JPS6185184U - - Google Patents
Info
- Publication number
- JPS6185184U JPS6185184U JP16978884U JP16978884U JPS6185184U JP S6185184 U JPS6185184 U JP S6185184U JP 16978884 U JP16978884 U JP 16978884U JP 16978884 U JP16978884 U JP 16978884U JP S6185184 U JPS6185184 U JP S6185184U
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- wiring board
- utility
- conductive member
- model registration
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 claims 1
- 230000001070 adhesive effect Effects 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
Landscapes
- Combinations Of Printed Boards (AREA)
Description
第１図は本考案の第１の実施例のプリント配線
板構造体の接合前の斜視図、第２図は第１図のプ
リント配線板構造体の接合後の断面図、第３図は
本考案の第２の実施例のプリント配線板構造体の
断面図である。
１…基板、２…貫通穴、３…銅箔、３Ａ…全面
銅箔、４…レジストインキ、５…電子部品、６…
導電性部材。
Fig. 1 is a perspective view of the printed wiring board structure according to the first embodiment of the present invention before bonding, Fig. 2 is a sectional view of the printed wiring board structure of Fig. 1 after bonding, and Fig. 3 is the main body. FIG. 2 is a sectional view of a printed wiring board structure according to a second embodiment of the invention. 1... Board, 2... Through hole, 3... Copper foil, 3A... Whole surface copper foil, 4... Resist ink, 5... Electronic component, 6...
Conductive member.
Claims (1)
ント配線板を、それぞれ電子部品塔載面とは反対
側の面にて対向させ、かつ、一方のプリント配線
板の貫通穴に導電性部材を通して、前記一方のプ
リント配線板の部品塔載面と他方のプリント配線
板の接合面とを電気的に接続したことを特徴とす
るプリント配線板構造体。 (2) 導電性部材として導電性接着剤を使用した
事を特徴とする実用新案登録請求の範囲第(1)項
記載のプリント配線板構造体。 (3) 導電性部材として半田を使用した事を特徴
とする実用新案登録請求の範囲第(1)項記載のプ
リント配線板構造体。[Scope of Claim for Utility Model Registration] (1) Two double-sided printed wiring boards with electronic components mounted on one side, facing each other on the opposite side from the surface on which the electronic components are mounted, and 1. A printed wiring board structure, characterized in that a conductive member is passed through a through hole of the wiring board to electrically connect the component mounting surface of one of the printed wiring boards and the bonding surface of the other printed wiring board. (2) The printed wiring board structure according to claim (1) of the utility model registration, characterized in that a conductive adhesive is used as the conductive member. (3) The printed wiring board structure according to claim (1) of the utility model registration, characterized in that solder is used as the conductive member.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16978884U JPS6185184U (en) | 1984-11-08 | 1984-11-08 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16978884U JPS6185184U (en) | 1984-11-08 | 1984-11-08 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6185184U true JPS6185184U (en) | 1986-06-04 |
Family
ID=30727504
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16978884U Pending JPS6185184U (en) | 1984-11-08 | 1984-11-08 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6185184U (en) |
-
1984
- 1984-11-08 JP JP16978884U patent/JPS6185184U/ja active Pending
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