ、 ｂは同接続構造 、の主
要部拡大斜視図、第３図は同接続構造の他実施例を示す
側面図である。
１・・・共通基板、２．３・・・補助基板、４・・・半
円状端子、５・・・ランド、６・・・半田、７・・・チ
ップ部品、８・・・両面プリント基板。Figure 1 is a perspective view showing one embodiment of the printed circuit board connection structure of the present invention, Figures 2a and b are enlarged perspective views of the main parts of the same connection structure, and Figure 3 is another embodiment of the same connection structure. FIG. 1...Common board, 2.3...Auxiliary board, 4...Semicircular terminal, 5...Land, 6...Solder, 7...Chip parts, 8...Double-sided printing substrate.
Claims (1)
一方のプリント基板の端部に配設する一列のスル
ーホールを分割して形成した半円状端子と、この半円状
端子に対応して他方のプリント基板上に配設するランド
とからなり、この半円状端子とランドとをそれぞれ半田
付けすることにより電気的及び機械的に接合することを
特徴とするプリント基板の接続構造。 ２ 上記２枚のプリント基板を、各電気回路に共通する
回路を塔載する共通基板と、付加機能等の回路を塔載す
る補助基板とすることを特徴とする実用新案登録請求の
範囲第１項記載のプリント基板の接続構造。 ３ ゛上記２枚のプリント基板を、それぞれ片面にチッ
プ部品等を塔載したプリント基板とし、裏面同士を互い
に接合して多層基板を形成することを特徴とする実用新
案登録請求の範囲第１項記載のプリント基板の一統構造
。[Claims for Utility Model Registration] 1. Overlapping at least two printed circuit boards 1.
It consists of a semicircular terminal formed by dividing a row of through holes arranged at the end of one printed circuit board, and a land arranged on the other printed circuit board corresponding to this semicircular terminal, A printed circuit board connection structure characterized in that the semicircular terminal and the land are electrically and mechanically connected by soldering, respectively. 2 Claim No. 1 for Utility Model Registration characterized in that the above two printed circuit boards are a common board on which a circuit common to each electric circuit is mounted and an auxiliary board on which a circuit for additional functions etc. is mounted. Connection structure of printed circuit board as described in section. 3 ゛Utility model registration claim 1, characterized in that the two printed circuit boards are each a printed circuit board with a chip component, etc. mounted on one side, and the back surfaces are bonded to each other to form a multilayer board. Unified structure of the printed circuit board described.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7423783U JPS59180470U (en) | 1983-05-17 | 1983-05-17 | Printed circuit board connection structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7423783U JPS59180470U (en) | 1983-05-17 | 1983-05-17 | Printed circuit board connection structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS59180470U true JPS59180470U (en) | 1984-12-01 |
Family
ID=30204331
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7423783U Pending JPS59180470U (en) | 1983-05-17 | 1983-05-17 | Printed circuit board connection structure |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59180470U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6367278U (en) * | 1986-10-23 | 1988-05-06 | ||
| JPH07183451A (en) * | 1993-11-16 | 1995-07-21 | Internatl Business Mach Corp <Ibm> | Module with chip dilectly attached |
| JP2017147386A (en) * | 2016-02-19 | 2017-08-24 | 本田技研工業株式会社 | Printed-circuit board |
-
1983
- 1983-05-17 JP JP7423783U patent/JPS59180470U/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6367278U (en) * | 1986-10-23 | 1988-05-06 | ||
| JPH07183451A (en) * | 1993-11-16 | 1995-07-21 | Internatl Business Mach Corp <Ibm> | Module with chip dilectly attached |
| JP2017147386A (en) * | 2016-02-19 | 2017-08-24 | 本田技研工業株式会社 | Printed-circuit board |
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